Patents by Inventor Shouji Minegishi
Shouji Minegishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9423691Abstract: In a layered structure having at least a substrate and a photosensitive resin layer or cured film layer formed on the substrate and containing an inorganic filler, the content of the inorganic filler in the photosensitive resin layer or cured film layer is low on the side contacting the substrate and high on the surface side away from the substrate, so that a linear thermal expansion coefficient of the photosensitive resin layer or cured film layer as a whole is maintained as low as possible. Preferably, the inorganic filler content in the layer gradually increases continuously obliquely or stepwise from the side contacting the substrate to the surface side away from the substrate. A photosensitive dry film containing the above-mentioned photosensitive resin layer is suitable for use as a solder resist or an interlayer resin insulation layer of a printed wiring board.Type: GrantFiled: March 16, 2015Date of Patent: August 23, 2016Assignee: TAIYO HOLDINGS CO., LTD.Inventors: Takahiro Yoshida, Shouji Minegishi, Masao Arima
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Patent number: 9091921Abstract: In a layered structure having at least a substrate and a photosensitive resin layer or cured film layer formed on the substrate and containing an inorganic filler, the content of the inorganic filler in the photosensitive resin layer or cured film layer is low on the side contacting the substrate and high on the surface side away from the substrate, so that a linear thermal expansion coefficient of the photosensitive resin layer or cured film layer as a whole is maintained as low as possible. Preferably, the inorganic filler content in the layer gradually increases continuously obliquely or stepwise from the side contacting the substrate to the surface side away from the substrate. A photosensitive dry film containing the above-mentioned photosensitive resin layer is suitable for use as a solder resist or an interlayer resin insulation layer of a printed wiring board.Type: GrantFiled: August 8, 2012Date of Patent: July 28, 2015Assignee: TAIYO HOLDINGS CO., LTD.Inventors: Takahiro Yoshida, Shouji Minegishi, Masao Arima
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Publication number: 20150185603Abstract: In a layered structure having at least a substrate and a photosensitive resin layer or cured film layer formed on the substrate and containing an inorganic filler, the content of the inorganic filler in the photosensitive resin layer or cured film layer is low on the side contacting the substrate and high on the surface side away from the substrate, so that a linear thermal expansion coefficient of the photosensitive resin layer or cured film layer as a whole is maintained as low as possible. Preferably, the inorganic filler content in the layer gradually increases continuously obliquely or stepwise from the side contacting the substrate to the surface side away from the substrate. A photosensitive dry film containing the above-mentioned photosensitive resin layer is suitable for use as a solder resist or an interlayer resin insulation layer of a printed wiring board.Type: ApplicationFiled: March 16, 2015Publication date: July 2, 2015Applicant: TAIYO HOLDINGS CO., LTD.Inventors: Takahiro YOSHIDA, Shouji MINEGISHI, Masao ARIMA
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Patent number: 8722816Abstract: A solder resist having both adequate sensitivity at photo-irradiation and alkali developability, and the solder resist forming a cured product which is excellent in dimensional stability against temperature change, does not exhibit brittleness, and further, is excellent in water resistance, electrical insulation, thermal cycle test resistance (TCT resistance) and the like is provided, and further, a dry film having a solder resist layer, a cured product and a printed wiring board are provided. The solder resist comprising an acid-modified vinyl ester synthesized from an epoxy compound, a phenol compound, an unsaturated monobasic acid and a polybasic acid anhydride, wherein the epoxy compound contains a crystalline epoxy resin having a melting point of 90° C. or more, and the phenol compound contains a compound having a bisphenol S structure.Type: GrantFiled: March 4, 2008Date of Patent: May 13, 2014Assignees: Nippon Shokubai Co., Ltd., Taiyo Holdings Co., Ltd.Inventors: Nobuaki Otsuki, Manabu Akiyama, Shouji Minegishi, Masao Arima
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Patent number: 8492070Abstract: A photocurable and thermosetting composition comprises (A) a carboxyl group-containing resin having at least one carboxyl group in its molecule, (B) a photopolymerization initiator having an oxime linkage represented by the following general formula (I), (C) a reactive diluent, and (D) an epoxy compound having two or more epoxy groups in its molecule. The above-mentioned photopolymerization initiator (B) is incorporated into a formulation which is different from at least a formulation into which the above-mentioned carboxyl group-containing resin (A) and the above-mentioned reactive diluent (C) are incorporated to formulate a system comprising at least two parts.Type: GrantFiled: July 27, 2012Date of Patent: July 23, 2013Assignee: Taiyo Ink Manufacturing Co., Ltd.Inventors: Hideaki Kojima, Hidekazu Miyabe, Shouji Minegishi, Naoki Yoneda, Yoshitaka Hirai
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Publication number: 20120301824Abstract: In a layered structure having at least a substrate and a photosensitive resin layer or cured film layer formed on the substrate and containing an inorganic filler, the content of the inorganic filler in the photosensitive resin layer or cured film layer is low on the side contacting the substrate and high on the surface side away from the substrate, so that a linear thermal expansion coefficient of the photosensitive resin layer or cured film layer as a whole is maintained as low as possible. Preferably, the inorganic filler content in the layer gradually increases continuously obliquely or stepwise from the side contacting the substrate to the surface side away from the substrate. A photosensitive dry film containing the above-mentioned photosensitive resin layer is suitable for use as a solder resist or an interlayer resin insulation layer of a printed wiring board.Type: ApplicationFiled: August 8, 2012Publication date: November 29, 2012Applicant: TAIYO HOLDINGS CO., LTD.Inventors: Takahiro YOSHIDA, Shouji Minegishi, Masao Arima
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Publication number: 20120301825Abstract: In a layered structure having at least a substrate and a photosensitive resin layer or cured film layer formed on the substrate and containing an inorganic filler, the content of the inorganic filler in the photosensitive resin layer or cured film layer is lower in a surface layer region away from the substrate than in other region, so that a linear thermal expansion coefficient of the layer as a whole is maintained as low as possible. Preferably, the photosensitive resin layer or cured film layer comprises at least two layers having different inorganic filler contents, wherein the inorganic filler content in the layer on the surface side away from the substrate is lower than the inorganic filler content in the other layer. A photosensitive dry film containing the photosensitive resin layer is suitable for use as a solder resist or an interlayer resin insulation layer of a printed wiring board.Type: ApplicationFiled: August 8, 2012Publication date: November 29, 2012Applicant: TAIYO HOLDINGS CO., LTD.Inventors: Takahiro YOSHIDA, Shouji Minegishi, Masao Arima
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Publication number: 20120295200Abstract: A photocurable and thermosetting composition comprises (A) a carboxyl group-containing resin having at least one carboxyl group in its molecule, (B) a photopolymerization initiator having an oxime linkage represented by the following general formula (I), (C) a reactive diluent, and (D) an epoxy compound having two or more epoxy groups in its molecule. The above-mentioned photopolymerization initiator (B) is incorporated into a formulation which is different from at least a formulation into which the above-mentioned carboxyl group-containing resin (A) and the above-mentioned reactive diluent (C) are incorporated to formulate a system comprising at least two parts.Type: ApplicationFiled: July 27, 2012Publication date: November 22, 2012Applicant: Taiyo Ink Manufacturing Co., Ltd.Inventors: Hideaki Kojima, Hidekazu Miyabe, Shouji Minegishi, Naoki Yoneda, Yoshitaka Hirai
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Publication number: 20100243304Abstract: A solder resist having both adequate sensitivity at photo-irradiation and alkali developability, and the solder resist forming a cured product which is excellent in dimensional stability against temperature change, does not exhibit brittleness, and further, is excellent in water resistance, electrical insulation, thermal cycle test resistance (TCT resistance) and the like is provided, and further, a dry film having a solder resist layer, a cured product and a printed wiring board are provided. The solder resist comprising an acid-modified vinyl ester synthesized from an epoxy compound, a phenol compound, an unsaturated monobasic acid and a polybasic acid anhydride, wherein the epoxy compound contains a crystalline epoxy resin having a melting point of 90° C. or more, and the phenol compound contains a compound having a bisphenol S structure.Type: ApplicationFiled: March 4, 2008Publication date: September 30, 2010Inventors: Nobuaki Otsuki, Manabu Akiyama, Shouji Minegishi, Masao Arima
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Publication number: 20080227883Abstract: A photocurable and thermosetting composition comprises (A) a carboxyl group-containing resin having at least one carboxyl group in its molecule, (B) a photopolymerization initiator having an oxime linkage represented by the following general formula (I), (C) a reactive diluent, and (D) an epoxy compound having two or more epoxy groups in its molecule. The above-mentioned photopolymerization initiator (B) is incorporated into a formulation which is different from at least a formulation into which the above-mentioned carboxyl group-containing resin (A) and the above-mentioned reactive diluent (C) are incorporated to formulate a system comprising at least two parts.Type: ApplicationFiled: May 16, 2008Publication date: September 18, 2008Applicant: Taiyo Ink Manufacturing Co., Ltd.Inventors: Hideaki Kojima, Hidekazu Miyabe, Shouji Minegishi, Naoki Yoneda, Yoshitaka Hirai
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Publication number: 20080096133Abstract: A photocurable and thermosetting resin composition comprising (A) a carboxyl-group containing resin, (B) an oxime ester-based photopolymerization initiator containing an oxime ester group, (C) an aminoacetophenone-based photopolymerization initiator and/or a phosphine oxide-based photopolymerization initiator, (D) a compound having at least two ethylenically unsaturated groups in its molecule, (E) a filler, and (F) a thermosetting component is capable of being developed with a dilute alkaline solution and cured with a laser emission source having a maximum wavelength of 350 nm to 420 nm.Type: ApplicationFiled: November 30, 2007Publication date: April 24, 2008Inventors: Kenji KATO, Yoko Shibasaki, Masao Arima, Shouji Minegishi
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Publication number: 20050215656Abstract: A photocurable and thermosetting composition comprises (A) a carboxyl group-containing resin having at least one carboxyl group in its molecule, (B) a photopolymerization initiator having an oxime linkage represented by the following general formula (I), (C) a reactive diluent, and (D) an epoxy compound having two or more epoxy groups in its molecule. The above-mentioned photopolymerization initiator (B) is incorporated into a formulation which is different from at least a formulation into which the above-mentioned carboxyl group-containing resin (A) and the above-mentioned reactive diluent (C) are incorporated to formulate a system comprising at least two parts.Type: ApplicationFiled: May 26, 2005Publication date: September 29, 2005Inventors: Hideaki Kojima, Hidekazu Miyabe, Shouji Minegishi, Naoki Yoneda, Yoshitaka Hirai