Patents by Inventor Shohei IDA

Shohei IDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10391555
    Abstract: Silver nanowires having a thin and long shape that exhibit excellent dispersibility in an aqueous solvent having an alcohol added thereto are provided by silver nanowires having an average diameter of 50 nm or less and an average length of 10 ?m or more, covered with a copolymer of a maleimide-based monomer and vinylpyrrolidone. The silver nanowires can be produced by a method for producing silver nanowires, containing reductively depositing silver in a wire form in an alcohol solvent having dissolved therein a silver compound, the deposition being performed in the solvent having dissolved therein a copolymer of a maleimide-based monomer and vinylpyrrolidone.
    Type: Grant
    Filed: January 14, 2016
    Date of Patent: August 27, 2019
    Assignees: THE UNIVERSITY OF SHIGA PREFECTURE, DOWA HOLDINGS CO., LTD.
    Inventors: Shohei Ida, Yoshitsugu Hirokawa, Jeyadevan Balachandran, Jhon Lehman Cuya Huaman, Kimitaka Sato
  • Publication number: 20180272424
    Abstract: Silver nanowires having a thin and long shape that exhibit excellent dispersibility in an aqueous solvent having an alcohol added thereto are provided by silver nanowires having an average diameter of 50 nm or less and an average length of 10 ?m or more, covered with a copolymer of a maleimide-based monomer and vinylpyrrolidone. The silver nanowires can be produced by a method for producing silver nanowires, containing reductively depositing silver in a wire form in an alcohol solvent having dissolved therein a silver compound, the deposition being performed in the solvent having dissolved therein a copolymer of a maleimide-based monomer and vinylpyrrolidone.
    Type: Application
    Filed: January 14, 2016
    Publication date: September 27, 2018
    Inventors: Shohei IDA, Yoshitsugu HIROKAWA, Jeyadevan BALACHANDRAN, Jhon Lehman Cuya HUAMAN, Kimitaka SATO