Patents by Inventor Shozo Iwabuchi

Shozo Iwabuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of grinding a substrate and method of manufacturing a glass substrate and a magnetic recording medium by the use of the glass substrate
    Publication number: 20040229003
    Abstract: In a method of grinding side end surfaces of substrates, spacers are interposed between the substrates to form a stack of the substrates and the spacers. The spacers are slightly smaller in size than the substrates. The stack of the substrates and the spacers are ground by a rotatable brush or pad on the side end surfaces of the substrates so as to smooth chamfered portions of the substrates together with the side end surfaces.
    Type: Application
    Filed: June 4, 2004
    Publication date: November 18, 2004
    Applicant: HOYA CORPORATION
    Inventors: Shozo Iwabuchi, Masahiro Katagiri
  • Method of grinding a substrate and method of manufacturing a glass substrate and a magnetic recording medium by the use of the glass substrate
    Publication number: 20030205060
    Abstract: In a method of grinding side end surfaces of substrates, spacers are interposed between the substrates to form a stack of the substrates and the spacers. The spacers are slightly smaller in size than the substrates. The stack of the substrates and the spacers are ground by a rotatable brush or pad on the side end surfaces of the substrates so as to smooth chamfered portions of the substrates together with the side end surfaces.
    Type: Application
    Filed: June 2, 2003
    Publication date: November 6, 2003
    Applicant: HOYA CORPORATION
    Inventors: Shozo Iwabuchi, Masahiro Katagiri
  • Method of grinding a substrate and method of manufacturing a glass substrate and a magnetic recording medium by the use of the glass substrate
    Patent number: 6615613
    Abstract: In a method of grinding side end surfaces of substrates, spacers are interposed between the substrates to form a stack of the substrates and the spacers. The spacers are slightly smaller in size than the substrates. The stack of the substrates and the spacers are ground by a rotatable brush or pad on the side end surfaces of the substrates so as to smooth chamfered portions of the substrates together with the side end surfaces.
    Type: Grant
    Filed: October 2, 2000
    Date of Patent: September 9, 2003
    Assignee: Hoya Corporation
    Inventors: Shozo Iwabuchi, Masahiro Katagiri