Patents by Inventor SHOU-FANG ZHONG

SHOU-FANG ZHONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10972841
    Abstract: A vibration system which does not rely on adhesive assembly includes a first bracket and a vibration assembly. The vibration assembly includes a voice coil portion and a first diaphragm portion. The voice coil portion includes a mounting base and a voice coil body. The voice coil body surrounds an outer surface of the mounting base. Through holes define in one end of the mounting base. The through holes penetrate the base. The first diaphragm portion includes two connecting portions and a diaphragm body between the two connecting portions. A first connecting portion connects the first bracket. A second connecting portion surrounds an end of the mounting base away from the voice coil body, and the second connecting portion inserts into the through hole. The disclosure further provides a loudspeaker and a method for manufacturing the vibration system.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: April 6, 2021
    Assignee: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: Kai-Ping Chang, Shou-Fang Zhong, Peng-Shuai Guo
  • Patent number: 10939210
    Abstract: A vibration system which does not rely on adhesive assembly includes a first bracket and a vibration assembly. The vibration assembly includes a voice coil portion and a first diaphragm portion. The voice coil portion includes a mounting base and a voice coil body. The voice coil body surrounds an outer surface of the mounting base. Through holes define in one end of the mounting base. The through holes penetrate the base. The first diaphragm portion includes two connecting portions and a diaphragm body between the two connecting portions. A first connecting portion connects the first bracket. A second connecting portion surrounds an end of the mounting base away from the voice coil body, and the second connecting portion inserts into the through hole. The disclosure further provides a loudspeaker and a method for manufacturing the vibration system.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: March 2, 2021
    Assignee: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: Kai-Ping Chang, Shou-Fang Zhong, Peng-Shuai Guo
  • Publication number: 20200329313
    Abstract: A vibration system which does not rely on adhesive assembly includes a first bracket and a vibration assembly. The vibration assembly includes a voice coil portion and a first diaphragm portion. The voice coil portion includes a mounting base and a voice coil body. The voice coil body surrounds an outer surface of the mounting base. Through holes define in one end of the mounting base. The through holes penetrate the base. The first diaphragm portion includes two connecting portions and a diaphragm body between the two connecting portions. A first connecting portion connects the first bracket. A second connecting portion surrounds an end of the mounting base away from the voice coil body, and the second connecting portion inserts into the through hole. The disclosure further provides a loudspeaker and a method for manufacturing the vibration system.
    Type: Application
    Filed: May 28, 2019
    Publication date: October 15, 2020
    Inventors: KAI-PING CHANG, SHOU-FANG ZHONG, PENG-SHUAI GUO
  • Publication number: 20110076455
    Abstract: A key includes a preform, a first molded layer formed on a first side surface of the preform by injection molding, and a second molded layer formed on the second side surface by injection molding. The preform, the first molded layer, and the second molded layer cooperatively define a depression. A periphery of the first molded layer forms an assembly portion. A portion of the second layer on the periphery of the first molder layer is substantially parallel to a portion of the ink layer on the periphery of the first molder layer. A method of manufacturing the key is also provided.
    Type: Application
    Filed: November 24, 2009
    Publication date: March 31, 2011
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen)CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: MING-WU LEE, HAO-DONG XU, CHU-YUAN CHEN, SHOU-FANG ZHONG