Patents by Inventor Shoji Saito
Shoji Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11563380Abstract: A control unit (4) generates a control signal. A switching device (2) performs switching according to the control signal and generates a primary side input voltage from a supply voltage. A transformer (1) converts the primary side input voltage to a secondary side output voltage. A drive circuit (7) drives a power device (8) according to the secondary side output voltage. The control unit (4) includes a table listing a correspondence relationship between supply voltages and set values of control signals for obtaining a desired secondary side output voltage, refers to the table and generates the control signal having a set value corresponding to the supply voltage.Type: GrantFiled: May 15, 2018Date of Patent: January 24, 2023Assignee: Mitsubishi Electric CorporationInventors: Koichi Taguchi, Shoji Saito
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Publication number: 20220359325Abstract: In a semiconductor device, a frame includes a first frame portion extending in a direction parallel to a connection surface to be connected to the connection surface and a second frame portion connecting a case and the first frame portion. The first frame portions are divided into a plurality of divided portions. At least one divided portion in the plurality of divided portions in the first frame portions is an elastic portion which can be elastically deformed from a first state where a tip end portion is inclined to be located on a lower side of the connection surface to a second state where the tip end portion extends in a direction parallel to the connection surface. The divided portion as the elastic portion is connected to the connection surface while being elastically deformed from the first state to the second state.Type: ApplicationFiled: February 7, 2020Publication date: November 10, 2022Applicant: Mitsubishi Electric CorporationInventors: Takuya SHIRATSURU, Shoji SAITO, Katsuhiko KONDO
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Publication number: 20220249561Abstract: The present invention is intended to develop a chimeric antigen receptor (CAR) that is effective against solid tumor expressing anaplastic lymphoma kinase (ALK). The present invention provides a polynucleotide encoding a CAR protein comprising a target binding domain binding to an extracellular ligand binding region of ALK, a transmembrane domain, and an intracellular signaling domain. The target binding domain of the polynucleotide is selected from among FAM150A, FAM150B, and fragments thereof binding to the extracellular ligand binding region of ALK. The present invention also provides a genetically modified cell comprising the polynucleotide introduced thereinto.Type: ApplicationFiled: May 29, 2020Publication date: August 11, 2022Applicant: SHINSHU UNIVERSITYInventors: Yozo Nakazawa, Shoji Saito, Shigeki Yagyu, Shigeru Nakano, Takaki Momose, Kenta Hitomi
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Patent number: 11352588Abstract: Provided is a musk-like composition that is excellent in harmony with various other fragrances and that can create a distinctive fragrance effect when blended. The composition includes a compound represented by General Formula (I). The ratio of an E-isomer of the compound represented by General Formula (I) to a Z-isomer of the compound represented by General Formula (I) is E-isomer/Z-isomer=3/7 or more and 7/3 or less.Type: GrantFiled: April 2, 2019Date of Patent: June 7, 2022Assignee: Kao CorporationInventors: Yuki Nakazawa, Shoji Saito, Misato Sawaguchi
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Publication number: 20220047517Abstract: According to one embodiment, a composition is for delivering an objective substance to the T-cell malignant tumor cell. The composition contains a substance delivery carrier. The substance delivery carrier has a lipid particle, and the objective substance encapsulated in the lipid particle. The lipid particle contains, as constituents thereof, at least a first lipid represented by formula (I) and a second lipid represented by formula (II).Type: ApplicationFiled: September 10, 2021Publication date: February 17, 2022Applicants: SHINSHU UNIVERSITY, KABUSHIKI KAISHA TOSHIBAInventors: Mitsuko ISHIHARA, Eiichi AKAHOSHI, Yozo NAKAZAWA, Shoji SAITO
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Patent number: 11232991Abstract: A semiconductor apparatus includes a metal base plate, an upper surface ceramic substrate provided on an upper surface of the metal base plate, a semiconductor device provided on the upper surface ceramic substrate, and a substrate that is provided in the metal base plate and includes an embedded ceramic substrate, an upper surface metal pattern provided on an upper surface of the embedded ceramic substrate, and a lower surface metal pattern provided on a lower surface of the embedded ceramic substrate, wherein a thermal conductivity of the upper surface metal pattern and a thermal conductivity of the lower surface metal pattern are larger than a thermal conductivity of the metal base plate.Type: GrantFiled: February 23, 2017Date of Patent: January 25, 2022Assignee: Mitsubishi Electric CorporationInventors: Shoji Saito, Seiichiro Inokuchi
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Publication number: 20210347669Abstract: The volatilization suppressing component according to the present disclosure has a metallic base material; and a laminated film having at least a first layer formed on a portion or the entirety of a surface of the metallic base material, and a second layer formed on the first layer, wherein the first layer is an adhesive layer between the metallic base material and the second layer, and the second layer is a protective layer for the first layer.Type: ApplicationFiled: September 27, 2019Publication date: November 11, 2021Inventors: Shoji SAITO, Tomoaki MIYAZAWA, Tomohiro MARUKO, Yuichi IWAMOTO, Atsushi ITO
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Publication number: 20210163845Abstract: Provided is a musk-like composition that is excellent in harmony with various other fragrances and that can create a distinctive fragrance effect when blended. The composition includes a compound represented by General Formula (I). The ratio of an E-isomer of the compound represented by General Formula (I) to a Z-isomer of the compound represented by General Formula (I) is E-isomer/Z-isomer=3/7 or more and 7/3 or less.Type: ApplicationFiled: April 2, 2019Publication date: June 3, 2021Applicant: Kao CorporationInventors: Yuki NAKAZAWA, Shoji SAITO, Misato SAWAGUCHI
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Patent number: 10989607Abstract: A thermocouple capable of preventing a decrease in strength of a temperature measuring junction portion while maintaining temperature responsiveness and productivity in comparison with a conventional thermocouple. A thermocouple including two wires and a clamping member, the clamping member clamping the two wires while distal end portions of the wires being in contact with each other in parallel to provide a temperature measuring junction portion, in which when it is assumed that diameters of the two wires are d1 and d2 (where d1?d2) respectively; a length of the temperature measuring junction portion in a longitudinal direction of the two wires is L; a maximum width of the temperature measuring junction portion in a parallel direction of the two wires is D; and a maximum width in a direction orthogonal to the parallel direction in a cross section of the temperature measuring junction portion is E, the following equations are satisfied: 0.Type: GrantFiled: November 4, 2016Date of Patent: April 27, 2021Assignee: FURUYA METAL CO., LTD.Inventors: Tomohiro Maruko, Tomoaki Miyazawa, Shoji Saito, Yuya Okawa, Kensuke Morita, Yoshiteru Arai
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Patent number: 10966348Abstract: An object is to provide a semiconductor cooling device which optimally keeps the mixing amount of microbubbles in the refrigerant and prevents the reduction of the cooling effect of the semiconductor module. The semiconductor cooling device includes a refrigerant circulation path through which refrigerant circulates, a heat exchanger provided on the refrigerant circulation path on which a semiconductor module is installable and configured to exchange heat between the refrigerant and the semiconductor module, a microbubble generator provided on the refrigerant circulation path, and configured to generate microbubbles in the refrigerant, a controller configured to control the microbubble generator, and a refrigerant sensor configured to measure a temperature, a flow rate, a flow velocity, or a pressure of the refrigerant circulating in the refrigerant circulation path.Type: GrantFiled: April 4, 2017Date of Patent: March 30, 2021Assignee: Mitsubishi Electric CorporationInventors: Koichi Ushijima, Shoji Saito
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Publication number: 20200358362Abstract: A control unit (4) generates a control signal. A switching device (2) performs switching according to the control signal and generates a primary side input voltage from a supply voltage. A transformer (1) converts the primary side input voltage to a secondary side output voltage. A drive circuit (7) drives a power device (8) according to the secondary side output voltage. The control unit (4) includes a table listing a correspondence relationship between supply voltages and set values of control signals for obtaining a desired secondary side output voltage, refers to the table and generates the control signal having a set value corresponding to the supply voltage.Type: ApplicationFiled: May 15, 2018Publication date: November 12, 2020Applicant: Mitsubishi Electric CorporationInventors: Koichi TAGUCHI, Shoji SAITO
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Patent number: 10734990Abstract: A current detection circuit (4) detects a device current flowing in the semiconductor device (1). A voltage detection circuit (5) detects a device voltage applied to the semiconductor device (1). A temperature calculation device (6) has a table collecting device temperatures of the semiconductor device (1) respectively corresponding to plural collector currents and plural collector voltages, and reads out a device temperature corresponding to the device current detected by the current detection circuit (4) and the device voltage detected by the voltage detection circuit (5) from the table.Type: GrantFiled: January 8, 2016Date of Patent: August 4, 2020Assignee: Mitsubishi Electric CorporationInventors: Hideo Komo, Shoji Saito, Takeshi Omaru
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Publication number: 20200243419Abstract: An object is to provide a semiconductor cooling device which optimally keeps the mixing amount of microbubbles in the refrigerant and prevents the reduction of the cooling effect of the semiconductor module. The semiconductor cooling device includes a refrigerant circulation path through which refrigerant circulates, a heat exchanger provided on the refrigerant circulation path on which a semiconductor module is installable and configured to exchange heat between the refrigerant and the semiconductor module, a microbubble generator provided on the refrigerant circulation path, and configured to generate microbubbles in the refrigerant, a controller configured to control the microbubble generator, and a refrigerant sensor configured to measure a temperature, a flow rate, a flow velocity, or a pressure of the refrigerant circulating the refrigerant circulation path.Type: ApplicationFiled: April 4, 2017Publication date: July 30, 2020Applicant: Mitsubishi Electric CorporationInventors: Koichi USHIJIMA, Shoji SAITO
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Patent number: 10682792Abstract: The mold device according to the present invention is a mold device to resin-seal the semiconductor device including an insert electrode, and in the semiconductor device, the insert electrode is provided with an insert hole, a nut having a screw hole is disposed in the insert electrode so that the insert hole and the screw hole communicate with each other, the mold device includes a mold body into which resin is injected to resin-seal the semiconductor device, including a side of the insert electrode where the nut is disposed, and a rod-like member that is inserted into the insert hole, and the rod-like member is inserted into the screw hole of the nut through the insert hole of the insert electrode to draw the nut to the side of the insert electrode.Type: GrantFiled: July 30, 2015Date of Patent: June 16, 2020Assignee: Mitsubishi Electric CorporationInventors: Takatoshi Yasui, Yuki Hata, Shoji Saito, Katsuji Ando, Korehide Okamoto, Ryoji Murai
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Publication number: 20190371688Abstract: A semiconductor apparatus includes a metal base plate, an upper surface ceramic substrate provided on an upper surface of the metal base plate, a semiconductor device provided on the upper surface ceramic substrate, and a substrate that is provided in the metal base plate and includes an embedded ceramic substrate, an upper surface metal pattern provided on an upper surface of the embedded ceramic substrate, and a lower surface metal pattern provided on a lower surface of the embedded ceramic substrate, wherein a thermal conductivity of the upper surface metal pattern and a thermal conductivity of the lower surface metal pattern are larger than a thermal conductivity of the metal base plate.Type: ApplicationFiled: February 23, 2017Publication date: December 5, 2019Applicant: Mitsubishi Electric CorporationInventors: Shoji SAITO, Seiichiro INOKUCHI
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Publication number: 20190271600Abstract: A thermocouple capable of preventing a decrease in strength of a temperature measuring junction portion while maintaining temperature responsiveness and productivity in comparison with a conventional thermocouple. A thermocouple including two wires and a clamping member, the clamping member clamping the two wires while distal end portions of the wires being in contact with each other in parallel to provide a temperature measuring junction portion, in which when it is assumed that diameters of the two wires are d1 and d2 (where d1?d2) respectively; a length of the temperature measuring junction portion in a longitudinal direction of the two wires is L; a maximum width of the temperature measuring junction portion in a parallel direction of the two wires is D; and a maximum width in a direction orthogonal to the parallel direction in a cross section of the temperature measuring junction portion is E, the following equations are satisfied: 0.Type: ApplicationFiled: November 4, 2016Publication date: September 5, 2019Inventors: Tomohiro MARUKO, Tomoaki MIYAZAWA, Shoji SAITO, Yuya OKAWA, Kensuke MORITA, Yoshiteru ARAI
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Patent number: 10297430Abstract: Method of producing a target having a small average crystal grain size of gold or platinum and having a uniform crystal grain size in an in-plane direction of a target surface and a thickness direction of the target in order to further stabilize film deposition characteristics during sputtering.Type: GrantFiled: January 20, 2015Date of Patent: May 21, 2019Assignee: FURUYA METAL CO., LTD.Inventors: Tomohiro Maruko, Yu Suzuki, Shoji Saito, Amiko Ito, Yusuke Takaishi, Nobuo Kikuchi, Daishi Kaneko, Eiji Matsumoto
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Patent number: 10281337Abstract: A thermocouple that can stably perform direct temperature measurement under a high temperature environment (1500° C. or higher but 2300° C. or lower) and a manufacturing method for the same. A thermocouple according to a first embodiment is a thermocouple including at least a protective tube and element wires, the protective tube and the element wires are insulated from one another by an insulator, and the insulator is either one or both of a powder and a compact, and is composed of at least one of a zirconium oxide, a hafnium oxide, or a composite oxide of zirconium and hafnium.Type: GrantFiled: September 19, 2014Date of Patent: May 7, 2019Assignee: FURUYA METAL CO., LTD.Inventors: Tomohiro Maruko, Tomoaki Miyazawa, Atsushi Ito, Shoji Saito, Yasuhiro Sato
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Patent number: 10113217Abstract: A platinum wire in which crystal grain growth is slowed in order to prevent damage caused by creep without dispersing a metal oxide, and occurrence of slip at crystal grain boundaries is slowed. A platinum thermocouple wire that is used in a negative electrode of a platinum-based thermocouple and has a nitrogen mass concentration of 10 to 100 ppm, and when structure observation of the cross section of the wire in a longitudinal direction is performed, a structure is observed in which there is a plurality of crystal grains, which have an aspect ratio {(length of major axis)/(length of minor axis perpendicular to major axis)} of 5 or more and elongate in the longitudinal direction of the wire, in a wire thickness direction.Type: GrantFiled: February 6, 2015Date of Patent: October 30, 2018Assignee: FURUYA METAL CO., LTD.Inventors: Tomohiro Maruko, Tomoaki Miyazawa, Shoji Saito, Kensuke Morita
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Publication number: 20180219543Abstract: A current detection circuit (4) detects a device current flowing in the semiconductor device (1). A voltage detection circuit (5) detects a device voltage applied to the semiconductor device (1). A temperature calculation device (6) has a table collecting device temperatures of the semiconductor device (1) respectively corresponding to plural collector currents and plural collector voltages, and reads out a device temperature corresponding to the device current detected by the current detection circuit (4) and the device voltage detected by the voltage detection circuit (5) from the table.Type: ApplicationFiled: January 8, 2016Publication date: August 2, 2018Applicant: Mitsubishi Electric CorporationInventors: Hideo KOMO, Shoji SAITO, Takeshi OMARU