Abstract: A light emitting apparatus includes: a package substrate that includes a recess that opens on a top surface of the package substrate; a light emitting device housed in the recess; a window member provided to cover an opening of the recess; and a metal bonding part that seals a space between the package substrate and the window member. The package substrate includes a packaging surface on which the light emitting device is mounted and a metal electrode is provided, an isolation surface provided in a shape of a frame on an outer side of the packaging surface, and a light reflection surface sloping from the isolation surface toward the top surface, and a metal layer is provided on the light reflection surface with a clearance from the isolation surface.

Abstract: An optical semiconductor apparatus includes: an optical semiconductor device including a translucent support substrate; a buffer layer on the support substrate, a seal ring in a frame shape provided in an outer region on the buffer layer, an active layer provided on an inner region of the buffer layer, and an electrode provided on the active layer. The optical semiconductor apparatus further including: a package substrate on which the optical semiconductor device is mounted; and a sealing part that seals a space between the seal ring and the package substrate.

Abstract: A semiconductor light-emitting device includes a substrate on which a semiconductor light-emitting element is mounted, the substrate having a first coefficient of thermal expansion, a lid member that covers the semiconductor light-emitting element, the lid member having a second coefficient of thermal expansion smaller than the first coefficient of thermal expansion, and a joining member that joins the lid member to the substrate to seal the semiconductor light-emitting element. The joining member includes a eutectic alloy solder.

Abstract: A fluid sterilization device includes: a processing flow passage in which a fluid subject to sterilization flows; a window member provided between a light source for irradiating the fluid in the processing flow passage with ultraviolet light and the processing flow passage, the window member including an incidence surface on which the ultraviolet light from the light source is incident and an exit surface from which the ultraviolet light exits toward the processing flow passage; and a heating body provided to be in contact with the incidence surface and adapted to heat the window member.

Abstract: A method of manufacturing an optical semiconductor apparatus includes: placing a light transmissive lid body on a package substrate adapted to house an optical semiconductor device in an atmosphere of a first gas containing oxygen (O2), sandwiching a bonding member containing gold-tin (AuSn); exchanging an atmosphere gas for a second gas so as to reduce an oxygen concentration in the atmosphere while a load is exerted from above the lid body placed on the package substrate for temporary sealing; and heating and melting the bonding member after an exchange for the second gas is started so as to bond the package substrate and the lid body.

Abstract: An optical semiconductor apparatus includes: an optical semiconductor device including a translucent support substrate; a buffer layer on the support substrate, a seal ring in a frame shape provided in an outer region on the buffer layer, an active layer provided on an inner region of the buffer layer, and an electrode provided on the active layer. The optical semiconductor apparatus further including: a package substrate on which the optical semiconductor device is mounted; and a sealing part that seals a space between the seal ring and the package substrate.

Abstract: A fluid sterilization device includes: a processing flow passage in which a fluid subject to sterilization flows; a window member provided between a light source for irradiating the fluid in the processing flow passage with ultraviolet light and the processing flow passage, the window member including an incidence surface on which the ultraviolet light from the light source is incident and an exit surface from which the ultraviolet light exits toward the processing flow passage; and a heating body provided to be in contact with the incidence surface and adapted to heat the window member.

Abstract: A semiconductor light-emitting device includes a substrate on which a semiconductor light-emitting element is mounted, the substrate having a first coefficient of thermal expansion, a lid member that covers the semiconductor light-emitting element, the lid member having a second coefficient of thermal expansion smaller than the first coefficient of thermal expansion, and a joining member that joins the lid member to the substrate to seal the semiconductor light-emitting element. The joining member includes a eutectic alloy solder.

Abstract: A test device includes: a support that supports a light emitting device subject to a test; a light waveguide that guides light output from the light emitting device supported by the support; a light diffuser plate that diffuses light output from the light waveguide; and a light receiving device that receives light diffused by the light diffuser plate. The test device may further include a constant-temperature device that houses the support and the light emitting device supported by the support and control a temperature of the light emitting device. The light receiving device may be provided outside the constant-temperature device, and the light waveguide may guide light from inside the constant-temperature device to a space outside the constant-temperature device.

Abstract: A light emitting apparatus includes: a package substrate that includes a recess that opens on a top surface of the package substrate; a light emitting device housed in the recess; a window member provided to cover an opening of the recess; and a metal bonding part that seals a space between the package substrate and the window member. The package substrate includes a packaging surface on which the light emitting device is mounted and a metal electrode is provided, an isolation surface provided in a shape of a frame on an outer side of the packaging surface, and a light reflection surface sloping from the isolation surface toward the top surface, and a metal layer is provided on the light reflection surface with a clearance from the isolation surface.

Abstract: A method of manufacturing an optical semiconductor apparatus includes: placing a light transmissive lid body on a package substrate adapted to house an optical semiconductor device in an atmosphere of a first gas containing oxygen (O2), sandwiching a bonding member containing gold-tin (AuSn); exchanging an atmosphere gas for a second gas so as to reduce an oxygen concentration in the atmosphere while a load is exerted from above the lid body placed on the package substrate for temporary sealing; and heating and melting the bonding member after an exchange for the second gas is started so as to bond the package substrate and the lid body.

Abstract: Disclosed is a method for producing a semiconductor device in which solder joints are made between a semiconductor chip with bumps and a substrate with electrodes corresponding to the bumps through a thermosetting adhesive layer, the method including the successive steps of: (A) forming a thermosetting adhesive layer in advance on a surface including bumps of the semiconductor chip; (B) laying a surface on the thermosetting adhesive layer side of the semiconductor chip, on which the thermosetting adhesive layer is formed, and a substrate one upon another, followed by pre-bonding using a heat tool to obtain a pre-bonded laminate; and (C) interposing a protective film having a thermal conductivity of 100 W/mK or more between the heat tool and a surface on the semiconductor chip side of the pre-bonded laminate, melting a solder between the semiconductor chips and the substrate and simultaneously curing the thermosetting adhesive layer using the heat tool.

Abstract: Disclosed is a process which comprises bringing an acidic organic substance or phosphoric acid into contact with a metal to form, on the surface of the metal, a layer that contains either an organic acid salt formed from both the acidic organic substance and the metal or a phosphoric acid salt formed from both the phosphoric acid and the metal. In the process, the layer can be selectively formed only on the surface of the metal. When the process is applied to the production of core-shell particles, neither agglomeration of the particles nor viscosity increase of the fluid occurs, while when the process is applied to the production of a covered metal-wiring circuit board, the layer can be selectively formed only in the metal area to be covered.