Abstract: A tire having high on-ice starting performance, the tire is provided with a plurality of circumferential direction grooves formed on a tread of the tire and extending in a tire circumferential direction, a plurality of width direction grooves extending in a direction intersecting the tire circumferential direction, a plurality of blocks demarcated by the circumferential direction grooves and the width direction grooves, and a plurality of width direction sipes formed on surfaces of the blocks and extending in the direction intersecting the tire circumferential direction, in which a distance P between the sipes 18z is set in a range of 4-12 mm.

Abstract: A collision prevention device of a measurer measuring dimensions or the like of a measured object while relatively displacing the measured object and a non-contact probe. The collision prevention device includes a pole-shaped spindle extending alongside the non-contact probe; a support mechanism supporting the spindle such that a forefront end of the spindle projects farther than the non-contact probe; and a switch detecting a collision between the spindle and the measured object.

Abstract: A collision prevention device of a measurer measuring dimensions or the like of a measured object while relatively displacing the measured object and a non-contact probe. The collision prevention device includes a pole-shaped spindle extending alongside the non-contact probe; a support mechanism supporting the spindle such that a forefront end of the spindle projects farther than the non-contact probe; and a switch detecting a collision between the spindle and the measured object.

Abstract: A semiconductor device includes: an insulating base; a semiconductor element provided on the insulating base; a protector provided on the semiconductor element; and a frame provided on a periphery of the insulating base and surrounding the semiconductor element. A region inside the frame is filled with a sealing resin, and at least one groove is provided in an upper corner portion of the frame on the semiconductor element side of the frame.

Abstract: A laser processing apparatus is provided with a first laser oscillator for laser CVD and a second laser oscillator for laser repair in a laser oscillation section. Either one of the first or second laser beam is irradiated by switching the first and second laser oscillators by a laser oscillator switch portion of a main body section. An optical path forming member is disposed such that the first or second laser beam, whichever is irradiated, will take the same optical path and reach a sample, after passing a common slit, to perform laser processing on the sample. Further, an objective lens is configured to be switched to an objective lens having a magnification corresponding to a wavelength of the laser beam irradiated from the laser oscillation section by an objective lens switch section of an objective lens section.

Abstract: A semiconductor device includes: an insulating base; a semiconductor element provided on the insulating base; a protector provided on the semiconductor element; and a frame provided on a periphery of the insulating base and surrounding the semiconductor element. A region inside the frame is filled with a sealing resin, and at least one groove is provided in an upper corner portion of the frame on the semiconductor element side of the frame.

Abstract: The electronic component tester includes: a socket configured to supply power to connection terminals for operating an electronic component; an electronic component mount member on which the electronic component is to be mounted; and a temperature adjusting member which is configured to come into contact with the electronic component mount member to keep the electronic component at a predetermined temperature. The electronic component mount member includes a heat transfer plate on which the electronic component is to be mounted and which is configured to come into contact with the temperature adjusting member, and an electronic component cover for covering the electronic component. The heat transfer plate includes through holes.

Abstract: A semiconductor device includes: an insulating base; a semiconductor element provided on the insulating base; a protector provided on the semiconductor element; and a frame provided on a periphery of the insulating base and surrounding the semiconductor element. A region inside the frame is filled with a sealing resin, and at least one groove is provided in an upper corner portion of the frame on the semiconductor element side of the frame.

Abstract: The electronic component tester includes: a socket configured to supply power to connection terminals for operating an electronic component; an electronic component mount member on which the electronic component is to be mounted; and a temperature adjusting member which is configured to come into contact with the electronic component mount member to keep the electronic component at a predetermined temperature. The electronic component mount member includes a heat transfer plate on which the electronic component is to be mounted and which is configured to come into contact with the temperature adjusting member, and an electronic component cover for covering the electronic component. The heat transfer plate includes through holes.

Abstract: A tabular form element arrangement data describing the arrangement of various component elements constituting a production system along the work flow in a combination of process identification names with component element names, is prepared. Element definition files describing programs for simulating the operations of various component elements are prepared. A program preparation unit sequentially reads component element names combined with process identification names from the element arrangement data and sequentially reads the element definition files corresponding to the read component element names. A variable array containing variables described in respective element definition files is prepared simultaneously along with an initial process program array containing programs described in respective definition files and a simulation program array.

Abstract: A laser processing apparatus is provided with a first laser oscillator for laser CVD and a second laser oscillator for laser repair in a laser oscillation section. Either one of the first or second laser beam is irradiated by switching the first and second laser oscillators by a laser oscillator switch portion of a main body section. An optical path forming member is disposed such that the first or second laser beam, whichever is irradiated, will take the same optical path and reach a sample, after passing a common slit, to perform laser processing on the sample. Further, an objective lens is configured to be switched to an objective lens having a magnification corresponding to a wavelength of the laser beam irradiated from the laser oscillation section by an objective lens switch section of an objective lens section.

Abstract: A semiconductor device includes: an insulating base; a semiconductor element provided on the insulating base; a protector provided on the semiconductor element; and a frame provided on a periphery of the insulating base and surrounding the semiconductor element. A region inside the frame is filled with a sealing resin, and at least one groove is provided in an upper corner portion of the frame on the semiconductor element side of the frame.

Abstract: A high-power semiconductor laser chip 39 with a long cavity length is disposed on a side 42 of a Si chip 37 along the long side of a package, thereby reducing the thickness and size of a semiconductor device 30 for integrating the semiconductor laser chip 39 and a light-receiving element for signal processing. Further, by using the semiconductor device 30, it is possible to reduce the thickness and size of an optical pickup and the thickness and size of an optical disc drive using the optical pickup.

Abstract: The invention is to provide a surface-treated steel sheet of good white rust resistance with no chromium in its surface treatment film, and it has realized a surface-treated steel sheet of higher-level corrosion resistance by forming a reaction layer of plating metal with a barrier layer effective for anticorrosion not in a two-layered film but in a single-layered film.

Abstract: In a case where an intruder is detected in a house, a detection signal is outputted from a home security communication device, and is notified to a monitor center through an in-area communication management device by a wireless connection. The monitor center notifies a portable telephone owned by a resident of the house that the intruder exists in the house and also notifies houses to in the area that the intruder exists in the house.

Abstract: The invention is to provide a surface-treated steel sheet of good white rust resistance with no chromium in its surface treatment film, and it has realized a surface-treated steel sheet of higher-level corrosion resistance by forming a reaction layer of plating metal with a barrier layer effective for anticorrosion not in a two-layered film but in a single-layered film.

Abstract: The present invention provides a process for forming a matted multicolor pattern coating film having a 60 degree specular gloss of 10 or less by spray-coating and baking plural coating materials having different colors on a moving strip coated article, wherein the above respective coating materials are shrunk matted coating film-forming coating materials each comprising (A) a hydroxyl group-containing organic resin, (B) a low nuclidic methylated melamine resin, (C) a reaction mixture of 1 mole of a sulfonic acid compound and 1.

Abstract: The present invention provides a process for forming a matted multicolor pattern coating film having a 60 degree specular gloss of 10 or less by spray-coating and baking plural coating materials having different colors on a moving strip coated article, wherein the above respective coating materials are shrunk matted coating film-forming coating materials each comprising (A) a hydroxyl group-containing organic resin, (B) a low nuclidic methylated melamine resin, (C) a reaction mixture of 1 mole of a sulfonic acid compound and 1.

Abstract: The present invention relates to a coating composition containing 8 to 130 parts by weight of (B) silica fine particles having an oil absorption in the range of 30 to 200 ml/100 g and a pore volume in the range of 0.05 to 1.2 ml/g per 100 parts by weight of (A) a coating film-forming resin, a cured coating film formed from the coating composition having a glass transition temperature in the range of 40 to 125° C.; and a coated metal plate having a coating film formed from the above coating composition on the surface of a metal plate.

Abstract: In a case where an intruder is detected in a house, a detection signal is outputted from a home security communication device, and is notified to a monitor center through an in-area communication management device by a wireless connection. The monitor center notifies a portable telephone owned by a resident of the house that the intruder exists in the house and also notifies houses to in the area that the intruder exists in the house.