Abstract: A method and an apparatus for determining the distributed power supply capacity to be accessed by a feed line of a power distribution network, and a storage medium, the method comprising: determining feed line loss on the basis of load information of power distribution network feed line access nodes and circuit parameters; on the basis of the feed line loss, determining three-phase voltage change values of the feed line circuit; using a single phase having the greatest voltage change amongst the voltage change values, determining a maximum active power for distributed power supply access under voltage constraints; comparing the current of the feed line corresponding to the maximum active power with a circuit current limit, and determining the distributed power supply capacity to be accessed by the feed line; the apparatus comprises a feed line information collection unit, a voltage drop unit, a quantitative calculation unit, and a results analysis unit.

Abstract: A method and an apparatus for determining the distributed power supply capacity to be accessed by a feed line of a power distribution network, and a storage medium, the method comprising: determining feed line loss on the basis of load information of power distribution network feed line access nodes and circuit parameters; on the basis of the feed line loss, determining three-phase voltage change values of the feed line circuit; using a single phase having the greatest voltage change amongst the voltage change values, determining a maximum active power for distributed power supply access under voltage constraints; comparing the current of the feed line corresponding to the maximum active power with a circuit current limit, and determining the distributed power supply capacity to be accessed by the feed line; the apparatus comprises a feed line information collection unit, a voltage drop unit, a quantitative calculation unit, and a results analysis unit.

Abstract: A package for providing electromagnetic shielding for microwave circuits. The package includes a top board having an upper surface, a lower surface opposite to the upper surface and a side surface joining the upper surface and the lower surface, and a bottom board having an upper surface attached to the lower surface of the top board, a lower surface opposite to the upper surface and an outer side surface joining the upper surface and the lower surface. The top board further includes at least one ground layer formed therein and a first metal coating formed on at least part of the side surface of the top board. The bottom board includes an inner side surface extending from the upper surface of the bottom board toward the lower surface of the bottom board and an inner lower surface joining the inner side surface, thereby providing an inner space for accommodating the microwave circuit.

Abstract: A microwave planar sensor for detecting the presence and movement of a target in a detection area, including a microwave board and a support board. The microwave board includes an oscillator/mixer layer, an antenna layer and a ground layer sandwiched between the oscillator/mixer layer and the antenna layer, when the oscillator/mixer layer and the antenna layer are bonded together. The oscillator/mixer layer includes an oscillator configured to generate at least one microwave signal and a signal mixer electrically coupled to the oscillator. The signal mixer is configured to combine a microwave signal generated by the oscillator and a reflected signal reflected by the target in the detection area, thereby generating an intermediate frequency signal having a Doppler frequency.

Abstract: A package for providing electromagnetic shielding for microwave circuits. The package includes a top board having an upper surface, a lower surface opposite to the upper surface and a side surface joining the upper surface and the lower surface, and a bottom board having an upper surface attached to the lower surface of the top board, a lower surface opposite to the upper surface and an outer side surface joining the upper surface and the lower surface. The top board further includes at least one ground layer formed therein and a first metal coating formed on at least part of the side surface of the top board. The bottom board includes an inner side surface extending from the upper surface of the bottom board toward the lower surface of the bottom board and an inner lower surface joining the inner side surface, thereby providing an inner space for accommodating the microwave circuit.