Patents by Inventor Shogo Mizota
Shogo Mizota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10500617Abstract: In one embodiment, a substrate liquid treatment apparatus includes: a tank that stores a processing liquid; a circulation line connected to the tank, through which circulation line a circulation flow of the processing liquid that leaves the tank and then returns back to the tank; a processing unit that processes a substrate by supplying the processing liquid, distributed from the circulation line, to the substrate; a return line that returns, to the tank, the processing liquid discharged from the processing unit after being supplied to the substrate; a cleaning nozzle that discharges a cleaning liquid onto an inner wall surface of the tank to clean the inner wall surface by the cleaning liquid; and a cleaning line that supplies the cleaning liquid to the cleaning nozzle.Type: GrantFiled: May 17, 2017Date of Patent: December 10, 2019Assignee: Tokyo Electron LimitedInventor: Shogo Mizota
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Patent number: 10236192Abstract: A liquid processing apparatus of the present disclosure holds and rotate a substrate in a substrate holding unit, ejects an etching liquid while moving a main nozzle of a main nozzle unit between a first position where the etching liquid reaches a center of the substrate and a second position closer to a peripheral side of the substrate than the first position, and then, ejects the etching liquid to the substrate from a sub nozzle provided at a third position closer to the peripheral side of the substrate than the first position at an ejection flow rate higher than that from the main nozzle.Type: GrantFiled: November 20, 2014Date of Patent: March 19, 2019Assignee: Tokyo Electron LimitedInventors: Jun Nonaka, Shogo Mizota, Tatsuya Nagamatsu, Daisuke Saiki, Kazuhiro Teraoka, Takashi Yabuta
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Patent number: 9862007Abstract: Disclosed are a substrate liquid processing apparatus and method for performing a liquid processing on a substrate using a processing liquid, and a computer-readable recording medium with a substrate liquid processing program recorded therein. In the method, a first chemical liquid supply step is performed to supply a first chemical liquid from a first chemical liquid supply unit to a processing liquid storage unit, a first chemical liquid purifying step is performed to purify the first chemical liquid in a chemical liquid purifying unit, a second chemical liquid supply step is performed to supply a second chemical liquid from a second chemical liquid supply unit to the processing liquid storage unit, and a processing liquid supply step is performed to supply the processing liquid obtained by mixing the first and second chemical liquids from the processing liquid supply unit to substrate liquid processing units.Type: GrantFiled: March 24, 2015Date of Patent: January 9, 2018Assignee: Tokyo Electron LimitedInventors: Daisuke Saiki, Shogo Mizota, Takashi Yabuta, Jun Nonaka, Tatsuya Nagamatsu, Koji Tanaka, Tomiyasu Maezono
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Publication number: 20170333958Abstract: In one embodiment, a substrate liquid treatment apparatus includes: a tank that stores a processing liquid; a circulation line connected to the tank, through which circulation line a circulation flow of the processing liquid that leaves the tank and then returns back to the tank; a processing unit that processes a substrate by supplying the processing liquid, distributed from the circulation line, to the substrate; a return line that returns, to the tank, the processing liquid discharged from the processing unit after being supplied to the substrate; a cleaning nozzle that discharges a cleaning liquid onto an inner wall surface of the tank to clean the inner wall surface by the cleaning liquid; and a cleaning line that supplies the cleaning liquid to the cleaning nozzle.Type: ApplicationFiled: May 17, 2017Publication date: November 23, 2017Applicant: Tokyo Electron LimitedInventor: Shogo MIZOTA
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Patent number: 9305767Abstract: There is provided a liquid processing apparatus including a rotation unit configured to hold the target substrate and rotate the target substrate around a vertical axis; a processing solution supply nozzle configured to supply the processing solution to the surface of the target substrate being rotated; a first gas supply unit configured to form a downward flow of a first gas that flows over the entire surface of the target substrate and is introduced into a cup in order to form a processing atmosphere suitable for a liquid process to be performed; and a second gas supply unit configured to form a downward flow of a second gas different from the first gas in a region outside the downward flow of the first gas. The first gas supply unit and the second gas supply unit are provided at a ceiling portion of the housing serving as the processing space.Type: GrantFiled: March 12, 2012Date of Patent: April 5, 2016Assignee: TOKYO ELECTRON LIMITEDInventors: Kenji Nishi, Kazuhiro Takeshita, Nobuhiro Ogata, Satoru Tanaka, Shogo Mizota
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Patent number: 9192878Abstract: A liquid processing apparatus and a chemical liquid collecting method can suppress corrosion of wirings formed on a substrate. The liquid processing apparatus includes a processing unit configured to perform a liquid process by supplying a chemical liquid to a substrate; a collecting line configured to collect the chemical liquid supplied to the processing unit; a supply line configured to supply the collected chemical liquid to the processing unit; and a gas supply unit configured to supply an inert gas into the collecting line.Type: GrantFiled: December 27, 2013Date of Patent: November 24, 2015Assignee: TOKYO ELECTRON LIMITEDInventors: Shogo Mizota, Takashi Yabuta, Tatsuya Nagamatsu, Daisuke Saiki
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Publication number: 20150273538Abstract: Disclosed are a substrate liquid processing apparatus and method for performing a liquid processing on a substrate using a processing liquid, and a computer-readable recording medium with a substrate liquid processing program recorded therein. In the method, a first chemical liquid supply step is performed to supply a first chemical liquid from a first chemical liquid supply unit to a processing liquid storage unit, a first chemical liquid purifying step is performed to purify the first chemical liquid in a chemical liquid purifying unit, a second chemical liquid supply step is performed to supply a second chemical liquid from a second chemical liquid supply unit to the processing liquid storage unit, and a processing liquid supply step is performed to supply the processing liquid obtained by mixing the first and second chemical liquids from the processing liquid supply unit to substrate liquid processing units.Type: ApplicationFiled: March 24, 2015Publication date: October 1, 2015Inventors: Daisuke Saiki, Shogo Mizota, Takashi Yabuta, Jun Nonaka, Tatsuya Nagamatsu, Koji Tanaka, Tomiyasu Maezono
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Publication number: 20150147888Abstract: A liquid processing apparatus of the present disclosure holds and rotate a substrate in a substrate holding unit, ejects an etching liquid while moving a main nozzle of a main nozzle unit between a first position where the etching liquid reaches a center of the substrate and a second position closer to a peripheral side of the substrate than the first position, and then, ejects the etching liquid to the substrate from a sub nozzle provided at a third position closer to the peripheral side of the substrate than the first position at an ejection flow rate higher than that from the main nozzle.Type: ApplicationFiled: November 20, 2014Publication date: May 28, 2015Inventors: Jun Nonaka, Shogo Mizota, Tatsuya Nagamatsu, Daisuke Saiki, Kazuhiro Teraoka, Takashi Yabuta
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Publication number: 20140377463Abstract: Disclosed is a liquid processing method which may de-electrify the surface of a hydrophobized substrate. A substrate electrified according to a liquid processing is de-electrified by supplying a hydrophobizing liquid to a surface of the substrate subjected to the liquid processing while rotating the substrate, and performing rinsing by supplying an alkaline rinsing liquid to the hydrophobized surface of the substrate.Type: ApplicationFiled: June 6, 2014Publication date: December 25, 2014Inventors: Yosuke Hachiya, Hisashi Kawano, Mitsunori Nakamori, Jun Nonaka, Shogo Mizota, Tatsuya Nagamatsu, Daisuke Saiki, Kazuhiro Teraoka, Takashi Yabuta
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Publication number: 20140182455Abstract: A liquid processing apparatus and a chemical liquid collecting method can suppress corrosion of wirings formed on a substrate. The liquid processing apparatus includes a processing unit configured to perform a liquid process by supplying a chemical liquid to a substrate; a collecting line configured to collect the chemical liquid supplied to the processing unit; a supply line configured to supply the collected chemical liquid to the processing unit; and a gas supply unit configured to supply an inert gas into the collecting line.Type: ApplicationFiled: December 27, 2013Publication date: July 3, 2014Applicant: Tokyo Electron LimitedInventors: Shogo Mizota, Takashi Yabuta, Tatsuya Nagamatsu, Daisuke Saiki
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Patent number: 8303723Abstract: In a liquid processing apparatus configured to remove, from a substrate including a first film and a second film formed above the first film, the first film and the second film, a first chemical-liquid supply part supplies, to a substrate W, a first liquid for dissolving the first film, a second chemical-liquid supply part supplies a second chemical liquid for weakening the second film, and a fluid supply part serving also as an impact giving part gives a physical impact to the second film so as to break the second film and supplies a fluid for washing away debris of the broken second film. A control device controls the respective parts such that, after the second liquid has been supplied and then the fluid has been supplied from the fluid supply part, the first chemical liquid is supplied.Type: GrantFiled: December 10, 2009Date of Patent: November 6, 2012Assignee: Tokyo Electron LimitedInventors: Teruomi Minami, Fumihiro Kamimura, Kazuki Kosai, Takashi Yabuta, Kenji Yokomizo, Shogo Mizota
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Publication number: 20120234356Abstract: There is provided a liquid processing apparatus including a rotation unit configured to hold the target substrate and rotate the target substrate around a vertical axis; a processing solution supply nozzle configured to supply the processing solution to the surface of the target substrate being rotated; a first gas supply unit configured to form a downward flow of a first gas that flows over the entire surface of the target substrate and is introduced into a cup in order to form a processing atmosphere suitable for a liquid process to be performed; and a second gas supply unit configured to form a downward flow of a second gas different from the first gas in a region outside the downward flow of the first gas. The first gas supply unit and the second gas supply unit are provided at a ceiling portion of the housing serving as the processing space.Type: ApplicationFiled: March 12, 2012Publication date: September 20, 2012Applicant: TOKYO ELECTRON LIMITEDInventors: Kenji Nishi, Kazuhiro Takeshita, Nobuhiro Ogata, Satoru Tanaka, Shogo Mizota
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Publication number: 20100319734Abstract: In a liquid processing apparatus configured to remove, from a substrate including a first film and a second film formed above the first film, the first film and the second film, a first chemical-liquid supply part supplies, to a substrate W, a first liquid for dissolving the first film, a second chemical-liquid supply part supplies a second chemical liquid for weakening the second film, and a fluid supply part serving also as an impact giving part gives a physical impact to the second film so as to break the second film and supplies a fluid for washing away debris of the broken second film. A control device controls the respective parts such that, after the second liquid has been supplied and then the fluid has been supplied from the fluid supply part, the first chemical liquid is supplied.Type: ApplicationFiled: December 10, 2009Publication date: December 23, 2010Applicant: Tokyo Electron LimitedInventors: Teruomi MINAMI, Fumihiro Kamimura, Kazuki Kosai, Takashi Yabuta, Kenji Yokomizo, Shogo Mizota
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Patent number: 7678199Abstract: A method is provided for reducing the amount of film fragments discharged into a processing liquid circulation system during removal of films from wafers, thereby reducing the frequency of filter cleaning or filter replacement. The method includes exposing a wafer containing a film formed thereon in a process chamber of a substrate processing system to a processing liquid, where the wafer is not rotated or is rotated at a first speed and the processing liquid is discharged from the process chamber to a processing liquid circulation system. Subsequently, exposure of the wafer to the processing liquid is discontinued and the wafer is rotated at a second speed greater than the first speed to centrifugally remove fragments of the film from the wafer. Next, the wafer is exposed to the same or a different processing liquid and the processing liquid is discharged from the process chamber to a processing liquid drain.Type: GrantFiled: September 6, 2006Date of Patent: March 16, 2010Assignee: Tokyo Electron LimitedInventors: Shogo Mizota, Minami Teruomi, Kenji Yokomizo, Taira Masaki
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Publication number: 20080053489Abstract: A method is provided for reducing the amount of film fragments discharged into a processing liquid circulation system during removal of films from wafers, thereby reducing the frequency of filter cleaning or filter placement. The method includes exposing a wafer containing a film formed thereon in a process chamber of a substrate processing system to a processing liquid, where the wafer is not rotated or is rotated at a first speed and the processing liquid is discharged from the process chamber to a processing liquid circulation system. Subsequently, exposure of the wafer to the processing liquid is discontinued and the wafer is rotated at a second speed greater than the first speed to centrifugally remove fragments of the film from the wafer. Next, the wafer is exposed to the same or a different processing liquid and the processing liquid is discharged from the process chamber to a processing liquid drain.Type: ApplicationFiled: September 6, 2006Publication date: March 6, 2008Applicant: Tokyo Electron LimitedInventors: Shogo Mizota, Minami Teruomi, Kenji Yokomizo, Taira Masaki