Patents by Inventor Shohei Sanada

Shohei Sanada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FLUX RESIN COMPOSITION, ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT, MOUNTING STRUCTURE, AND METHOD FOR MANUFACTURING THE MOUNTING STRUCTURE
    Publication number: 20230141042
    Abstract: A flux resin composition includes an epoxy resin, an imidazole compound, a thixo agent, and an activator. The epoxy resin includes at least one resin selected from the group consisting of naphthalene epoxy resins, biphenyl aralkyl epoxy resins, trisphenol methane epoxy resins, biphenyl epoxy resins, and dicyclopentadiene epoxy resins. The content of the at least one resin is equal to or greater than 20% by weight with respect to a total weight of the epoxy resin.
    Type: Application
    Filed: March 3, 2021
    Publication date: May 11, 2023
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Shohei SANADA, Shigeru YAMATSU
  • FLUX RESIN COMPOSITION, ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT, MOUNTING STRUCTURE, AND METHOD FOR MANUFACTURING THE MOUNTING STRUCTURE
    Publication number: 20220195177
    Abstract: A flux resin composition contains: 60-80% by weight of an epoxy resin; 0.01-2% by weight of an imidazole compound; 1-5% by weight of a thixo agent; 4-20% by weight of an activator; and 7-30% by weight of a phenolic compound. The epoxy resin contains at least one resin selected from the group consisting of naphthalene type epoxy resins, biphenyl aralkyl type epoxy resins, trisphenol methane type epoxy resins, biphenyl type epoxy resins, and dicyclopentadiene type epoxy resins. Content of the at least one resin falls within a range from 15% by weight to 40% by weight with respect to a total weight of the flux resin composition. The phenolic resin is liquid and contains a phenol novolac.
    Type: Application
    Filed: December 15, 2021
    Publication date: June 23, 2022
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Shohei SANADA, Shigeru YAMATSU
  • Addition-curable silicone resin composition, addition-curable silicone resin cured product, and sealed optical semiconductor element
    Patent number: 9783717
    Abstract: The invention aims to provide an addition curable silicone resin composition with excellent interfacial adhesion properties, storage stability and transparency. The addition curable silicone resin mixtures has a refractive index of 1.35 to 1.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: October 10, 2017
    Assignee: Sumitomo Seika Chemicals Co., Ltd.
    Inventors: Noriaki Fukuda, Shohei Sanada, Katsumasa Yamamoto
  • ADDITION-CURABLE SILICONE RESIN COMPOSITION, ADDITION-CURABLE SILICONE RESIN CURED PRODUCT, AND SEALED OPTICAL SEMICONDUCTOR ELEMENT
    Publication number: 20160194537
    Abstract: The present invention aims to provide an addition-curable silicone resin composition with excellent interfacial adhesion properties, storage stability, and transparency. The present invention also aims to provide an addition-curable silicone resin cured product formed from the addition-curable silicone resin composition and a sealed optical semiconductor element formed by using the addition-curable silicone resin composition. The present invention is an addition-curable silicone resin composition including: an addition-curable silicone resin mixture; and an adhesion-imparting agent, the addition-curable silicone resin mixture having a refractive index of 1.35 to 1.45, the adhesion-imparting agent including a compound that includes a structural unit represented by the formula (1-3) and/or a structural unit represented by the formula (1-4) between a structural unit represented by the formula (1-1) and a structural unit represented by the formula (1-2), the compound having a refractive index of 1.35 to 1.
    Type: Application
    Filed: June 27, 2014
    Publication date: July 7, 2016
    Inventors: Noriaki FUKUDA, Shohei SANADA, Katsumasa YAMAMOTO
  • Silicone resin composition, cured silicone resin, and sealed optical semiconductor element
    Patent number: 9181400
    Abstract: The present invention provides a silicone resin composition having excellent adhesion. The present invention also aims to provide a cured silicone resin and a sealed optical semiconductor element each produced using the silicone resin composition.
    Type: Grant
    Filed: October 16, 2013
    Date of Patent: November 10, 2015
    Assignee: Sumitomo Seika Chemicals Co., Ltd.
    Inventors: Noriaki Fukuda, Shohei Sanada, Katsumasa Yamamoto
  • SILICONE RESIN COMPOSITION, CURED SILICONE RESIN, AND SEALED OPTICAL SEMICONDUCTOR ELEMENT
    Publication number: 20150284515
    Abstract: The present invention provides a silicone resin composition having excellent adhesion. The present invention also aims to provide a cured silicone resin and a sealed optical semiconductor element each produced using the silicone resin composition.
    Type: Application
    Filed: October 16, 2013
    Publication date: October 8, 2015
    Inventors: Noriaki Fukuda, Shohei Sanada, Katsumasa Yamamoto