Patents by Inventor Sho-Chang Sun

Sho-Chang Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6525939
    Abstract: A heat sink apparatus for heat dissipation for a CPU includes a fan, a heat sink module and a latch. The fan has at least one attachment hole. The heat sink module is mounted onto the CPU, and is itself a metal heat conduction column having, a plurality of arc-shaped cooling fins radiating from the edge of the metal heat conduction column and a plurality of mounting holes positioned at the ends of the arc-shaped cooling fins. In addition, each mounting hole corresponds to a respective attachment hole. The latch comprises at least a latch arm, a plurality of openings and at least one latch hole. The latch arm is secured to the flange at the side of the CPU socket. Each of the openings corresponds to a mounting hole on the arc-shaped cooling fins of the heat sink module and the attachment holes on the fan.
    Type: Grant
    Filed: March 5, 2001
    Date of Patent: February 25, 2003
    Assignee: Acer Inc.
    Inventors: Chuan-Yi Liang, Sho-Chang Sun
  • Patent number: 6349031
    Abstract: A storage box for hard disk drive (HDD) is provided. The storage box includes an outer frame, a first holder, a second holder, a cooling module and a back panel board. The first and second holders are opposite and for supporting the HDD. The cooling module, for cooling the HDD, is fixed in the storage box via the second holder and the outer frame. The cooling air is drawn into the storage box by the cooling module. The back panel board is electrically connected to the cooling module. The back panel board has an outlet positioned relative to the cooling module. The cooling air is flowed through surface of the HDD and a heat sink of the cooling module, and then exhausted from the outlet of the back panel board.
    Type: Grant
    Filed: August 29, 2000
    Date of Patent: February 19, 2002
    Assignee: Acer, Inc.
    Inventors: Bo-Yao Lin, I-Huei Huang, Lin-Hsiu Chiang, Tsung-I Chang, Sho-Chang Sun
  • Publication number: 20020018336
    Abstract: A heat sink apparatus for heat dissipation for a CPU includes a fan, a heat sink module and a latch. The fan has at least one attachment hole. The heat sink module is mounted onto the CPU, and is itself a metal heat conduction column having, a plurality of arc-shaped cooling fins radiating from the edge of the metal heat conduction column and a plurality of mounting holes positioned at the ends of the arc-shaped cooling fins. In addition, each mounting hole corresponds to a respective attachment hole. The latch comprises at least a latch arm, a plurality of openings and at least one latch hole. The latch arm is secured to the flange at the side of the CPU socket. Each of the openings corresponds to a mounting hole on the arc-shaped cooling fins of the heat sink module and the attachment holes on the fan.
    Type: Application
    Filed: March 5, 2001
    Publication date: February 14, 2002
    Inventors: C. Y. Liang, Sho-Chang Sun