Patents by Inventor Shota Shimonishi
Shota Shimonishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150036349Abstract: A light emitting device includes a heat dissipation board, a wiring board that is bonded and fixed to the heat dissipation board and formed with a through-hole, a semiconductor light emitting element that is mounted on a face of the heat dissipation board, the face being exposed through the through-hole of the wiring board, and a light reflecting member that covers a portion of an inner peripheral wall surface of the through-hole of the wiring board, the portion being squarely opposed to a side surface of the semiconductor light emitting element.Type: ApplicationFiled: August 1, 2014Publication date: February 5, 2015Inventors: Yosuke TSUCHIYA, Hiroyuki Tajima, Shota Shimonishi, Shigeo Takeda, Tomohiro Miwa
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Patent number: 8921873Abstract: The present invention provides a light-emitting device which includes a plurality of LED chips mounted on a chip mount surface of a substrate provided with a wiring pattern. In the light-emitting device, the wiring pattern is provided so as to meet the following conditions (a), (b), and (c). (a) The wiring pattern divides the chip mount surface into at least three divided areas in a radial fashion from a center of the chip mount surface, and includes radial elements and circumferential elements so as to surround divided areas. (b) Of two radial elements and one circumferential element which surround each divided area as viewed from the individual divided area, one or two elements form part of a positive electrode pattern, and the remainder forms part of a negative electrode pattern. (c) There is only one radial element between adjoining ones of the divided areas.Type: GrantFiled: June 18, 2013Date of Patent: December 30, 2014Assignee: Toyoda Gosei Co., Ltd.Inventors: Shigeo Takeda, Tomohiro Miwa, Shota Shimonishi, Hiroyuki Tajima
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Patent number: 8852970Abstract: A method for mounting a luminescent device having a mount layer on a substrate, comprising the steps of coating a metallic nano-particle paste on the substrate, disposing the mount layer of the luminescent device on the metallic nano-particle paste, and heating the mount layer and the metallic nano-particle paste to form an alloy, thereby bonding the luminescent device and the substrate.Type: GrantFiled: September 19, 2011Date of Patent: October 7, 2014Assignee: Toyoda Gosei Co., Ltd.Inventors: Shota Shimonishi, Hiroyuki Tajima, Yosuke Tsuchiya
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Patent number: 8853728Abstract: An LED mounting substrate includes a base substrate, a conductive pattern formed on the base substrate and including a recessed portion on an upper surface thereof, and a light reflecting film formed in an inter-pattern gap of the conductive pattern on the base substrate and in the recessed portion of the conductive pattern.Type: GrantFiled: June 17, 2013Date of Patent: October 7, 2014Assignee: Toyoda Gosei Co., Ltd.Inventors: Yosuke Tsuchiya, Shota Shimonishi, Hiroyuki Tajima, Akira Sengoku
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Publication number: 20140284651Abstract: A light-emitting device includes a thermally conductive substrate, a wiring electrode formed on the thermally conductive substrate, a resist formed on the wiring electrode except a terminal thereof, and a light-emitting element that is disposed in an element mounting region of the thermally conductive substrate and electrically connected to the terminal of the wiring electrode. A heat dissipation hole is formed in a region of the resist outside the element mounting region so as to expose a surface of the thermally conductive substrate.Type: ApplicationFiled: February 7, 2014Publication date: September 25, 2014Applicant: TOYODA GOSEI CO., LTD.Inventors: Yosuke TSUCHIYA, Hiroyuki Tajima, Shota Shimonishi, Akira Sengoku
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Publication number: 20140087498Abstract: A method of manufacturing a light-emitting device includes mounting an LED chip on a bottom surface of a recessed portion of a case, and after mounting the LED chip, forming a highly-reflective sidewall so as to be in contact with side surfaces and the bottom surface of the recessed portion and to be spaced from the LED chip. The highly-reflective sidewall includes a higher light reflectance than the side surfaces of the recessed position of the case and an outwardly convex surface as a surface exposed in the recessed portion.Type: ApplicationFiled: September 19, 2013Publication date: March 27, 2014Applicant: Toyoda Gosei Co., Ltd.Inventors: Takashi TERAYAMA, Akira Kojima, Toshimasa Hayashi, Seiji Yamaguchi, Hiroyuki Tajima, Shota Shimonishi, Yukihiro Demukai
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Publication number: 20140084311Abstract: The present invention provides a light-emitting device which includes a plurality of LED chips mounted on a chip mount surface of a substrate provided with a wiring pattern. In the light-emitting device, the wiring pattern is provided so as to meet the following conditions (a), (b), and (c). (a) The wiring pattern divides the chip mount surface into at least three divided areas in a radial fashion from a center of the chip mount surface, and includes radial elements and circumferential elements so as to surround divided areas. (b) Of two radial elements and one circumferential element which surround each divided area as viewed from the individual divided area, one or two elements form part of a positive electrode pattern, and the remainder forms part of a negative electrode pattern. (c) There is only one radial element between adjoining ones of the divided areas.Type: ApplicationFiled: June 18, 2013Publication date: March 27, 2014Inventors: Shigeo TAKEDA, Tomohiro Miwa, Shota Shimonishi, Hiroyuki Tajima
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Patent number: 8643271Abstract: The present invention provides a LED lamp module including a metal base, a flexible board mounted on the metal base and having a through hole, a surface mounted type LED lamp including a ceramic package having a projection portion on a back of the ceramic package, a LED chip mounted on the ceramic package, and a light output surface. The projection part is thermally connected with the metal base through the through hole, and the LED lamp is electrically connected with the flexible board through an electric conductive member at a portion other than the projection portion. The LED lamp module includes a cover covering a part of the LED lamp other than the light output surface and the flexible board and pressing the LED lamp.Type: GrantFiled: February 5, 2009Date of Patent: February 4, 2014Assignee: Toyoda Gosei Co., Ltd.Inventors: Shota Shimonishi, Hiroyuki Tajima, Toshimasa Hayashi, Hideki Kokubu
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Publication number: 20140028173Abstract: A light-emitting device includes a base material having a conductor layer on a surface thereof, the conductor layer being configured to be connected to an external power source, a light-emitting element mounted on the base, a phosphor layer arranged above the light-emitting element, and a resin layer contacting both of the phosphor layer and the conductor layer and containing heat-conductive particles dispersed therein. The heat-conductive particles have a thermal conductivity of not less than 100 W/m·K and an insulator property or a semiconductor property.Type: ApplicationFiled: June 19, 2013Publication date: January 30, 2014Inventors: Yosuke TSUCHIYA, Hiroyuki Tajima, Shota Shimonishi, Akira Sengoku
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Publication number: 20140014992Abstract: An LED mounting substrate includes a base substrate, a conductive pattern formed on the base substrate and including a recessed portion on an upper surface thereof, and a light reflecting film formed in an inter-pattern gap of the conductive pattern on the base substrate and in the recessed portion of the conductive pattern.Type: ApplicationFiled: June 17, 2013Publication date: January 16, 2014Inventors: Yosuke TSUCHIYA, Shota Shimonishi, Hiroyuki Tajima, Akira Sengoku
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Publication number: 20130249401Abstract: A light-emitting device includes a substrate having a metal film on a first surface, a light-emitting element mounted on the first surface of the substrate and connected to the metal film, a heat sensitive circuit breaker mounted on the first surface of the substrate and connected to the metal film, a light-proof cover that covers the heat sensitive circuit breaker to block light emitted from the light-emitting element and travelling toward the heat sensitive circuit breaker, and a heat dissipating member formed on a second surface of the substrate to dissipate heat of the substrate, the second surface being opposite to the first surface.Type: ApplicationFiled: January 31, 2013Publication date: September 26, 2013Applicant: Toyoda Gosei Co., Ltd.Inventors: Hideaki Kato, Shota Shimonishi
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Patent number: 8368108Abstract: A light emitting element housing package comprises a ceramic substrate on which a light emitting element is mounted, and a wiring pattern that is formed on the ceramic substrate and to which a light emitting element chip is electrically connected, wherein a white thin film layer formed from a sintered body of white inorganic particles is formed on at least an upper surface of the wiring pattern, except a connection region in the wiring pattern to be connected to the light emitting element chip.Type: GrantFiled: September 21, 2011Date of Patent: February 5, 2013Assignee: Toyoda Gosei Co., Ltd.Inventors: Shota Shimonishi, Hiroyuki Tajima, Yosuke Tsuchiya
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Patent number: 8232578Abstract: A light emitting semiconductor device includes a base substrate; a light emitting semiconductor element including a crystal growth basis and provided on the base substrate so that the crystal growth basis faces in opposite direction to the base substrate; a first transparent sealing medium which seals the light emitting semiconductor on the base substrate; and a second transparent sealing medium which seals the light emitting semiconductor over the first transparent sealing medium and contains phosphor. A thickness of the second sealing medium in a portion with high emission intensity is larger than that of the other portion of the first sealing medium; and the portion with high emission intensity is defined as a portion where light emission intensity from the light emitting semiconductor element is maximum.Type: GrantFiled: September 2, 2009Date of Patent: July 31, 2012Assignee: Toyoda Gosei Co., Ltd.Inventors: Shigeo Takeda, Hiroyuki Tajima, Shota Shimonishi, Yosuke Tsuchiya
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Publication number: 20120074445Abstract: A light emitting element housing package comprises a ceramic substrate on which a light emitting element is mounted, and a wiring pattern that is formed on the ceramic substrate and to which a light emitting element chip is electrically connected, wherein a white thin film layer formed from a sintered body of white inorganic particles is formed on at least an upper surface of the wiring pattern, except a connection region in the wiring pattern to be connected to the light emitting element chip.Type: ApplicationFiled: September 21, 2011Publication date: March 29, 2012Applicant: Toyoda Gosei Co., Ltd.Inventors: Shota Shimonishi, Hiroyuki Tajima, Yosuke Tsuchiya
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Publication number: 20120070920Abstract: A method for mounting a luminescent device having a mount layer on a substrate, comprising the steps of coating a metallic nano-particle paste on the substrate, disposing the mount layer of the luminescent device on the metallic nano-particle paste, and heating the mount layer and the metallic nano-particle paste to form an alloy, thereby bonding the luminescent device and the substrate.Type: ApplicationFiled: September 19, 2011Publication date: March 22, 2012Applicant: Toyoda Gosei Co., Ltd.Inventors: Shota Shimonishi, Hiroyuki Tajima, Yosuke Tsuchiya
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Publication number: 20100052006Abstract: A light emitting semiconductor device includes a base substrate; a light emitting semiconductor element including a crystal growth basis and provided on the base substrate so that the crystal growth basis faces in opposite direction to the base substrate; a first transparent sealing medium which seals the light emitting semiconductor on the base substrate; and a second transparent sealing medium which seals the light emitting semiconductor over the first transparent sealing medium and contains phosphor. A thickness of the second sealing medium in a portion with high emission intensity is larger than that of the other portion of the first sealing medium; and the portion with high emission intensity is defined as a portion where light emission intensity from the light emitting semiconductor element is maximum.Type: ApplicationFiled: September 2, 2009Publication date: March 4, 2010Applicant: TOYODA GOSEI CO., LTD.Inventors: Shigeo Takeda, Hiroyuki Tajima, Shota Shimonishi, Yosuke Tsuchiya
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Publication number: 20090206718Abstract: The present invention provides a LED lamp module including a metal base, a flexible board mounted on the metal base and having a through hole, a surface mounted type LED lamp including a ceramic package having a projection portion on a back of the ceramic package, a LED chip mounted on the ceramic package, and a light output surface. The projection part is thermally connected with the metal base through the through hole, and the LED lamp is electrically connected with the flexible board through an electric conductive member at a portion other than the projection portion.Type: ApplicationFiled: February 5, 2009Publication date: August 20, 2009Applicant: TOYODA GOSEI CO., LTD.Inventors: Shota Shimonishi, Hiroyuki Tajima, Toshimasa Hayashi, Hideki Kokubu
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Patent number: D698322Type: GrantFiled: December 13, 2012Date of Patent: January 28, 2014Assignee: Toyoda Gosei Co., Ltd.Inventors: Shigeo Takeda, Tomohiro Miwa, Shota Shimonishi, Hiroyuki Tajima
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Patent number: D700585Type: GrantFiled: December 13, 2012Date of Patent: March 4, 2014Assignee: Toyoda Gosei Co., Ltd.Inventors: Shigeo Takeda, Tomohiro Miwa, Shota Shimonishi, Hiroyuki Tajima
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Patent number: D717252Type: GrantFiled: December 13, 2012Date of Patent: November 11, 2014Assignee: Toyoda Gosei Co., Ltd.Inventors: Shigeo Takeda, Tomohiro Miwa, Shota Shimonishi, Hiroyuki Tajima