Abstract: A display motherboard and a manufacturing method thereof are provided. The display motherboard includes a first substrate and a second substrate that are assembled, a plurality of mutually independent display devices located between the first substrate and the second substrate, a first seal, and a second seal. The first seal is provided in a peripheral area of the display motherboard, the second seal is provided in a cutting area of the display motherboard, the cutting area is located around each of the display devices, and the second seal surrounds at least one of the display devices.

Abstract: A display motherboard and a manufacturing method thereof are provided. The display motherboard includes a first substrate and a second substrate that are assembled, a plurality of mutually independent display devices located between the first substrate and the second substrate, a first seal, and a second seal. The first seal is provided in a peripheral area of the display motherboard, the second seal is provided in a cutting area of the display motherboard, the cutting area is located around each of the display devices, and the second seal surrounds at least one of the display devices.

Abstract: A printing screen method includes: providing at least one printing scraper assembly, wherein the printing scraper assembly has a printing scraper and a pressure sensing feedback system; placing at least one printing screen on a substrate; detecting and supplying a pressure value between the printing scraper and the printing screen during printing by the pressure sensing feedback system; and comparing the supplied pressure value and a predetermined pressure value, and changing the pressure between the printing scraper and the printing screen if a difference between the feedback pressure value and the predetermined pressure value is larger than a predetermined threshold. An imprinting apparatus implementing the printing screen method is also provided.

Abstract: A device for printing silicon sealant, including a coating device, a horizontal coating stage, and an elevating device, wherein: the elevating device is connected with the horizontal coating stage and is configured to adjust the height of the horizontal coating stage; the horizontal coating stage can be moved to a position right below a screen and fully contacted with the screen under the adjustment of the elevating device; and the coating device is configured to be moved to a position above the screen to coat silicon sealant in a pattern area of the screen after the horizontal coating stage is fully contacted with the screen.

Abstract: The present disclosure provides a display panel and a fabricating method thereof, and a display device. The fabricating method for the display panel includes forming a glass adhesive layer on a packaging region of a first substrate, forming an OLED device on a display region of the first substrate, and aligning the first substrate with a second substrate, and forming a sealing structure between the first substrate and the second substrate by irradiating the packaging region with laser. The fabricating method for the display panel according to an embodiment of the present disclosure avoids the occurrence of the phenomenon that the coated glass adhesive layer and the evaporated organic light emitting layer are offset during the subsequent packaging process, by fabricating the glass adhesive layer on the substrate for forming the OLED device, thereby the production efficiency of the overall packaging process is enhanced.

Abstract: An embodiment of the present disclosure discloses an evaporation method, including: providing a flexible substrate having an original size; stretching the flexible substrate to have an evaporation size, wherein, the evaporation size is greater than the original size; arranging a mask on a side of the flexible substrate having the evaporation size; evaporating a material onto the flexible substrate having the evaporation size by using the mask, to form a patterned film layer.

Abstract: A printing screen method includes: providing at least one printing scraper assembly, wherein the printing scraper assembly has a printing scraper and a pressure sensing feedback system; placing at least one printing screen on a substrate; detecting and supplying a pressure value between the printing scraper and the printing screen during printing by the pressure sensing feedback system; and comparing the supplied pressure value and a predetermined pressure value, and changing the pressure between the printing scraper and the printing screen if a difference between the feedback pressure value and the predetermined pressure value is larger than a predetermined threshold. An imprinting apparatus implementing the printing screen method is also provided.

Abstract: The present disclosure provides a display panel and a fabricating method thereof, and a display device. The fabricating method for the display panel includes forming a glass adhesive layer on a packaging region of a first substrate, forming an OLED device on a display region of the first substrate, and aligning the first substrate with a second substrate, and forming a sealing structure between the first substrate and the second substrate by irradiating the packaging region with laser. The fabricating method for the display panel according to an embodiment of the present disclosure avoids the occurrence of the phenomenon that the coated glass adhesive layer and the evaporated organic light emitting layer are offset during the subsequent packaging process, by fabricating the glass adhesive layer on the substrate for forming the OLED device, thereby the production efficiency of the overall packaging process is enhanced.

Abstract: A device for printing silicon sealant, including a coating device, a horizontal coating stage, and an elevating device, wherein: the elevating device is connected with the horizontal coating stage and is configured to adjust the height of the horizontal coating stage; the horizontal coating stage can be moved to a position right below a screen and fully contacted with the screen under the adjustment of the elevating device; and the coating device is configured to be moved to a position above the screen to coat silicon sealant in a pattern area of the screen after the horizontal coating stage is fully contacted with the screen.

Abstract: The present invention provides an OLED display motherboard, a packaging method thereof and a packaging system, belongs to the field of organic light-emitting display technology, and can solve the problem of poor sealing performance in the existing OLED display motherboard. The OLED display motherboard of the present invention comprises a package cover plate and an OLED substrate, which are assembled with each other in an aligned manner, a sealant is provided between the package cover plate and the OLED substrate, and the sealant is disposed in a peripheral region of the OLED display motherboard, and includes a hot melt adhesive.

Abstract: An embodiment of the present disclosure discloses an evaporation method, including: providing a flexible substrate having an original size; stretching the flexible substrate to have an evaporation size, wherein, the evaporation size is greater than the original size; arranging a mask on a side of the flexible substrate having the evaporation size; evaporating a material onto the flexible substrate having the evaporation size by using the mask, to form a patterned film layer.