Abstract: In a suction nozzle (20), a sucking surface (60) is made larger in area than a to-be-sucked surface of a component (55) and is configured arbitrarily so long as a width (G1) between mutually-opposed sides parallel to a longer side (110) of the component to be sucked is smaller than a width (G2) in a direction parallel to a shorter side (111) of the component to be sucked. The suction nozzle sucks a component at its sucking surface, with a longitudinal axis (O) of the sucking surface (60) kept inclined with respect to a direction (J) in which the component is supplied.

Abstract: In an electronic component feeding apparatus for feeding components with use of a taping component, a brushless motor is used as a drive motor in a tape sending mechanism that transports the taping component so as to improve productivity in an electronic component mounting apparatus equipped with the electronic component feeding apparatus. Also, an electronic component feeding apparatus is provided with a control part that automatically executes initial processing such as sending of the taping component, as well as detects and reports a sending failure of the taping component when the electronic component feeding apparatus is installed in the electronic component mounting apparatus, which makes it possible to provide an electronic component feeding apparatus enabling easy and prompt detection of the sending failure of the taping component.

Abstract: A device for mounting components using mounting heads having a plurality of suction nozzles that provide a plurality of component pickups, positions or mounting operating positions. The mounting heads are positioned on a rotating table that is cooperatively positioned adjacent a component supply table having a plurality of component feeder members. The control unit can rotate the rotating table to position a mounting head at a component supply position and further position one of the plurality of suction nozzles to a first, second and third section operating position for picking up a component from a component feeder. The relative movement of the component supply table and the positioning of first and second suction operating positions relative to our reference point where the edge of the rotating table contacts the line of movement of the component supply table can increase the pickup speed of components.

Abstract: In an electronic component feeding apparatus (41) for feeding components with use of a taping component (3), a brushless motor is used as a drive motor (110) in a tape sending mechanism (43) that transports the taping component (3) so as to improve productivity in an electronic component mounting apparatus equipped with the electronic component feeding apparatus (41). Also, an electronic component feeding apparatus (241, 371) is provided with a control part (255, 355) that automatically executes initial processing such as sending of the taping component (3) as well as detects and reports sending failure of the taping component (3) when the electronic component feeding apparatus (241, 371) is installed in the electronic component mounting apparatus, which makes it possible to provide an electronic component feeding apparatus enabling easy and prompt detection of sending failure of the taping component (3).

Abstract: A method for mounting components using mounting heads for which a plurality of suction or mounting operating positions are set for suction nozzles in a state where the mounting head is at rest in a component supply position or component mounting position, it being possible to select any of these operating positions, comprising a first step of selecting a component supply position or component mounting position such that the amount of movement of component feeder holding components to be mounted, or the amount of movement of the substrate to the mounting position for the next component to be mounted becomes a minimum, and moving the component feeder or substrate accordingly; and a second step of selecting a suction nozzle position corresponding to the component suction position or component mounting position in the first step, whilst the mounting head is moving towards the component suction position.

Abstract: At the front end side of parts supply device 8, an engagement part 22 is provided that is fixed in the vertical and left/right direction by engagement with an abutment part 23 that is provided on the side of a parts supply table 7; and at the rear end side of parts supply device 8 a fixing shaft 28 in the horizontal direction is provided. In parts supply table 7, there is provided a toggle link mechanism having an abutment link 31 that can be rocked in the vertical direction, that is formed at its free end 31a with an engagement groove 32, which can be fitted into and engaged by this fixing shaft 28. The toggle link mechanism is so arranged that it biases the abutment link 31 towards two positions: an attitude in which this engagement groove 32 is directed upwardly, and an attitude in which it is horizontal or directed downwardly.

Abstract: A method for mounting components using mounting heads for which a plurality of suction or mounting operating positions are set for suction nozzles in a state where the mounting head is at rest in a component supply position or component mounting position, it being possible to select any of these operating positions, comprising a first step of selecting a component supply position or component mounting position such that the amount of movement of component feeder holding components to be mounted, or the amount of movement of the substrate to the mounting position for the next component to be mounted becomes a minimum, and moving the component feeder or substrate accordingly; and a second step of selecting a suction nozzle position corresponding to the component suction position or component mounting position in the first step, whilst the mounting head is moving towards the component suction position.

Abstract: An electronic component mounting apparatus includes a table for feeding in and out a printed circuit board and holding the board thereon, a supply section for supplying an electronic component, a head portion for suctioning the component thereto and mounting the component on the board, an XY-robot for placing the head portion at an arbitrary position, a suction device for suctioning the component thereto, arranged at the head portion and vertically moving with respect to the head portion, and having a function of placing the component in a rotational direction thereof, a recognizing camera for recognizing the component and measuring an error amount of a position of the component before and after correction of the position of the component, and a controller for controlling the head portion, the XY-robot, and the camera.