Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, and (III) biphenyl skeleton-containing epoxy resins, as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc.

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, and (III) biphenyl skeleton-containing epoxy resins, as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc.

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110° C. after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130° C.

Abstract: The present invention concerns a polarizer for visible light, comprising a polyvinyl alcohol-based polarizing element wherein not less than 60% of dichromophore is iodine, and a protective film. The said polarizing element has at least three absorption bands in an ultraviolet region of 210 nm to 400 nm and also has a UA value of not smaller than 4.0 which value represents ultraviolet absorption characteristics. Consequently, the polarizer of the invention possesses both superior polarization characteristics and high heat and humidity resistance. The polarizer of the invention having these characteristics is used for liquid crystal display and is suitable particularly for such uses as display in watches and electronic calculators, terminal dispaly in personal computers and word processor, picture display in portable television sets, and display in automobiles and aircraft.