Abstract: Embodiments of the invention provide a laser processing apparatus and method. The laser processing apparatus includes a holder that holds a processing target, a first laser source that emits pulsed laser beam, and a second laser source that emits continuous-wave laser beam. The apparatus further includes an optical system that transmits the pulsed laser beam from the first laser source and the continuous-wave laser beam from the second laser source on a surface of the processing target held by the holder in such a manner that a beam spot of the pulsed laser beam is included inside a beam spot of the continuous-wave laser beam, and a moving mechanism that moves the beam spots of the pulsed laser beam and the continuous-wave laser beam on the surface of the processing target.

Abstract: Laser beam is irradiated to a surface of a processing target after reforming a cross section of the laser beam with a mask having a pierced hole by concentrating the laser beam passing through the pierced hole by a lens to form an image of the pierced hole of the mask on the surface of the processing target. The laser beam passing through the lens is scanned to move an irradiating position of the laser beam on the surface of the processing target, and the image of the pierced hole of the mask is formed on the surface of the processing target during the scanning for processing the processing target. A high quality laser process can be carried out.

Abstract: A laser source emits a laser beam. A diffractive optical element is disposed at a position which the laser beam emitted from the laser source is incident on. The diffractive optical element splits the incident laser beam into laser beams. The laser beams are incident on a first zoom lens system. The first zoom lens system focuses the incident laser beams onto a first virtual plane.

Abstract: A laser processing method has the steps of: (a) irradiating a laser beam from a laser source; and (b) applying the laser beam irradiated from the laser source to a first surface area of a processing object having a resin layer and a transparent conductive layer made of metal oxide and formed on the surface of the resin layer, to remove the transparent conductive layer and form a concave portion exposing the resist layer on the bottom of the first concave portion.

Abstract: Laser beam is irradiated to a surface of a processing target after reforming a cross section of the laser beam with a mask having a pierced hole by concentrating the laser beam passing through the pierced hole by a lens to foreman image of the pierced hole of the mask on the surface of the processing target. The laser beam passing through the lens is scanned to move an irradiating position of the laser beam on the surface of the processing target, and the image of the pierced hole of the mask is formed on the surface of the processing target during the scanning for processing the processing target. A high quality laser process can be carried out.

Abstract: A mask 10 comprises a mask member layer 12 having a laser processing pattern and comprising a metallic material and first and second substrate members 11 and 13 holding the mask member on two faces thereof and comprising a material that transmits laser light.

Abstract: It is provided with a homogeneous optical system 13 for transforming laser light from a laser oscillator 10 into laser light having a linear cross-section and a drive mechanism for synchronously moving a mask 11 and a printed circuit board 12, an irradiation position of the linear laser light being fixed, the drive mechanism moving the mask and the workpiece so that the mask passes through the irradiation position of the laser light while the moving direction thereof is perpendicular to the extending direction of the linear laser light so that the mask is scanned by the linear laser light, the drilling defined by the mask pattern thereby being carried out to the workpiece.

Abstract: A polygon mirror 11, a mask 12 having a row of holes for defining a processing pattern, a galvano-mirror 16, and a processing lens 17are arranged in that order between a laser oscillator 10 and a printed circuit board 20 as a workpiece, and the laser beam from the laser oscillator 10 is projected onto the printer circuit board 20 traveling through these components. The polygon mirror 11 sweeps the laser beam so that the laser beam scans the holes of the mask 12 for the mirror on each face, and a plurality of holes are thereby formed into the printed circuit board 20. The irradiation region of the laser beam to the printer circuit board 20 is shifted in one axis direction by the galvano-mirror 16.

Abstract: A mask 10 comprises a mask member layer 12 having a laser processing pattern and comprising a metallic material and first and second substrate members 11 and 13 holding the mask member on two faces thereof and comprising a material that transmits laser light.

Abstract: A method of micromachining polytetrafluoroethylene by applying radiation light to the surface of polytetrafluoroethylene, includes the steps of: preparing a workpiece including a region made of polytetrafluoroethylene; preparing a mask having patterned areas substantially transmitting and not transmitting the radiation light; and applying the radiation light containing at least ultraviolet rays of a wavelength of 160 nm to a surface of the workpiece through the mask. Polytetrafluoroethylene can be microscopically processed, while obtaining a high aspect ratio and processing a large area with ease.