Abstract: A stabilizer comprises a main bar that is elastically deformable, a pair of connecting plates respectively configured to be connected to a pair of left and right suspension apparatuses, and transition sections connecting both end portions of the main bar and the pair of connecting plates, a size of one transition section of the transition sections in a plate thickness direction of one connecting plate of the connecting plates gradually decreasing from the main bar toward the connecting plate, wherein the minimum value of the Vickers hardness of the transition section is 200 HV or more.

Abstract: An industrial vehicle charging system includes a plurality of chargers, a charge controller configured to instruct each of the plurality of the chargers on a value of charge power, and a management device configured to receive charge information of an industrial vehicle. The chargers each have a communication unit that receives the charge information, and transmits the charge information to the charge controller. The management device has a storage that stores a charge schedule and an operation load, and a required charge amount calculator that calculates a required charge amount of the industrial vehicle The charge controller has a charge power value calculator that calculates the value of the charge power which is transmitted to each of the chargers.

Abstract: This semiconductor module is provided with a first conductive plate, a first switching element mounted on the first conductive plate, a second conductive plate provided on the first switching element, a second switching element laminated on the second conductive plate, a third conductive plate provided on the second switching element, and first and second control terminals. Each of the switching elements is configured using silicon carbide. On a second lower conductive plate surface of the second conductive plate, a protruding part is provided that protrudes from said second lower conductive plate surface toward a first element upper surface and that is bonded to a first upper electrode.

Abstract: A stabilizer comprises a main bar that is elastically deformable, a pair of connecting plates respectively configured to be connected to a pair of left and right suspension apparatuses, and transition sections connecting both end portions of the main bar and the pair of connecting plates, a size of one transition section of the transition sections in a plate thickness direction of one connecting plate of the connecting plates gradually decreasing from the main bar toward the connecting plate, wherein the minimum value of the Vickers hardness of the transition section is 200 HV or more.

Abstract: Provided is an operation support system for a desulfurization apparatus evaluates soundness of the desulfurization apparatus by comparing an analytic performance calculated based on operation data of the desulfurization apparatus and a measured performance and creates support information including an operation condition candidate set based on the evaluation result and a balance forecast.

Abstract: A halogenation system, a method of halogenating a substrate, and halogenated compounds are provided. The halogenation system includes PltM immobilized on a solid support. The system may include one or more additional enzymes immobilized on the solid support. The method of halogenating a substrate includes running the substrate and a reaction solution through the halogenation system including PltM immobilized on a solid support. The halogenated compounds include 4,6-diCl-3, 4,6-diCl-8, 2,4-diCl-9, 2,6-diCl-11, 3,5-diCl-15, 4,6-diCl-16, 4,6-diCl-18, 4-Cl-23, and/or 4,6-diBr-3.

Abstract: A liquid ejection apparatus, including: a channel structure in which a channel is formed; an actuator stacked on the channel structure in a stacking direction, the actuator configured to cause a liquid in the channel to be ejected; a first frame formed of metal and stacked on the channel structure in the stacking direction; a driver integrated circuit (IC) electrically connected to the actuator; and a second frame formed of metal, the second frame including at least two side walls facing each other and an upper wall extending between the two side walls and extending in a direction orthogonal to the stacking direction, the second frame being thermally connected to the first frame, wherein the driver IC is disposed between the two side walls, and the upper wall of the second frame is thermally connected to the driver IC.

Abstract: A semiconductor module includes a substrate, two bare chips (semiconductor elements) mounted on the substrate, and a case fixed to the substrate. A conductor pattern and five signal patterns are provided for each bare chip on an upper surface of an insulating substrate. Signal electrodes and the signal patterns of the bare chips are connected to by conductive plates. An insulating member is provided on connecting portions of the conductive plates.

Abstract: A liquid discharge apparatus includes a plate-like actuator including a plurality of individual electrodes aligning in a first direction, a channel member being joined to one surface of the actuator to include a plurality of pressure chambers aligning along the first direction, and a heater being arranged directly or indirectly on the other surface of the actuator and having a convex portion in direct or indirect contact with the plate-like actuator. The convex portion is arranged between the plurality of individual electrodes and an outer edge of the actuator.

Abstract: A head unit includes: a head module having a nozzle surface; a casing; a first connector having a first communication opening; a second connector having a second communication opening; a first liquid-passage tube connected to the first communication opening; first and second branch-liquid-passage tubes connected to the first liquid-passage tube; a first tube joint connecting the first liquid-passage tube to the first and second branch-liquid-passage tubes; a second liquid-passage tube connected to the second communication opening; third and fourth branch-liquid-passage tubes connected to the second liquid-passage tube; and a second tube joint connecting the second liquid-passage tube to the third and fourth branch-liquid-passage tubes. The first tube joint is disposed between the second connector and the second tube joint when viewed in a direction parallel with the nozzle surface.

Abstract: A head unit includes a circuit board, a casing, and a head module including: a nozzle plate and a liquid-passage defining member stacked on each other in a stacking direction; a drive element; and an interconnect member. A distance between a first end and a second end of the nozzle plate which are spaced in a first direction is greater than a distance between a third end and a fourth end of the nozzle plate which are spaced in a second direction. A distance between a seventh end and an eighth end of the circuit board which are spaced in the stacking direction is greater than a distance between a fifth end and a sixth end of the circuit board which are spaced in the first direction.

Abstract: There is provided a head module including: a case; and a head provided with nozzles through which a liquid is jetted. The head includes: two first inlets through which the liquid flows into the head; and a first outlet through which the liquid flows out of the head. The case includes: a second inlet through which the liquid supplied from an outside flows into the case; two inflow-connecting ports communicating with the second inlet and connected to the two first inlets; an outflow-connecting port connected to the first outlet; and a second outlet communicating with the outflow-connecting port and through which the liquid flows out to the outside.

Abstract: A semiconductor module includes a substrate, two bare chips (semiconductor elements) mounted on the substrate, and a case fixed to the substrate. A conductor pattern and five signal patterns are provided for each bare chip on an upper surface of an insulating substrate. Signal electrodes and the signal patterns of the bare chips are connected to by conductive plates. An insulating member is provided on connecting portions of the conductive plates.

Abstract: A head unit includes a circuit board, a casing, and a head module including: a nozzle plate and a liquid-passage defining member stacked on each other in a stacking direction; a drive element; and an interconnect member. A distance between a first end and a second end of the nozzle plate which are spaced in a first direction is greater than a distance between a third end and a fourth end of the nozzle plate which are spaced in a second direction. A distance between a seventh end and an eighth end of the circuit board which are spaced in the stacking direction is greater than a distance between a fifth end and a sixth end of the circuit board which are spaced in the first direction.

Abstract: A liquid ejection apparatus, including: a channel structure in which a channel is formed; an actuator stacked on the channel structure in a stacking direction, the actuator configured to cause a liquid in the channel to be ejected; a first frame formed of metal and stacked on the channel structure in the stacking direction; a driver integrated circuit (IC) electrically connected to the actuator; and a second frame formed of metal, the second frame including at least two side walls facing each other and an upper wall extending between the two side walls and extending in a direction orthogonal to the stacking direction, the second frame being thermally connected to the first frame, wherein the driver IC is disposed between the two side walls, and the upper wall of the second frame is thermally connected to the driver IC.

Abstract: A head unit includes: a head module having a nozzle surface; a casing; a first connector having a first communication opening; a second connector having a second communication opening; a first liquid-passage tube connected to the first communication opening; first and second branch-liquid-passage tubes connected to the first liquid-passage tube; a first tube joint connecting the first liquid-passage tube to the first and second branch-liquid-passage tubes; a second liquid-passage tube connected to the second communication opening; third and fourth branch-liquid-passage tubes connected to the second liquid-passage tube; and a second tube joint connecting the second liquid-passage tube to the third and fourth branch-liquid-passage tubes. The first tube joint is disposed between the second connector and the second tube joint when viewed in a direction parallel with the nozzle surface.

Abstract: A liquid discharge apparatus includes a plate-like actuator including a plurality of individual electrodes aligning in a first direction, a channel member being joined to one surface of the actuator to include a plurality of pressure chambers aligning along the first direction, and a heater being arranged directly or indirectly on the other surface of the actuator and having a convex portion in direct or indirect contact with the plate-like actuator. The convex portion is arranged between the plurality of individual electrodes and an outer edge of the actuator.

Abstract: An electronic device includes a heat dissipation member, a power element that is thermally coupled to the heat dissipation member, and a first conductive layer to which the power element is electrically coupled. The electronic device further includes a control element that controls a switching operation of the power element, a second conductive layer to which the control element is electrically coupled, and a resin layer arranged between the first conductive layer and the second conductive layer. The power element is embedded in the resin layer. The first conductive layer, the resin layer, and the second conductive layer are stacked on the heat dissipation member in this order from the ones closer to the heat dissipation member.

Abstract: A semiconductor module includes a wiring substrate and two semiconductor devices mounted on the wiring substrate. The semiconductor module includes a housing having a rectangular frame body including four side walls. The housing includes a beam that bridges first side walls. A bus bar includes two end portions, upright portions each extending from one of the end portions in the thickness direction of an insulating substrate, bent portions each extending continuously with one of the upright portions, and an extension extending continuously with the bent portions. A section of the extension is embedded in the housing.

Abstract: A motor-driven compressor includes a compressor unit, a motor unit including a motor, and an inverter unit that drives the motor. The compressor unit, the motor unit, and the inverter unit are lined up in an axial direction of the motor. The motor-driven compressor further includes a housing that accommodates the compressor unit and the motor unit. The inverter unit includes an inverter module. The inverter module includes U-phase, V-phase, and W-phase semiconductor elements that respectively configure U-phase, V-phase, and W-phase arms and a substrate on which the semiconductor elements are bare-chip-mounted. The substrate includes a heat dissipation surface that is thermally connected to the housing. The semiconductor elements are arranged along a contour of the housing.