Patents by Inventor Shiyuki Kanisawa
Shiyuki Kanisawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10435601Abstract: An adhesive agent having excellent bonding properties with oxide films and excellent heat-dissipation properties and a connection structure using the same. The adhesive agent contains an epoxy compound, a cationic catalyst, and an acrylic resin containing acrylic acid and acrylic acid ester having a hydroxyl group. Acrylic acid in the acrylic resin reacts with the epoxy compound to generate connections between an island of acrylic resin and a sea of epoxy compound and roughen the surface of an oxide film to improve an anchor effect with the sea of epoxy compound; solder particles contained in the adhesive agent are melted to form metal bonding with an electrode, thereby enabling improvement in adhesive strength between the adhesive agent and the electrode and further improving heat dissipation from a surface of the metal bonding.Type: GrantFiled: May 22, 2015Date of Patent: October 8, 2019Assignee: DEXERIALS CORPORATIONInventors: Masaharu Aoki, Shiyuki Kanisawa, Hidetsugu Namiki, Akira Ishigami
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Patent number: 9994743Abstract: This adhesive contains an epoxy compound, a cationic catalyst, and an acrylic resin that includes acrylic acid and an acrylic acid ester having a hydroxyl group. The acrylic acid in the acrylic resin reacts with the epoxy compound, creating a link between the acrylic resin island part and the epoxy compound sea part, and strengthening the anchoring effect with respect to the epoxy compound sea part by roughening the surface of an oxide film. Furthermore, the hydroxyl-group-containing acrylic acid ester in the acrylic resin becomes electrostatically adhesive to wiring due to the polarity of the hydroxyl group. Excellent adhesive strength can be obtained by adhering, in this way, the entire cured product composed of the acrylic resin island part and the epoxy compound sea part to the oxide film.Type: GrantFiled: September 9, 2014Date of Patent: June 12, 2018Assignee: DEXERIALS CORPORATIONInventors: Masaharu Aoki, Shiyuki Kanisawa, Hidetsugu Namiki, Taichi Koyama, Akira Ishigami
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Patent number: 9676066Abstract: An anisotropic conductive adhesive in which high thermal dissipation is provided. Conductive particles and solder particles are dispersed in a binder. In a thermally compressed LED device manufactured using this anisotropic conductive adhesive, terminals of the LED device are electrically connected to terminals of a substrate via particles and the terminals of the LED device and the terminals of the substrate are solder bonded.Type: GrantFiled: September 17, 2013Date of Patent: June 13, 2017Assignee: DEXERIALS CORPORATIONInventors: Akira Ishigami, Shiyuki Kanisawa, Hidetsugu Namiki, Masaharu Aoki
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Patent number: 9670385Abstract: Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles solder particles and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics.Type: GrantFiled: February 13, 2015Date of Patent: June 6, 2017Assignee: DEXERIALS CORPORATIONInventors: Hidetsugu Namiki, Shiyuki Kanisawa, Akira Ishigami, Masaharu Aoki
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Patent number: 9670384Abstract: A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring substrate includes a thermosetting resin composition, conductive particles, and light-reflective insulating particles. The light-reflective insulating particles are formed by subjecting titanium oxide particles to a surface treatment with one kind selected from the group consisting of Al2O3, SiO, SiO2, ZnO, ZnO2, and ZrO2. The amount of the titanium oxide contained in the light-reflective insulating particles is 85 to 93%. The particle diameter of the light-reflective insulating particles is 0.2 to 0.3 ?m, and the particle diameter of the conductive particles is 2 to 10 ?m.Type: GrantFiled: February 24, 2012Date of Patent: June 6, 2017Assignee: DEXERIALS CORPORATIONInventors: Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi
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Publication number: 20170121571Abstract: Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles solder particles and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics.Type: ApplicationFiled: February 13, 2015Publication date: May 4, 2017Applicant: DEXERIALS CORPORATIONInventors: Hidetsugu NAMIKI, Shiyuki KANISAWA, Akira ISHIGAMI, Masaharu AOKI
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Publication number: 20170114255Abstract: An adhesive agent having excellent bonding properties with oxide films and excellent heat-dissipation properties and a connection structure using the same. The adhesive agent contains an epoxy compound, a cationic catalyst, and an acrylic resin containing acrylic acid and acrylic acid ester having a hydroxyl group. Acrylic acid in the acrylic resin reacts with the epoxy compound to generate connections between an island of acrylic resin and a sea of epoxy compound and roughen the surface of an oxide film to improve an anchor effect with the sea of epoxy compound; solder particles contained in the adhesive agent are melted to form metal bonding with an electrode, thereby enabling improvement in adhesive strength between the adhesive agent and the electrode and further improving heat dissipation from a surface of the metal bonding.Type: ApplicationFiled: May 22, 2015Publication date: April 27, 2017Applicant: DEXERIALS CORPORATIONInventors: Masaharu AOKI, Shiyuki KANISAWA, Hidetsugu NAMIKI, Akira ISHIGAMI
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Patent number: 9548141Abstract: A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a thermosetting resin composition, conductive particles, and light-reflective insulating particles. The light-reflective insulating particles are at least one of inorganic particles selected from the group consisting of titanium oxide, boron nitride, zinc oxide, and aluminum oxide, or resin-coated metal particles formed by coating the surface of scale-like or spherical metal particles with an insulating resin.Type: GrantFiled: July 20, 2010Date of Patent: January 17, 2017Assignee: DEXERIALS CORPORATIONInventors: Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi
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Patent number: 9487678Abstract: Provided is a light emitting device high in the intensity of emitted light. A blue LED chip having a peak of emitted light in a wavelength range of at least 360 nm and at most 500 nm is adhered to an electrode substrate by an anisotropic conductive adhesive. A light reflecting layer made of a silver alloy on a surface of each conductive particle contained in the anisotropic conductive adhesive, and has high reflectance with respect to blue light. The light reflecting layer is formed by sputtering of a sputtering target that contains Ag, Bi, and Nd with the content ratio of Bi set to at least 0.1 weight % (wt %) and at most 3.0 wt % and the content ratio of Nd set to at least 0.1 weight % and at most 2.0 wt % with respect to the total weight of Ag, Bi, and Nd of 100 wt %. The conductive particle has high anti-migration properties.Type: GrantFiled: August 19, 2015Date of Patent: November 8, 2016Assignee: DEXERIALS CORPORATIONInventors: Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi, Masaharu Aoki, Akira Ishigami
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Patent number: 9418958Abstract: An anisotropic conductive adhesive includes an epoxy adhesive containing an epoxy compound and a curing agent and conducive particles dispersed in the epoxy adhesive. When elastic moduluses at 35° C., 55° C., 95° C., and 150° C. of a cured product of the anisotropic conductive adhesive are denoted by EM35, EM55, EM95, and EM150, respectively, and change rates in the elastic modulus between 55° C. and 95° C. and between 95° C. and 150° C. are denoted by ?EM55-95 and ?EM95-150, respectively, the following expressions (1) to (5) are satisfied 700 Mpa?EM35?3000 MPa??(1) EM150<EM95<EM55<EM35??(2) ?EM55-95<?EM95-150??(3) 20%??EM55-95??(4) 40%??EM95-150??(5).Type: GrantFiled: December 12, 2013Date of Patent: August 16, 2016Assignee: DEXERIALS CORPORATIONInventors: Hidetsugu Namiki, Shiyuki Kanisawa, Genki Katayanagi
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Publication number: 20160204313Abstract: In order to provide a light emitting device having high connection reliability, the light-emitting device includes a board provided with a wiring pattern, an anisotropic conductive paste arranged on an board electrode of the wiring pattern, and a light-emitting element embedded in the anisotropic conductive paste, and at least one of the board electrode and the element electrode is plated with an AuSn alloy layer. The anisotropic conductive paste contains an epoxy compound, an acid anhydride, white inorganic particles, and conductive particles obtained by coating resin particles with an Au coating layer. It is possible to maintain electrical connection between the board electrode and the element electrode by the Au coating layers of the conductive particles even when a crack is generated in a eutectic bonding portion. Therefore, it is possible to obtain high connection reliability.Type: ApplicationFiled: March 23, 2016Publication date: July 14, 2016Applicant: DEXERIALS CORPORATIONInventors: Hidetsugu NAMIKI, Shiyuki KANISAWA, Akira ISHIGAMI
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Publication number: 20160194531Abstract: This adhesive contains an epoxy compound, a cationic catalyst, and an acrylic resin that includes acrylic acid and an acrylic acid ester having a hydroxyl group. The acrylic acid in the acrylic resin reacts with the epoxy compound, creating a link between the acrylic resin island part and the epoxy compound sea part, and strengthening the anchoring effect with respect to the epoxy compound sea part by roughening the surface of an oxide film. Furthermore, the hydroxyl-group-containing acrylic acid ester in the acrylic resin becomes electrostatically adhesive to wiring due to the polarity of the hydroxyl group. Excellent adhesive strength can be obtained by adhering, in this way, the entire cured product composed of the acrylic resin island part and the epoxy compound sea part to the oxide film.Type: ApplicationFiled: September 9, 2014Publication date: July 7, 2016Applicant: DEXERIALS CORPORATIONInventors: Masaharu AOKI, Shiyuki KANISAWA, Hidetsugu NAMIKI, Taichi KOYAMA, Akira ISHIGAMI
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Patent number: 9340710Abstract: A light-reflective conductive particle for an anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a core particle coated with a metal material and a light-reflecting layer formed from light-reflective inorganic particles having a refractive index of 1.52 or more on a surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or more include titanium oxide particles, zinc oxide particles, or aluminum oxide particles.Type: GrantFiled: December 19, 2013Date of Patent: May 17, 2016Assignee: DEXERIALS CORPORATIONInventors: Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi
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Patent number: 9260634Abstract: A light-reflective anisotropic conductive adhesive is used for anisotropic conductive connection of a light-emitting element to a wiring board. The adhesive includes a thermosetting resin, conductive particles, and light-reflective acicular insulating particles. The conductive particles comprise a core particle coated with a metal particle or a metal material, and a light reflective layer formed on a surface of the core particle. The light reflective layer comprises inorganic particles selected from any one of titanium oxide particles, zinc oxide particles or aluminum oxide particles until the entire conductive particle appears a color in a range from white to gray.Type: GrantFiled: November 17, 2014Date of Patent: February 16, 2016Assignee: Dexerials CorporationInventors: Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi, Akira Ishigami
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Publication number: 20150353781Abstract: Provided is a light emitting device high in the intensity of emitted light. A blue LED chip having a peak of emitted light in a wavelength range of at least 360 nm and at most 500 nm is adhered to an electrode substrate by an anisotropic conductive adhesive. A light reflecting layer made of a silver alloy on a surface of each conductive particle contained in the anisotropic conductive adhesive, and has high reflectance with respect to blue light. The light reflecting layer is formed by sputtering of a sputtering target that contains Ag, Bi, and Nd with the content ratio of Bi set to at least 0.1 weight % (wt %) and at most 3.0 wt % and the content ratio of Nd set to at least 0.1 weight % and at most 2.0 wt % with respect to the total weight of Ag, Bi, and Nd of 100 wt %. The conductive particle has high anti-migration properties.Type: ApplicationFiled: August 19, 2015Publication date: December 10, 2015Inventors: Hidetsugu NAMIKI, Shiyuki KANISAWA, Hideaki UMAKOSHI, Masaharu AOKI, Akira ISHIGAMI
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Publication number: 20150209914Abstract: An anisotropic conductive adhesive in which high thermal dissipation is provided. Conductive particles and solder particles are dispersed in a binder. In a thermally compressed LED device manufactured using this anisotropic conductive adhesive, terminals of the LED device are electrically connected to terminals of a substrate via particles and the terminals of the LED device and the terminals of the substrate are solder bonded.Type: ApplicationFiled: September 17, 2013Publication date: July 30, 2015Inventors: Akira Ishigami, Shiyuki Kanisawa, Hidetsugu Namiki, Masaharu Aoki
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Publication number: 20150197672Abstract: An anisotropic conductive adhesive includes: a conductive particle including a resin particle and a conductive metal layer that is formed on a surface of the resin particle; a thermally conductive particle that is a metal particle or an insulation coated particle, wherein the metal particle has an average particle size that is smaller than an average particle size of the conductive particle, and the insulation coated particle has an average particle size that is smaller than the average particle size of the conductive particle and includes a metal particle and an insulating layer that is formed on a surface of the metal particle; and an adhesive component in which the conductive particle and the thermally conductive particle are dispersed.Type: ApplicationFiled: September 17, 2013Publication date: July 16, 2015Applicant: DEXERIALS CORPORATIONInventors: Hidetsugu Namiki, Shiyuki Kanisawa, Akira Ishigami
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Publication number: 20150069448Abstract: A light-reflective anisotropic conductive adhesive is used for anisotropic conductive connection of a light-emitting element to a wiring board. The adhesive includes a thermosetting resin, conductive particles, and light-reflective acicular insulating particles. The conductive particles comprise a core particle coated with a metal particle or a metal material, and a light reflective layer formed on a surface of the core particle. The light reflective layer comprises inorganic particles selected from any one of titanium oxide particles, zinc oxide particles or aluminum oxide particles until the entire conductive particle appears a color in a range from white to gray.Type: ApplicationFiled: November 17, 2014Publication date: March 12, 2015Inventors: Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi, Akira Ishigami
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Patent number: 8975654Abstract: A light-reflective conductive particle for an anisotropic conductive adhesive used for connecting a light-emitting element to a wiring board by anisotropic conductive connection includes a core particle covered with a metal material and a light reflecting layer formed of a light-reflective inorganic particle having a refractive index of 1.52 or greater on the surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or greater include a titanium oxide particle, a zinc oxide particle, and an aluminum oxide particle. The coverage of the light reflecting layer on the surface of the core particle is 70% or more.Type: GrantFiled: March 21, 2014Date of Patent: March 10, 2015Assignee: Dexerials CorporationInventors: Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi
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Publication number: 20150034989Abstract: an anisotropic conductive adhesive which uses conductive particles where a silver-based metal is used as a conductive layer, having high light reflectance and excellent migration resistance is provided. The anisotropic conductive adhesive includes light reflective conductive particles in an insulating adhesive resin. The light reflective conductive particle includes a light reflective metal layer made of a metal alloy including silver, gold and hafnium formed on the surface of a resin particle as a core by sputtering method. The light reflective metal layer is preferably formed having a composition ratio of a silver of at least 50% by weight to at most 80% by weight: a gold of at least 10% by weight to at most 45%: a hafnium of at least 10% by weight to at most 40% by weight, and a total ratio does not exceed 100% by weight.Type: ApplicationFiled: October 16, 2014Publication date: February 5, 2015Inventors: Hidetsugu NAMIKI, Shiyuki KANISAWA, Hideaki UMAKOSHI, Masaharu AOKI, Akira ISHIGAMI