Patents by Inventor Shogo Shinkai

Shogo Shinkai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230223000
    Abstract: Provided is an acoustic reproduction apparatus, including a first microphone to be used for noise cancellation processing using a feedback scheme, a second microphone including a sound collection surface in a direction different from a direction of a sound collection surface of the first microphone and to be used for noise cancellation processing using the feedback scheme, and an acoustic signal processing unit configured to generate a noise-cancelling signal using a first sound collection signal collected by the first microphone and a second sound collection signal collected by the second microphone.
    Type: Application
    Filed: February 16, 2021
    Publication date: July 13, 2023
    Inventors: SHOGO SHINKAI, HAYAMI TOBISE, SHUN KATSUYAMA, MAHENDRA KODAVATI, TAKUMA FUKUNAGA
  • Patent number: 10936128
    Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: March 2, 2021
    Assignee: Sony Corporation
    Inventors: Hiroto Kawaguchi, Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
  • Patent number: 10871846
    Abstract: A sensor panel includes a sensor section that detects magnetic force of a contacting surface or a region in the vicinity of the contacting surface on a basis of a change in capacitance and is allowed to output a signal depending on the change in capacitance along with information on a position where the change in capacitance has occurred.
    Type: Grant
    Filed: April 15, 2015
    Date of Patent: December 22, 2020
    Assignee: SONY CORPORATION
    Inventors: Taizo Nishimura, Hiroto Kawaguchi, Hiroshi Mizuno, Shogo Shinkai, Fumihiko Iida, Akira Ebisui, Kei Tsukamoto, Tomoko Katsuhara
  • Patent number: 10615793
    Abstract: An input apparatus according to an embodiment of the present technology includes an operation member, an electrode substrate, and a first support. The operation member includes a plurality of key regions and is configured to be deformable. The electrode substrate includes a first capacitive element arranged opposed to each of the plurality of key regions and a second capacitive element arranged around the first capacitive element. The electrode substrate is capable of electrostatically detecting a change of a distance from each of the plurality of key regions. The first support includes a plurality of first structures and a first space. The plurality of first structures connect between the electrode substrate and the operation member. The first space is formed between the plurality of first structures and capable of changing the distance between each of the plurality of key regions and the electrode substrate according to an input operation.
    Type: Grant
    Filed: January 30, 2014
    Date of Patent: April 7, 2020
    Assignee: Sony Corporation
    Inventors: Hiroto Kawaguchi, Shogo Shinkai, Tetsuro Goto, Toshio Kano
  • Publication number: 20200097106
    Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.
    Type: Application
    Filed: August 26, 2019
    Publication date: March 26, 2020
    Applicant: Sony Corporation
    Inventors: Hiroto Kawaguchi, Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
  • Patent number: 10386971
    Abstract: A sensor device includes: a sensor layer provided at a position facing a surface, of a substrate having an operation surface, opposite to the operation surface, and configured to detect a contacted position or a pressed position on the operation surface; and a gap layer located in a gap between the substrate and the sensor layer. The gap layer includes a bonding region bonding the substrate to the sensor layer, and a relaxation region relaxing stress applied from the substrate to the sensor layer.
    Type: Grant
    Filed: July 23, 2014
    Date of Patent: August 20, 2019
    Assignee: SONY CORPORATION
    Inventors: Taizo Nishimura, Fumihiko Iida, Hiroshi Mizuno, Yasuyuki Abe, Takayuki Tanaka, Hayato Hasegawa, Shogo Shinkai
  • Patent number: 10282041
    Abstract: Provided is a sensor device, including: a deformable first surface; a second surface facing the first surface; an electrode board between the first surface and the second surface, the electrode board including a plurality of capacitive elements arranged in a matrix; a support including a first support layer and a second support layer, the first support layer including a plurality of first columns, the second support layer being layered on the first support layer, the support being deformable following deformation of the first surface, the support connecting at least one of the first surface and the second surface to the electrode board; and a conductor layer supported by the support.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: May 7, 2019
    Assignee: Sony Corporation
    Inventors: Shogo Shinkai, Hiroto Kawaguchi, Hiroshi Mizuno, Taizo Nishimura, Fumihiko Iida, Kei Tsukamoto, Hayato Hasegawa, Tomoko Katsuhara
  • Patent number: 10197849
    Abstract: An illumination apparatus includes a pair of substrates arranged oppositely to each other with a distance, and a light source disposed on a side surface of one of the pair of substrates. The illumination apparatus further includes an electrode that is provided on a surface of each of the pair of substrates and generates an electric field in a direction intersecting perpendicularly to the surface of the substrate. The illumination apparatus further includes a light modulation layer that is disposed at a clearance between the pair of substrates and is configured to exhibit scattering property or transparency to light from the light source, based on magnitude of the electric field generated by the electrode. The electrode includes a plurality of first electrode blocks on a surface of one of the pair of substrates.
    Type: Grant
    Filed: April 30, 2013
    Date of Patent: February 5, 2019
    Assignee: Sony Corporation
    Inventors: Shogo Shinkai, Akira Ebisui
  • Patent number: 10055067
    Abstract: [Object] To provide a sensor device capable of detecting an operation position and a pressing force with high accuracy. [Solution] A sensor device includes a first conductor layer, an electrode substrate, and a plurality of first structural bodies configured to separate the first conductor layer from the electrode substrate. At least one of the first conductor layer and the electrode substrate has flexibility. The electrode substrate includes a plurality of first electrodes and a plurality of second electrodes intersecting the plurality of first electrodes. At least one of the first and second electrodes includes a plurality of sub-electrodes.
    Type: Grant
    Filed: February 6, 2014
    Date of Patent: August 21, 2018
    Assignee: Sony Corporation
    Inventors: Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hiroto Kawaguchi, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
  • Publication number: 20180088709
    Abstract: There is provided a sensor device includes a sheet-like first conductor layer and an electrode substrate. The electrode substrate includes a plurality of first electrode wires, a plurality of second electrode wires, capacity sensors being formed at paired portions of the first and second electrode wires, and a sheet substrate that supports the first and second electrode wires. The sensor device also includes a first supporting body including a plurality of first structures that connect the first conductor layer and the electrode substrate.
    Type: Application
    Filed: October 14, 2017
    Publication date: March 29, 2018
    Applicant: Sony Corporation
    Inventors: Takashi Itaya, Shogo Shinkai, Hiroto Kawaguchi, Fumihiko Iida, Hayato Hasegawa, Kei Tsukamoto, Takayuki Tanaka, Tomoko Katsuhara, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
  • Publication number: 20170364182
    Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.
    Type: Application
    Filed: September 1, 2017
    Publication date: December 21, 2017
    Applicant: Sony Corporation
    Inventors: Hiroto Kawaguchi, Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
  • Patent number: 9811226
    Abstract: There is provided a sensor device that includes a flexible first conductor layer and an electrode substrate. The electrode substrate includes a plurality of first electrode wires, a plurality of second electrode wires, capacity sensors being formed at capacitively coupled portions of the first and second electrode wires, and a flexible substrate that supports the first and second electrode wires. The sensor device also includes a first supporting body including a plurality of first structures that connect the first conductor layer and the electrode substrate.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: November 7, 2017
    Assignee: Sony Corporation
    Inventors: Takashi Itaya, Shogo Shinkai, Hiroto Kawaguchi, Fumihiko Iida, Hayato Hasegawa, Kei Tsukamoto, Takayuki Tanaka, Tomoko Katsuhara, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
  • Patent number: 9785006
    Abstract: An illumination unit of an embodiment of the present technology includes: an illumination optical system configured to generate illumination light; and a plurality of lenses configured to reduce a divergence angle of the illumination light. The illumination optical system includes: a light source (20) configured to apply light onto an end surface of one of a first substrate and a second substrate; and a light modulation layer (30) provided in a gap between the first substrate and the second substrate. The illumination optical system includes an electrode configured to generate an electric filed that generates, in the light modulation layer (30), a plurality of linear scattering regions (30B) in a three-dimensional mode, and to generate an electric field that generates, in the light modulation layer, a planar scattering region in a two-dimensional display mode.
    Type: Grant
    Filed: July 25, 2013
    Date of Patent: October 10, 2017
    Assignee: Sony Corporation
    Inventors: Shogo Shinkai, Akira Ebisui
  • Patent number: 9785297
    Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: October 10, 2017
    Assignee: Sony Corporation
    Inventors: Hiroto Kawaguchi, Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
  • Patent number: 9760183
    Abstract: An input apparatus including a deformable sheet-like operational member having a plurality of key areas.
    Type: Grant
    Filed: December 16, 2013
    Date of Patent: September 12, 2017
    Assignee: Sony Corporation
    Inventors: Hiroto Kawaguchi, Tetsuro Goto, Toshio Kano, Hideo Tanaka, Hayato Hasegawa, Takashi Itaya, Takayuki Tanaka, Fumihiko Iida, Tomoaki Suzuki, Taizo Nishimura, Yuji Takahashi, Yasushi Itoshiro, Shogo Shinkai
  • Patent number: 9733500
    Abstract: An illumination unit includes a light modulation layer including a first region and a second region that have optical anisotropy and different responsiveness to an electric field. The light modulation layer satisfies an expression A/B<A1/B1 when the light modulation layer exhibits the scattering characteristics.
    Type: Grant
    Filed: May 13, 2013
    Date of Patent: August 15, 2017
    Assignee: Sony Corporation
    Inventors: Akira Ebisui, Harumi Sato, Kentaro Okuyama, Shogo Shinkai
  • Publication number: 20170115792
    Abstract: A sensor panel includes a sensor section that detects magnetic force of a contacting surface or a region in the vicinity of the contacting surface on a basis of a change in capacitance and is allowed to output a signal depending on the change in capacitance along with information on a position where the change in capacitance has occurred.
    Type: Application
    Filed: April 15, 2015
    Publication date: April 27, 2017
    Inventors: TAIZO NISHIMURA, HIROTO KAWAGUCHI, HIROSHI MIZUNO, SHOGO SHINKAI, FUMIHIKO IIDA, AKIRA EBISUI, KEI TSUKAMOTO, TOMOKO KATSUHARA
  • Patent number: 9632637
    Abstract: A sensor device includes: a first sensor including a first electrode board including a plurality of first capacitive elements arranged in a matrix, a first conductor layer facing the first electrode board, a first support layer arranged between the first electrode board and the first conductor layer, the first support layer being deformable, and a first operation input surface provided on the first electrode board or the first conductor layer, the first electrode board and/or the first conductor layer being flexible; and a second sensor layered on the first sensor, the second sensor including a second electrode board including a plurality of second capacitive elements, a second conductor layer facing the second electrode board, and a second support layer arranged between the second electrode board and the second conductor layer, the second support layer being deformable, the second electrode board and/or the second conductor layer being flexible.
    Type: Grant
    Filed: August 19, 2014
    Date of Patent: April 25, 2017
    Assignee: Sony Corporation
    Inventors: Shogo Shinkai, Hayato Hasegawa, Hiroto Kawaguchi, Tomoko Katsuhara, Fumihiko Iida, Kei Tsukamoto, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
  • Patent number: 9618790
    Abstract: An illumination unit includes: a light modulation layer disposed in a gap between a first transparent substrate and a second transparent substrate, and exhibiting a scattering property or transparency with respect to light from a light source, depending on magnitude of an electric field; and an electrode generating an electric field in the light modulation layer, when a voltage is applied thereto, in which the light modulation layer generates a plurality of strip-like illumination light beams extending in a direction intersecting with a first end surface of the first or second transparent substrate with use of light from the light source, when an electric field for a three-dimensional display mode is applied from the electrode to the light modulation layer, and a light emission area per unit area of each of the strip-like illumination light beams varies with a distance from the light source.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: April 11, 2017
    Assignee: Sony Corporation
    Inventors: Shogo Shinkai, Kentaro Okuyama, Akira Ebisui, Harumi Sato
  • Patent number: 9581749
    Abstract: In a scan system, a lighting unit, a display, and a three-dimensional display that have all of high luminance, low power consumption, and high reliability of a circuit board are provided. A light modulation device bonded to a light guide plate is provided with a light modulation layer exhibiting scattering property or transparency to light propagating through the light guide plate. The light modulation layer is interposed between a lower electrode that is configured of a plurality of partial electrodes extending in a direction parallel to a light incident surface and a sheet-like upper electrode. A drive circuit sequentially drives the plurality of partial electrodes to scan a region exhibiting the scattering property of the light modulation layer in a direction orthogonal to the light incident surface.
    Type: Grant
    Filed: December 8, 2011
    Date of Patent: February 28, 2017
    Assignee: Sony Corporation
    Inventors: Kentaro Okuyama, Makoto Shinoda, Shinpei Nagatani, Yuji Takahashi, Tomoaki Suzuki, Shogo Shinkai, Akira Ebisui, Taizo Nishimura