Patents by Inventor Sho-Wei Lo

Sho-Wei Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100025615
    Abstract: The present inventions include an insulating fluid comprising a non-particulate viscosifying polymer, a water or brine, a cross-linking agent, and insulating particulates. The insulating fluid may be produced by performing the following steps in any order: adding a non-particulate viscosifying polymer to a brine, adding a cross-linking agent, adding insulating particulates, and optionally adding a solvent. The insulating fluid may be injected into an annulus surrounding a pipe such as production tubing, casing, surface pipelines, subsea pipelines, or risers.
    Type: Application
    Filed: November 15, 2007
    Publication date: February 4, 2010
    Inventors: Sho-Wei Lo, Xiaoping Qiu
  • Patent number: 6725930
    Abstract: A method for hydraulic fracturing subterranean formation whereby at least part of the fracture is propped with proppant material essentially in the form of elongated particles having a shape with a length-basis aspect ratio greater than 5, preferably such as metallic wire segment. The remaining part of the fracture may be propped with conventional non-metallic proppant. Fracture conductivity is optimized.
    Type: Grant
    Filed: April 19, 2002
    Date of Patent: April 27, 2004
    Assignee: Schlumberger Technology Corporation
    Inventors: Curtis L. Boney, Matthew J. Miller, Sho-Wei Lo
  • Publication number: 20030196805
    Abstract: This invention relates generally to the art of hydraulic fracturing in subterranean formations and more particularly to a method and means for optimizing fracture conductivity. The proposed method involves propping part of the totality of a fracture in a subterranean formation with proppant essentially in the form of elongated particles having a shape with a length-basis aspect ratio greater than 5, preferably such as metallic wire segment. 1 Inventors: MATHEW J.
    Type: Application
    Filed: April 19, 2002
    Publication date: October 23, 2003
    Inventors: Curtis L. Boney, Matthew J. Miller, Sho-Wei Lo