Patents by Inventor Shoichi Koshikawa

Shoichi Koshikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CONNECTION DEVICE
    Publication number: 20240106144
    Abstract: A connection device (10) includes a flexible substrate (200), a coaxial connector (300) overlapping with the flexible substrate (200), and a jig (400) fixing the flexible substrate (200) and the coaxial connector (300).
    Type: Application
    Filed: February 3, 2022
    Publication date: March 28, 2024
    Applicant: YOKOWO CO., LTD.
    Inventors: Takahiro NAKAMURA, Yasushi SHIRAKATA, Shoichi KOSHIKAWA
  • Semiconductor packaging container, semiconductor device, electronic device
    Patent number: 9041169
    Abstract: A semiconductor packaging container allowing to use in millimeter band is provided at a low cost. The inner SIG pads and the inner GND pads, capable of a direct connection with a signal terminal of a semiconductor chip 10 are provided on the bottomed cylindrical dielectric case formed of the liquid crystal polymer. Further, the external SIG pads integrally formed with the inner SIG pads 201, 202 and the external GND pad 303 integrally formed with the inner GND pad are provided on the back of the bottom surface of the dielectric case as the external terminal. The inner GND pads and are to form the coplanar waveguide with the inner SIG pads and. Also, the inner GND pads and are to add capacitive reactance for canceling the inductance caused by the space at the semiconductor chip portion to the coplanar waveguide.
    Type: Grant
    Filed: May 27, 2014
    Date of Patent: May 26, 2015
    Assignee: YOKOWO CO., LTD.
    Inventors: Shoichi Koshikawa, Junichiro Nikaido, Shintaro Takase, Yoshio Aoki
  • Semiconductor packaging container, Semiconductor device, Electronic device
    Publication number: 20140353811
    Abstract: A semiconductor packaging container allowing to use in millimeter band is provided at a low cost. The inner SIG pads and the inner GND pads, capable of a direct connection with a signal terminal of a semiconductor chip 10 are provided on the bottomed cylindrical dielectric case formed of the liquid crystal polymer. Further, the external SIG pads integrally formed with the inner SIG pads 201, 202 and the external GND pad 303 integrally formed with the inner GND pad are provided on the back of the bottom surface of the dielectric case as the external terminal. The inner GND pads and are to form the coplanar waveguide with the inner SIG pads and. Also, the inner GND pads and are to add capacitive reactance for canceling the inductance caused by the space at the semiconductor chip portion to the coplanar waveguide.
    Type: Application
    Filed: May 27, 2014
    Publication date: December 4, 2014
    Applicant: YOKOWO CO., LTD.
    Inventors: Shoichi Koshikawa, Junichiro Nikaido, Shintaro Takase, Yoshio Aoki