Patents by Inventor Shiro Sujaku

Shiro Sujaku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11161342
    Abstract: A liquid discharge head includes a recording element substrate including a discharge port configured to discharge a liquid, a pressure generating element configured to pressurize the liquid to discharge the liquid, and an electric connecting portion connected to the pressure generating element through an electric wiring and configured to supply power for driving the pressure generating element to the pressure generating element. The liquid discharge head includes a first recessed portion and a second recessed portion formed in a range from a back surface of a discharge port surface in which the discharge port of the recording element substrate is formed up to the electric connecting portion, and a communicating portion configured to connect a space formed within the first recessed portion and a space formed within the second recessed portion by allowing the first recessed portion and the second recessed portion to communicate with each other.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: November 2, 2021
    Assignee: Canon Kabushiki Kaisha
    Inventors: Mitsunori Toshishige, Noriyasu Ozaki, Shiro Sujaku
  • Patent number: 10744770
    Abstract: A liquid ejection head is equipped with a substrate having therethrough a supply path to be supplied with a liquid, a top plate placed opposite to the substrate, having an ejection orifice for ejecting the liquid and constituting, between the top plate and the substrate, a flow path communicated with the supply path and the ejection orifice and a columnar member extending from the top plate to the inside of the supply path through the flow path. An end surface of the columnar member positioned in the supply path is tilted relative to the top plate in a direction away from the ejection orifice.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: August 18, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventors: Mitsunori Toshishige, Kenji Takahashi, Shiro Sujaku, Daisuke Otsuka
  • Publication number: 20200061995
    Abstract: A liquid discharge head includes a recording element substrate including a discharge port configured to discharge a liquid, a pressure generating element configured to pressurize the liquid to discharge the liquid, and an electric connecting portion connected to the pressure generating element through an electric wiring and configured to supply power for driving the pressure generating element to the pressure generating element. The liquid discharge head includes a first recessed portion and a second recessed portion formed in a range from a back surface of a discharge port surface in which the discharge port of the recording element substrate is formed up to the electric connecting portion, and a communicating portion configured to connect a space formed within the first recessed portion and a space formed within the second recessed portion by allowing the first recessed portion and the second recessed portion to communicate with each other.
    Type: Application
    Filed: August 8, 2019
    Publication date: February 27, 2020
    Inventors: Mitsunori Toshishige, Noriyasu Ozaki, Shiro Sujaku
  • Publication number: 20200009863
    Abstract: A liquid ejection head is equipped with a substrate having therethrough a supply path to be supplied with a liquid, a top plate placed opposite to the substrate, having an ejection orifice for ejecting the liquid and constituting, between the top plate and the substrate, a flow path communicated with the supply path and the ejection orifice and a columnar member extending from the top plate to the inside of the supply path through the flow path. An end surface of the columnar member positioned in the supply path is tilted relative to the top plate in a direction away from the ejection orifice.
    Type: Application
    Filed: June 28, 2019
    Publication date: January 9, 2020
    Inventors: Mitsunori Toshishige, Kenji Takahashi, Shiro Sujaku, Daisuke Otsuka
  • Publication number: 20190263124
    Abstract: A liquid ejection head substrate that includes a nozzle plate provided with an ejection orifice adapted to eject liquid droplets, in which a projection/depression pattern is provided on a liquid droplet ejection surface of the nozzle plate, the projection/depression pattern being made up of a plurality of projections and depressions, the projections being separated by depressions 1 ?m or less in depth and disposed at predetermined spacing 10 ?m or less in length; and the projection/depression pattern includes a part having water repellency due to lotus effect.
    Type: Application
    Filed: February 20, 2019
    Publication date: August 29, 2019
    Inventors: Kenji Takahashi, Mitsuru Chida, Mitsunori Toshishige, Shiro Sujaku, Kenji Kumamaru, Noriyasu Ozaki, Makoto Terui, Seiko Minami
  • Patent number: 10166779
    Abstract: A method for manufacturing a liquid-discharge-head substrate includes providing a substrate having an energy-generating element and a pad, the pad having a wiring layer and a contact-probe receiving section, the contact-probe receiving section having a Vickers hardness that is higher than a Vickers hardness of the wiring layer; bringing a contact probe into contact with the contact-probe receiving section; and performing an electrical inspection by bringing the contact probe into contact with the wiring layer in the pad.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: January 1, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shiro Sujaku, Keiji Watanabe, Kouji Hasegawa, Junya Hayasaka, Satoshi Ibe
  • Patent number: 9610773
    Abstract: A method for producing a liquid-ejection-head substrate includes providing a substrate having an energy-generating element and a pad, the pad including a wiring layer, the wiring layer in the pad having a relatively thick portion and a relatively thin portion and performing electrical inspection by applying a contact probe to the relatively thin portion of the wiring layer in the pad.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: April 4, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Satoshi Ibe, Keiji Watanabe, Junya Hayasaka, Shiro Sujaku, Kouji Hasegawa
  • Patent number: 9604454
    Abstract: A method for manufacturing a liquid ejection head having a substrate, heat generating elements formed at the front surface side of the substrate, and a nozzle layer forming liquid chambers and liquid ejection ports at the front surface side of the substrate, and the method includes a process of preparing a substrate having heat generating elements and a nozzle layer formation material layer at the front surface side, a process of driving the heat generating elements for heating to form air bubbles serving as the liquid chambers in the nozzle layer formation material layer, and a process of forming liquid ejection ports which communicate with the liquid chambers in the nozzle layer formation material layer, and then forming a nozzle layer forming the liquid chambers and the liquid ejection ports at the front surface side of the substrate.
    Type: Grant
    Filed: April 6, 2015
    Date of Patent: March 28, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Jun Yamamuro, Satoshi Ibe, Toshiaki Kurosu, Shiro Sujaku
  • Publication number: 20160229184
    Abstract: A method for producing a liquid-ejection-head substrate includes providing a substrate having an energy-generating element and a pad, the pad including a wiring layer, the wiring layer in the pad having a relatively thick portion and a relatively thin portion and performing electrical inspection by applying a contact probe to the relatively thin portion of the wiring layer in the pad.
    Type: Application
    Filed: February 2, 2016
    Publication date: August 11, 2016
    Inventors: Satoshi Ibe, Keiji Watanabe, Junya Hayasaka, Shiro Sujaku, Kouji Hasegawa
  • Publication number: 20160229183
    Abstract: A method for manufacturing a liquid-discharge-head substrate includes providing a substrate having an energy-generating element and a pad, the pad having a wiring layer and a contact-probe receiving section, the contact-probe receiving section having a Vickers hardness that is higher than a Vickers hardness of the wiring layer; bringing a contact probe into contact with the contact-probe receiving section; and performing an electrical inspection by bringing the contact probe into contact with the wiring layer in the pad.
    Type: Application
    Filed: February 1, 2016
    Publication date: August 11, 2016
    Inventors: Shiro Sujaku, Keiji Watanabe, Kouji Hasegawa, Junya Hayasaka, Satoshi Ibe
  • Patent number: 9174439
    Abstract: A liquid ejection head includes a print element board and an electric wiring board electrically connected to a bump of the print element board using an interconnecting wire. The bump has a first surface and a second surface. The height of the second surface from a surface of a base plate is higher than that of the first surface. The first surface has a protrusion formed therein, and the bump is connected to the interconnecting wire in the second surface.
    Type: Grant
    Filed: August 1, 2013
    Date of Patent: November 3, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Satoshi Ibe, Yoshinori Tagawa, Jun Yamamuro, Hiroto Komiyama, Kouji Hasegawa, Shiro Sujaku
  • Publication number: 20150290939
    Abstract: A method for manufacturing a liquid ejection head having a substrate, heat generating elements formed at the front surface side of the substrate, and a nozzle layer forming liquid chambers and liquid ejection ports at the front surface side of the substrate, and the method includes a process of preparing a substrate having heat generating elements and a nozzle layer formation material layer at the front surface side, a process of driving the heat generating elements for heating to form air bubbles serving as the liquid chambers in the nozzle layer formation material layer, and a process of forming liquid ejection ports which communicate with the liquid chambers in the nozzle layer formation material layer, and then forming a nozzle layer forming the liquid chambers and the liquid ejection ports at the front surface side of the substrate.
    Type: Application
    Filed: April 6, 2015
    Publication date: October 15, 2015
    Inventors: Jun Yamamuro, Satoshi Ibe, Toshiaki Kurosu, Shiro Sujaku
  • Patent number: 9132647
    Abstract: An object of the present invention is to provide a liquid ejection head capable of suppressing the capture of bubbles into the liquid ejection head including ejection ports having different opening areas so as to satisfactorily fill a liquid channel and the ejection ports with liquid. In order to achieve the object, the liquid ejection head according to the present invention includes a liquid supply port communicating with a plurality of kinds of ejection ports, and further, a defoaming opening communicating with another ejection port except an ejection port having a large opening area out of the plurality of kinds of ejection ports via a defoaming channel.
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: September 15, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shiro Sujaku, Jun Yamamuro, Hiroyuki Murayama, Toshiaki Kurosu, Yoshinori Tagawa
  • Patent number: 9108406
    Abstract: A device substrate includes a substrate body having an energy generating device provided thereon, where the energy generating device generates energy for ejecting liquid, an ejection port forming member disposed on the substrate body, where the ejection port forming member has a pressure chamber that surrounds the energy generating device and an ejection port that communicates with the pressure chamber, and a supply port configured to supply the liquid to the pressure chamber. The ejection port forming member has a first surface that is in contact with the substrate body and a second surface other than the first surface, and the supply port is formed in the second surface.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: August 18, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kouji Hasegawa, Satoshi Ibe, Jun Yamamuro, Shuhei Oya, Shiro Sujaku, Junya Hayasaka
  • Patent number: 9085141
    Abstract: A liquid ejection head and a printing apparatus can perform high-quality printing by suppressing the shrinkage stress of an adhesive joining a substrate and a flow path forming member and the deformation and peeling of the flow path forming member. A stress dispersing section is formed on the side surface of the substrate.
    Type: Grant
    Filed: August 21, 2014
    Date of Patent: July 21, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shuhei Oya, Satoshi Ibe, Jun Yamamuro, Kouji Hasegawa, Shiro Sujaku, Junya Hayasaka
  • Publication number: 20150097899
    Abstract: An object of the present invention is to provide a liquid ejection head capable of suppressing the capture of bubbles into the liquid ejection head including ejection ports having different opening areas so as to satisfactorily fill a liquid channel and the ejection ports with liquid. In order to achieve the object, the liquid ejection head according to the present invention includes a liquid supply port communicating with a plurality of kinds of ejection ports, and further, a defoaming opening communicating with another ejection port except an ejection port having a large opening area out of the plurality of kinds of ejection ports via a defoaming channel.
    Type: Application
    Filed: September 24, 2014
    Publication date: April 9, 2015
    Inventors: Shiro SUJAKU, Jun Yamamuro, Hiroyuki Murayama, Toshiaki Kurosu, Yoshinori Tagawa
  • Publication number: 20150062260
    Abstract: There are provided a liquid ejection head and a printing apparatus capable of performing high-quality printing by suppressing the shrinkage stress of an adhesive joining a substrate and a flow path forming member and the deformation and peeling of the flow path forming member. A stress dispersing section 11 is formed on the side surface of the substrate 1.
    Type: Application
    Filed: August 21, 2014
    Publication date: March 5, 2015
    Inventors: Shuhei OYA, Satoshi Ibe, Jun Yamamuro, Kouji Hasegawa, Shiro Sujaku, Junya Hayasaka
  • Patent number: 8968584
    Abstract: A method for manufacturing a liquid ejection head includes the steps of: disposing an etching mask layer on a substrate having a first face and a second face that is on an opposite side of the first face, the etching mask layer being disposed on the second face; forming a concave line pattern at a region of the etching mask layer other than a region where an opening for the support port is to be formed; providing an etching opening at the etching mask layer; performing anisotropic etching from a side of the second face using the etching mask layer provided with the etching opening as a mask, thus forming the supply port at the substrate; comparing the line pattern with a recess generated at the substrate, thus selecting a device chip for liquid ejection; and connecting the selected device chip to a liquid supply part.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: March 3, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Jun Yamamuro, Yoshinori Tagawa, Satoshi Ibe, Hiroto Komiyama, Kouji Hasegawa, Shiro Sujaku
  • Patent number: 8945957
    Abstract: The method of manufacturing a liquid ejection head includes: forming a first protective layer on one surface of the substrate; forming the wiring layer on another surface of the substrate; forming the insulating layer on the wiring layer, and then partially removing the insulating layer to partially expose the wiring layer; forming the electrode pad on an exposed portion of the wiring layer; forming a flow path member on the another surface of the substrate; forming a second protective layer on the one surface of the substrate after the formation of the flow path member; and partially removing at least one of the first protective layer and the second protective layer, and then forming the supply port leading from the one surface of the substrate to the another surface of the substrate.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: February 3, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hiroto Komiyama, Satoshi Ibe, Jun Yamamuro, Kouji Hasegawa, Shiro Sujaku, Yoshinori Tagawa
  • Publication number: 20140340451
    Abstract: A device substrate includes a substrate body having an energy generating device provided thereon, where the energy generating device generates energy for ejecting liquid, an ejection port forming member disposed on the substrate body, where the ejection port forming member has a pressure chamber that surrounds the energy generating device and an ejection port that communicates with the pressure chamber, and a supply port configured to supply the liquid to the pressure chamber. The ejection port forming member has a first surface that is in contact with the substrate body and a second surface other than the first surface, and the supply port is formed in the second surface.
    Type: Application
    Filed: May 13, 2014
    Publication date: November 20, 2014
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Kouji Hasegawa, Satoshi Ibe, Jun Yamamuro, Shuhei Oya, Shiro Sujaku, Junya Hayasaka