Abstract: A domain wall displacement element includes a magnetoresistance element which has a reference layer and a domain wall displacement layer each containing a ferromagnetic body, a non-magnetic layer, and first and second magnetization fixed layers which are in contact with the displacement layer, wherein the first layer has a first region in contact with the displacement layer, a non-magnetic first intermediate layer, and a second region contacting the first intermediate layer, the first region has a first ferromagnetic layer contacting the first intermediate layer, the second region has a second ferromagnetic layer contacting the first intermediate layer, the first and second ferromagnetic layers are ferromagnetically coupled, a ferromagnetic layer closest to the displacement layer in the first region and a ferromagnetic layer closest to displacement layer in the second magnetization fixed layer have the same film configuration, and the first and second regions are different in film configuration.

Abstract: An acquisition unit acquires pieces of information including information related to a vehicle, information related to the environment inside and outside the vehicle, and information related to a driver on board the vehicle. A determination unit determines priorities of the pieces of information acquired by the acquisition unit on the basis of a service or the like used by the driver among services or the likes provided using information accumulated in a server device. A selection unit selects a piece of information to be transmitted to the server device from among the pieces of information acquired by the acquisition unit on the basis of the priorities determined by the determination unit. A communication unit transmits the piece of information selected by the selection unit to the server device.

Abstract: A magnetic domain wall moving element includes a first ferromagnetic layer, non-magnetic layer, second ferromagnetic layer, first magnetization fixed part, second magnetization fixed part, first surface layer and second surface layer.

Abstract: A magnetic array includes: a plurality of magnetoresistance effect elements; and a pulse application device which applies a pulse to each of the plurality of magnetoresistance effect elements, wherein each of the plurality of magnetoresistance effect elements includes domain wall motion layer, ferromagnetic layer, and non-magnetic layer sandwiched between the domain wall motion layer and the ferromagnetic layer, wherein the pulse application device is configured to apply an initialization pulse and an operation pulse to each of the plurality of magnetoresistance effect elements, wherein the initialization pulse has a first pulse that is applied a plurality of times to spread a distribution of resistance values of the plurality of magnetoresistance effect elements from an initial distribution, and wherein a voltage of each first pulse is smaller than that of the operation pulse or each pulse length of the first pulse is shorter than that of the operation pulse.

Abstract: A manufacturing method of a semiconductor device according to the technology disclosed in the present specification includes: providing at least one semiconductor element; connecting, to the semiconductor element, a plurality of first terminals and at least one second terminal that is a control terminal to which a voltage lower than that of the first terminal is applied; and forming a first bent part in the first terminal, in which the first bent part does not protrude on the surfaces, facing each other, of the plurality of first terminals that are adjacent to each other.

Abstract: Provided is a lead frame of a semiconductor device in which lead terminals with different terminal lengths can be formed without changing width of a frame portion. A lead frame includes: a first terminal portion in which a plurality of first terminals is arranged side by side; a second terminal portion in which a plurality of second terminals wider than the first terminals is arranged side by side; and a frame portion to which a tip end portion of each of the first terminals and the second terminals is connected, wherein first recess portions recessed along the first terminals are provided in the frame portion, and wherein the first terminal portion includes the first terminal the tip end portion of which is sandwiched between the adjacent first recess portions and the first terminal the tip end portion of which is not sandwiched between the adjacent first recess portions.

Abstract: A semiconductor device includes: semiconductor elements; a package sealing the semiconductor elements and being rectangular in a top view; control terminals protruding from a first side of the package; output terminals protruding from a second side facing the first side of the package; and a recessed portion formed in a third side adjacent to the first side and the second side of the package, wherein a part of the control terminals is disposed at end portions of lead frames, the semiconductor device further includes dummy terminals disposed at other end portions of the lead frames, respectively, the dummy terminals protruding from the recessed portion, and an amount of the protrusion of each of the dummy terminals from the recessed portion is smaller than or equal to 0.75 mm.

Abstract: A semiconductor device includes: a rectangular RC-IGBT; an IC chip electrically connected to the RC-IGBT; a plurality of control terminals electrically connected to the IC chip; a plurality of power terminals electrically connected to the RC-IGBT; and a rectangular sealing resin covering the RC-IGBT and the IC chip. The RC-IGBT has an aspect ratio of 1.62 or more, the sealing resin has a lengthwise length of 44 mm or smaller, and the semiconductor device has a rated current of 25 A or more.

Abstract: A reciprocating tool includes: a motor; a gear case; a converting mechanism; a plunger; a sealing member; and an auxiliary sealing member. The converting mechanism is accommodated in the gear case and configured to convert rotating motion of the motor into reciprocating movement in a predetermined direction. The plunger is provided with a mounting portion on which an end bit is mountable, and is reciprocally movably supported to the gear case. The plunger is driven by the converting mechanism to reciprocally move in the predetermined direction. The plunger is reciprocally movably inserted into the sealing member in the predetermined direction. The sealing member is supported by the gear case. The auxiliary sealing member is supported by the sealing member and sealing an outer peripheral surface of the plunger.

Abstract: A method for manufacturing a semiconductor device according to the present invention includes the steps of (a) preparing a lead frame including a power chip die pad to which two terminals are connected, a control element die pad to which one terminal is connected, and tie bar portions connecting between a plurality of terminals including the two terminals, (b) placing a power chip and a free wheel diode on the power chip die pad and placing ICs on the control element die pad, (c) encapsulating in a mold resin to allow the tie bar portions to be exposed outside and a plurality of terminals including the two terminals and the one terminal to protrude outward, and (d) removing the tie bar portions other than the tie bar portions connecting the two terminals.

Abstract: A semiconductor module includes: a semiconductor element; a first lead frame including a first portion on which the semiconductor element is mounted; a sealing member sealing the semiconductor element and the first portion; and a heat dissipation member which is integrated with the sealing member and dissipates heat generated in the semiconductor element. The heat dissipation member is insulated from the semiconductor element and the first portion by the sealing member. Therefore, the semiconductor module that is applicable to vertical semiconductor elements and ensures electrical insulation between the semiconductor element and the heat dissipation member when implementing the semiconductor module onto a circuit board, can be provided.

Abstract: A manufacturing method of a semiconductor device according to the technology disclosed in the present specification includes: providing at least one semiconductor element; connecting, to the semiconductor element, a plurality of first terminals and at least one second terminal that is a control terminal to which a voltage lower than that of the first terminal is applied; and forming a first bent part in the first terminal, in which the first bent part does not protrude on the surfaces, facing each other, of the plurality of first terminals that are adjacent to each other.

Abstract: The present invention is a semiconductor module including: first and second drive circuits that perform drive control of at least one pair of first and second switching devices, in which the at least one pair of first and second switching devices and the first and second drive circuits are sealed in a package having a rectangular shape in plan view, and there are provided: a control terminal provided to protrude from a side surface of a first long side out of first and second long sides of the package, and to which a control signal of the first and second drive circuits is inputted; an output terminal provided to protrude from a side surface of the second long side; a first main terminal provided to protrude from a side surface of a first short side out of first and second short sides of the package; and a second main terminal provided to protrude from a side surface of the second short side.

Abstract: A method for manufacturing a semiconductor device according to the present invention includes the steps of (a) preparing a lead frame including a power chip die pad to which two terminals are connected, a control element die pad to which one terminal is connected, and tie bar portions connecting between a plurality of terminals including the two terminals, (b) placing a power chip and a free wheel diode on the power chip die pad and placing ICs on the control element die pad, (c) encapsulating in a mold resin to allow the tie bar portions to be exposed outside and a plurality of terminals including the two terminals and the one terminal to protrude outward, and (d) removing the tie bar portions other than the tie bar portions connecting the two terminals.

Abstract: The present invention is a semiconductor module including: first and second drive circuits that perform drive control of at least one pair of first and second switching devices, in which the at least one pair of first and second switching devices and the first and second drive circuits are sealed in a package having a rectangular shape in plan view, and there are provided: a control terminal provided to protrude from a side surface of a first long side out of first and second long sides of the package, and to which a control signal of the first and second drive circuits is inputted; an output terminal provided to protrude from a side surface of the second long side; a first main terminal provided to protrude from a side surface of a first short side out of first and second short sides of the package; and a second main terminal provided to protrude from a side surface of the second short side.

Abstract: A reciprocating tool includes: a motor; a gear case; a converting mechanism; a plunger; a sealing member; and an auxiliary sealing member. The converting mechanism is accommodated in the gear case and configured to convert rotating motion of the motor into reciprocating movement in a predetermined direction. The plunger is provided with a mounting portion on which an end bit is mountable, and is reciprocally movably supported to the gear case. The plunger is driven by the converting mechanism to reciprocally move in the predetermined direction. The plunger is reciprocally movably inserted into the sealing member in the predetermined direction. The sealing member is supported by the gear case. The auxiliary sealing member is supported by the sealing member and sealing an outer peripheral surface of the plunger.

Abstract: A semiconductor module includes: a semiconductor element; a first lead frame including a first portion on which the semiconductor element is mounted; a sealing member sealing the semiconductor element and the first portion; and a heat dissipation member which is integrated with the sealing member and dissipates heat generated in the semiconductor element. The heat dissipation member is insulated from the semiconductor element and the first portion by the sealing member. Therefore, the semiconductor module that is applicable to vertical semiconductor elements and ensures electrical insulation between the semiconductor element and the heat dissipation member when implementing the semiconductor module onto a circuit board, can be provided.

Abstract: A semiconductor module includes: a semiconductor chip; a package sealing the semiconductor chip; and a plurality of terminals connected to the semiconductor chip and protruding from the package, wherein the plurality of terminals includes a plurality of first terminals arranged side by side at a first pitch, and a plurality of second terminals arranged side by side at a second pitch, each terminal has a base portion, a tip portion narrower than the base portion, and a connection portion connecting the base portion and the tip portion, the connection portions of the plurality of first terminals are right-angled, and the connection portions of the plurality of second terminals are arc-shaped.

Abstract: A semiconductor module includes: a semiconductor chip; a package sealing the semiconductor chip; and a plurality of terminals connected to the semiconductor chip and protruding from the package, wherein the plurality of terminals includes a plurality of first terminals arranged side by side at a first pitch, and a plurality of second terminals arranged side by side at a second pitch, each terminal has a base portion, a tip portion narrower than the base portion, and a connection portion connecting the base portion and the tip portion, the connection portions of the plurality of first terminals are right-angled, and the connection portions of the plurality of second terminals are arc-shaped.