Patents by Inventor Shona Bullock

Shona Bullock has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for mounting electronic components onto flexible substrates
    Patent number: 7156279
    Abstract: A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14 ) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).
    Type: Grant
    Filed: October 3, 2001
    Date of Patent: January 2, 2007
    Assignee: Visteon Global Technologie, Inc.
    Inventors: Lakhi N. Goenke, Charles Frederick Schweitzer, Jason Bullock, legal representative, Shona Bullock, legal representative, Mark D. Miller, Jay DeAvis Baker, Karen Lee Chiles, Achyuta Achari, Lawrence Lernel Bullock, deceased
  • System and method for mounting electronic components onto flexible substrates
    Publication number: 20040094607
    Abstract: A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14 ) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).
    Type: Application
    Filed: August 1, 2003
    Publication date: May 20, 2004
    Inventors: Lakhi N. Goenka, Charles Frederick Schweitzer, Lawrence Lernel Bullock, Mark D. Miller, Jay DeAvis Baker, Karen Lee Chiles, Achyuta Achari, Jason Bullock, Shona Bullock
  • System and method for mounting electronic components onto flexible substrates
    Publication number: 20040050915
    Abstract: A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).
    Type: Application
    Filed: August 1, 2003
    Publication date: March 18, 2004
    Inventors: Lakhi Nandlal Goenka, Lawrence Lernel Bullock, Jason Bullock, Shona Bullock, Peter Joseph Sinkunas, Charles Frederick Schweitzer, Mark D. Miller, Raymond Eric Foster, Stephen Edward Fuks, Thomas B. Krautheim