Patents by Inventor Shou HASEGAWA

Shou HASEGAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power semiconductor device, rotating electric machine including same, and method of manufacturing power semiconductor device
    Patent number: 11094603
    Abstract: A power semiconductor device includes a planar rectifying element, a base electrode, a first solder layer, a lead electrode, a second solder layer, and first and second sealing portions. The base electrode is electrically connected to the rectifying element via the first solder layer formed on a first surface of the rectifying element. The lead electrode is electrically connected to the rectifying element via the second solder layer formed on a second surface of the rectifying element. The first sealing portion is formed of a first resin and provided in a recess; the recess is formed by the first surface of the rectifying element and the first solder layer or by the second surface of the rectifying element and the second solder layer. The second sealing portion is formed of a second resin and separately from the first sealing portion to cover an outer surface of the first sealing portion.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: August 17, 2021
    Assignee: DENSO CORPORATION
    Inventor: Shou Hasegawa
  • POWER SEMICONDUCTOR DEVICE, ROTATING ELECTRIC MACHINE INCLUDING SAME, AND METHOD OF MANUFACTURING POWER SEMICONDUCTOR DEVICE
    Publication number: 20190287871
    Abstract: A power semiconductor device includes a planar rectifying element, a base electrode, a first solder layer, a lead electrode, a second solder layer, and first and second sealing portions. The base electrode is electrically connected to the rectifying element via the first solder layer formed on a first surface of the rectifying element. The lead electrode is electrically connected to the rectifying element via the second solder layer formed on a second surface of the rectifying element. The first sealing portion is formed of a first resin and provided in a recess; the recess is formed by the first surface of the rectifying element and the first solder layer or by the second surface of the rectifying element and the second solder layer. The second sealing portion is formed of a second resin and separately from the first sealing portion to cover an outer surface of the first sealing portion.
    Type: Application
    Filed: March 18, 2019
    Publication date: September 19, 2019
    Applicant: DENSO CORPORATION
    Inventor: Shou HASEGAWA