Patents by Inventor Shouji Aoki

Shouji Aoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive for semiconductor devices and adhesive tape using the adhesive
    Patent number: 5786055
    Abstract: An adhesive for semiconductor device, comprising (a) a polyamide resin having an amine value of 20 to 60 and a weight average molecular weight of 1,000 to 5,000 and (b) a phenolic compound having a weight average molecular weight of 2,000 or less and having a skeleton containing at least 2 methylol groups.
    Type: Grant
    Filed: February 1, 1995
    Date of Patent: July 28, 1998
    Assignee: Tomoegawa Paper Co., Ltd.
    Inventors: Akinori Sei, Yoshikazu Tsukamoto, Takashi Shiozawa, Shouji Aoki, Tadahiro Oishi, Hitoshi Narushima