Abstract: A horizontal machine tool (1) includes a base frame (10) where workpiece support faces (11c) for supporting a workpiece are formed at front portions; an X-axis saddle (20) attached to a back-face portion (12b) of the base frame (10) through an X-axis movement mechanism (50) universally slidably in a left-right direction; a Y-axis saddle (30) attached to the X-axis saddle (20) through a Y-axis movement mechanism (60) universally slidably in an up-down direction; and a spindle device (40) attached to the Y-axis saddle (30) through a Z-axis movement mechanism (70) universally slidably in a front-rear direction. According to this configuration, it is possible to make a whole of the horizontal machine tool a small size and lightweight and to enhance machining accuracy of the workpiece.

Abstract: A finishing grindstone member (20) is fixed to a spindle (10) by a bolt. In the spindle (10), there is formed a tool mounting portion (25) into which a rough grindstone member can be mounted. Into the tool mounting portion (25), there can be mounted not only the rough grindstone member but also a cover member (36). After a silicone wafer is roughly ground using the rough grindstone member, when finish grinding the silicone wafer using the finishing grindstone member (20), the cover member (36) is mounted onto the tool mounting portion (25) to thereby prevent the tool mounting portion (25) from being soiled.

Abstract: Chamfering C1 is performed along the edge of a notch groove by the center 01 of a grindstone 5. Change to grindstone center 02 is performed to perform chamfering C2 along the edge of the notch groove. Similarly, chamfering C3, C4 and C5 are formed. A grindstone having a large diameter can be employed. Only control of the diameter of the grindstone is required to maintain the shape. Satisfactory surface roughness can be realized. It is possible to improve surface roughness of a notch groove of a wafer and realize high efficiency.

Abstract: A workpiece 23 formed of a circular thin plate is rotated about its center as an axis L1. Each of disk-shaped rotating grinding wheels 27 and 28, while being rotated about an axis L3 extending in a direction substantially parallel to the plane of the workpiece 23 and perpendicular to the radial direction of the workpiece 23, is made to undergo relative feeding movement on both obverse and reverse surface sides of the workpiece 23 along an outer peripheral edge portion 23a of the workpiece 23. Consequently, the outer peripheral edge portion 23a of the workpiece 23 is ground by an outer peripheral surface of each of the rotating grinding wheels 27 and 28. In this case, it is preferred that two grinding wheels 27 and 28 for rough grinding and finish grinding be provided as the disk-shaped rotating grinding wheels, and that rough grinding and finish grinding are performed by the same station.

Abstract: In the wafer chamfering method, there is used a disk-shaped grindstone 8 which includes: a peripheral edge portion serving as a grinding surface 1; a flat portion formed in the central portion of the grinding surface 1 in the width direction thereof; and, two edge portions 5 respectively formed on the two sides of the flat portion 2 in the width direction thereof and made in the form of the shape of the valley portion of the notch portion 4 of a disk-shaped wafer 3 to be chamfered. In operation, in the wafer chamfering method, while rotating the above grindstone 8, the grindstone 8 is revolved in the thickness direction of the wafer 3 to thereby chamfer the wafer 3.

Abstract: In the wafer chamfering method, there is used a disk-shaped grindstone 8 which includes: a peripheral edge portion serving as a grinding surface 1; a flat portion formed in the central portion of the grinding surface 1 in the width direction thereof; and, two edge portions 5 respectively formed on the two sides of the flat portion 2 in the width direction thereof and made in the form of the shape of the valley portion of the notch portion 4 of a disk-shaped wafer 3 to be chamfered. In operation, in the wafer chamfering method, while rotating the above grindstone 8, the grindstone 8 is revolved in the thickness direction of the wafer 3 to thereby chamfer the wafer 3.

Abstract: A workpiece receiving hole 60a for fittingly receiving a workpiece 17 is formed in the center of a rotary disk 60 which is thinner than the workpiece 17. A workpiece drive section 60b which engages a notch 17a formed for the purpose of orienting the workpiece 17 relative to crystal orientation is formed along the brim of the hole 60a. A gear 59 is rotated by a gear 62 of a motor 61, thereby rotating the rotary disk 60 and imparting torque to the workpiece 17. Accordingly, both surfaces of the workpiece are ground by means of a double disc surface grinder.

Abstract: A finishing grindstone member 20 is fixed to a spindle 10 by a bolt. In the spindle 10, there is formed a tool mounting portion 25 into which a rough grindstone member can be mounted. Into the tool mounting portion 25, there can be mounted not only the rough grindstone member but also a cover member 36. After a silicone wafer is roughly ground using the rough grindstone member, when finish grinding the silicone wafer using the finishing grindstone member 20, the cover member 36 is mounted onto the tool mounting portion 25 to thereby prevent the tool mounting portion 25 from being soiled.

Abstract: A spindle 23 of a grinding wheel 28 is rotatively borne by a bench 22 for the grinding wheel through hydrostatic thrust bearings 26 and 27. A pressure regulator 38 for regulating the pressure which must be supplied to at least either of supply ports 26a and 27a opposite to each other in the direction of the axial line of the spindle 23 in the hydrostatic thrust bearings 26 and 27 is provided. The pressure regulator 38 has a changing member for changing a passage for choking the fluid and the length of the choking passage.

Abstract: A method of slicing an ingot wherein a pre-cut work 3 in which a holding member 2 extending over the entire length of a side surface of a cylindrical ingot 1 is bonded to the side surface of the ingot 1 is set on a slicing apparatus 4, and the pre-cut work 3 is split into a multiplicity of pieces over its longitudinal direction so as to obtain disk-shaped works 5 to be ground, characterized in that a retaining member 2 is used in which a retaining layer 7 which is directly bonded to the side surface of the ingot 1 by a first adhesive agent having an adhesive strength sufficient to receive a rotating force due to a grinding apparatus 6 in a subsequent grinding process, an intermediate layer 8 which is bonded to said retaining layer 7 in a superposed manner by a second adhesive agent whose adhesive strength deteriorates more than that of the first adhesive agent under a fixed condition, and a supporting layer 11 which is connected to said intermediate layer 8 and is connected to a supporting portion 10 of said

Abstract: A spindle 23 of a grinding wheel 28 is rotatively borne by a bench 22 for the grinding wheel through hydrostatic thrust bearings 26 and 27. A pressure regulator 38 for regulating the pressure which must be supplied to at least either of supply ports 26a and 27a opposite to each other in the direction of the axial line of the spindle 23 in the hydrostatic thrust bearings 26 and 27 is provided. The pressure regulator 38 has a changing member for changing a passage for choking the fluid and the length of the choking passage.