Patents by Inventor SHOU-TE YEN

SHOU-TE YEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11283259
    Abstract: A method for electrostatic discharge protection in a receiver and associated receiver are provided. The receiver includes a reference voltage terminal, a detection terminal, at least one set of receiving terminals and at least one set of termination resistors. The method includes: according to a voltage level of the detection terminal, generating a detection result; and according to the detection result, controlling whether to configure said at least one set of termination resistors to be respectively coupled between said at least one set of receiving terminals and the reference voltage terminal.
    Type: Grant
    Filed: May 12, 2019
    Date of Patent: March 22, 2022
    Assignee: Realtek Semiconductor Corp.
    Inventors: Guo-Yuan Luo, Shou-Te Yen, Yan-Jyun Chen
  • Patent number: 10856404
    Abstract: A signal processing circuit includes: a printed circuit board (PCB) including a first surface layer, a second surface layer, a first reference layer, and a second reference layer, wherein the first and second surface layers are positioned on opposing side of the PCB while the first reference layer and the second reference layer are positioned between the first and second surface layers; a memory chip positioned on the first surface layer; a controller chip positioned on the second surface layer; a first set of signal lines arranged on the first surface layer and coupled with the memory chip, wherein all signal lines in the first set of signal lines does not cross each other; and a second set of signal lines arranged on the second surface layer and coupled with the controller chip, wherein all signal lines in the second set of signal lines does not cross each other.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: December 1, 2020
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Shou-Te Yen, Chao-Min Lai, Ping-Chia Wang
  • Publication number: 20200253038
    Abstract: A signal processing circuit includes: a printed circuit board (PCB) including a first surface layer, a second surface layer, a first reference layer, and a second reference layer, wherein the first and second surface layers are positioned on opposing side of the PCB while the first reference layer and the second reference layer are positioned between the first and second surface layers; a memory chip positioned on the first surface layer; a controller chip positioned on the second surface layer; a first set of signal lines arranged on the first surface layer and coupled with the memory chip, wherein all signal lines in the first set of signal lines does not cross each other; and a second set of signal lines arranged on the second surface layer and coupled with the controller chip, wherein all signal lines in the second set of signal lines does not cross each other.
    Type: Application
    Filed: January 13, 2020
    Publication date: August 6, 2020
    Applicant: REALTEK SEMICONDUCTOR CORP.
    Inventors: Shou-Te YEN, Chao-Min LAI, Ping-Chia WANG
  • Publication number: 20200185914
    Abstract: A method for electrostatic discharge protection in a receiver and associated receiver are provided. The receiver includes a reference voltage terminal, a detection terminal, at least one set of receiving terminals and at least one set of termination resistors. The method includes: according to a voltage level of the detection terminal, generating a detection result; and according to the detection result, controlling whether to configure said at least one set of termination resistors to be respectively coupled between said at least one set of receiving terminals and the reference voltage terminal.
    Type: Application
    Filed: May 12, 2019
    Publication date: June 11, 2020
    Inventors: Guo-Yuan Luo, Shou-Te Yen, Yan-Jyun Chen
  • Patent number: 10334727
    Abstract: An electronic apparatus and a circuit board thereof are provided. The electronic apparatus operates in cooperation with a packaged electronic component. The electronic apparatus includes a circuit board and a control device disposed on the circuit board. The circuit board includes a plurality of conductive vias passing therethrough, and the conductive vias includes a plurality of first conductive vias arranged respectively corresponding to the first contact pads of the packaged electronic component. The control device includes a signal contact array including a plurality of first signal contacts. When the packaged electronic component and the control device are respectively disposed on two opposite sides of the circuit board, the packaged electronic component and the control device at least partially overlap in a thickness direction of the circuit board, and the first signal contacts are respectively electrically connected to the first contact pads via the corresponding conductive vias.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: June 25, 2019
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Chao-Min Lai, Shou-Te Yen
  • Publication number: 20180343739
    Abstract: An electronic apparatus and a circuit board thereof are provided. The electronic apparatus operates in cooperation with a packaged electronic component. The electronic apparatus includes a circuit board and a control device disposed on the circuit board. The circuit board includes a plurality of conductive vias passing therethrough, and the conductive vias includes a plurality of first conductive vias arranged respectively corresponding to the first contact pads of the packaged electronic component. The control device includes a signal contact array including a plurality of first signal contacts. When the packaged electronic component and the control device are respectively disposed on two opposite sides of the circuit board, the packaged electronic component and the control device at least partially overlap in a thickness direction of the circuit board, and the first signal contacts are respectively electrically connected to the first contact pads via the corresponding conductive vias.
    Type: Application
    Filed: April 19, 2018
    Publication date: November 29, 2018
    Inventors: CHAO-MIN LAI, SHOU-TE YEN