Patents by Inventor Shozo Minamitani
Shozo Minamitani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20060285965Abstract: While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet (3) corresponding to an adhesion region (R1) of a semiconductor chip (1) are sucked and held, a plurality of protruding portions (30) of a removing member (21) are brought into contact with the bottom surface of the semiconductor chip through the adhesive sheet at the region. Also, the adhesive sheet is sucked in between the respective protruding portions so as to change a surface bonding of the semiconductor chip to the adhesive sheet by-adhesion to a point bonding, and further the removing member is moved along the bottom surface of the semiconductor chip so as to change a position of the point bonding and decrease bonding force to the adhesive sheet by the adhesion. Then, the semiconductor chip is removed from the adhesive sheet.Type: ApplicationFiled: September 7, 2004Publication date: December 21, 2006Inventors: Akira Kabeshita, Kurayasu Hamasaki, Shozo Minamitani, Yoichi Makino, Noriyuki Tani
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Patent number: 7020953Abstract: A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted onto a substrate such as a circuit board. The component, when held by the placement head, is recognized by an imaging device at or in the vicinity of the transfer station.Type: GrantFiled: March 23, 2001Date of Patent: April 4, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yasuharu Ueno, Shozo Minamitani, Shinji Kanayama, Satoshi Shida, Shunji Onobori
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Publication number: 20060016562Abstract: A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.Type: ApplicationFiled: September 27, 2005Publication date: January 26, 2006Inventors: Shozo Minamitani, Naoto Hosotani, Koichi Morita, Syunji Onobori, Kenichi Nishino
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Publication number: 20050283972Abstract: A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted onto a substrate such as a circuit board. The component, when held by the placement head, is recognized by an imaging device at or in the vicinity of the transfer station.Type: ApplicationFiled: September 1, 2005Publication date: December 29, 2005Inventors: Yasuharu Ueno, Shozo Minamitani, Shinji Kanayama, Takashi Shimizu, Satoshi Shida, Shunji Onobori
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Publication number: 20050227429Abstract: A component mounting apparatus includes a component feeder (20) that feeds a component (2) with its bump electrodes facing down, a mounting head (5) that mounts the component onto a substrate (3), a supporting base (8) that secures the substrate, and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as vibration parallel thereto, a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes (2a) on its face.Type: ApplicationFiled: March 27, 2003Publication date: October 13, 2005Inventors: Shozo Minamitani, Takaharu Mae, Yasuharu Ueno, Akira Yamada, Shinji Kanayama, Makoto Akita, Nobuhisa Watanabe, Akira Mori, Hiroyuki Naito, Shinya Marumo, Makoto Morikawa
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Publication number: 20050098610Abstract: After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.Type: ApplicationFiled: December 20, 2002Publication date: May 12, 2005Inventors: Shunji Onobori, Shuichi Hirata, Masakazu Yamano, Kazuya Yamamoto, Satoshi Shida, Takaharu Mae, Makoto Akita, Shozo Minamitani
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Patent number: 6706130Abstract: When pressurizing and relatively moving the objects to be bonded to each other relative to each other subject their metallic bonding portions to friction bonding for the friction bonding of the metallic bonding portions, the friction bonding operation is temporarily partway reduced or stopped.Type: GrantFiled: April 4, 2002Date of Patent: March 16, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shozo Minamitani, Shinji Kanayama, Satoshi Shida, Yasuharu Ueno
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Publication number: 20040020043Abstract: A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at the component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted on a substrate such as circuit board. The component held by the placement head is recognized by an imaging device at or in the vicinity of the transfer station.Type: ApplicationFiled: December 5, 2002Publication date: February 5, 2004Inventors: Yasuharu Ueno, Shozo Minamitani, Shinji Kanayama, Satoshi Shida, Shunji Onobori
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Publication number: 20030205607Abstract: The present invention provides a bump-joining apparatus, a bump-joining method, and a semiconductor component-manufacturing apparatus whereby bumps and electrode portions of circuit board are perfectly joined with higher join strength than in the conventional art. The apparatus includes a vibration generation device, a pressing device and a control unit, wherein bumps are pressed to electrode portions of a circuit board and vibrated with ultrasonic waves after reaching an initial contact area before reaching a join-completed-contact area at a completion of the joining, so that the bumps are more perfectly joined to the electrode portion than in the conventional art which vibrates the bump only after reaching the join-completed-contact area. Larger join strength is achieved than in the conventional art.Type: ApplicationFiled: April 21, 2003Publication date: November 6, 2003Inventors: Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa
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Publication number: 20030150108Abstract: Component 3 is pressed onto a circuit board 4 so that their respective metal interconnects 5, 6 are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle 14 holding the component 3. Friction is thereby generated between metal interconnects 5, 6 whereby the component 3 is bonded on circuit substrate. Suction nozzle 14 for handling components is made of stainless steel and has a working face 14a provided with a hardened layer 14b, or alternatively, suction nozzle 14 may have a suction head 14c having a working face 14a made of cemented carbide. Working face 14a of suction nozzle 14 is refined by polishing as required during the mounting operation.Type: ApplicationFiled: February 28, 2003Publication date: August 14, 2003Inventors: Kazushi Higashi, Shozo Minamitani, Shinji Kanayama, Kenji Takahashi
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Publication number: 20030121616Abstract: A beating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.Type: ApplicationFiled: February 13, 2003Publication date: July 3, 2003Inventors: Shozo Minamitani, Naoto Hosotani, Koichi Morita, Syunji Onobori, Kenichi Nishino
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Patent number: 6572005Abstract: The present invention provides a bump-joining apparatus, a bump-joining method, and a semiconductor component-manufacturing apparatus whereby bumps and electrode portions of circuit board are perfectly joined with higher join strength than in the conventional art. The apparatus includes a vibration generation device, a pressing device and a control unit, wherein bumps are pressed to electrode portions of a circuit board and vibrated with ultrasonic waves after reaching an initial contact area before reaching a join-completed-contact area at a completion of the joining, so that the bumps are more perfectly joined to the electrode portion than in the conventional art which vibrates the bump only after reaching the join-completed-contact area. Larger join strength is achieved than in the conventional art.Type: GrantFiled: September 28, 2001Date of Patent: June 3, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa
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Patent number: 6544377Abstract: A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.Type: GrantFiled: May 18, 2000Date of Patent: April 8, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shozo Minamitani, Naoto Hosotani, Koichi Morita, Syunji Onobori, Kenichi Nishino
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Patent number: 6506222Abstract: A divided component separated individually beforehand is supplied in a state while stored in a storage body, taken outside by a take-out and storage unit, and a component is mounted on the divided component by a mounting unit, and thereby a divided component with the component is produced. A plurality of the produced divided components with the components mounted thereon are collected into the storage body. Since the component is mounted on the already divided component, as compared with the prior art, no trouble is given rise to at a junction part between the divided component and the component, thus contributing to an improvement in product quality.Type: GrantFiled: June 5, 2001Date of Patent: January 14, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shozo Minamitani, Takashi Shimizu, Shinji Kanayama, Kenji Takahashi, Kazushi Higashi, Satoshi Shida, Naoto Hosotani
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Patent number: 6467670Abstract: Sealant 11 is supplied in advance to one or both of the electrical bonding areas 5,6 of the component 3 and the mounting surface 4, and as the component 3 is brought in contact with the mounting surface 4, the sealant 11 is compressed and filled therebetween in a required area. At the same time ultrasonic vibration is applied to the component 3 for generating friction between the electrical bonding areas 5, 6 of the component 3 and the mounting surface 4 in tight contact with each other, so that both electrical bonding areas 5, 6 are melted and ultrasonically bonded together, and thereby the component 3 is mounted on the mounting surface 4.Type: GrantFiled: January 8, 2001Date of Patent: October 22, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazushi Higashi, Hiroyuki Otani, Shozo Minamitani, Shinji Kanayama, Kenji Takahashi
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Patent number: 6439447Abstract: When electrodes on an electronic component and electrode portions on a circuit board are joined via bumps with the electronic component and the circuit board vibrated respectively, a vibration damping detect device and a deciding device detect damping of the vibration caused by a progress of joining between the bumps and the electrode portions, and then determine a good or defective of the joining on a basis of the damping of the vibration. Further, regarding an impedance of an ultrasonic oscillator, a movement amount of a nozzle, or a current supplying to a VCM, these waveforms during the joining are compared with waveforms of good joining thereof and then the good or defective is determined. According to the above constructions, the good or defective of the joining between the electronic component and the circuit board can be determined during the joining. Further, when a joining state becomes wrong during the joining, the joining state can be changed.Type: GrantFiled: February 28, 2001Date of Patent: August 27, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa, Makoto Akita, Kenji Okamoto, Shinzo Eguchi, Yasuhiro Kametani
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Publication number: 20020008132Abstract: The present invention provides a bump-joining apparatus, a bump-joining method, and a semiconductor component-manufacturing apparatus whereby bumps and electrode portions of circuit board are perfectly joined with higher join strength than in the conventional art. The apparatus includes a vibration generation device, a pressing device and a control unit, wherein bumps are pressed to electrode portions of a circuit board and vibrated with ultrasonic waves after reaching an initial contact area before reaching a join-completed-contact area at a completion of the joining, so that the bumps are more perfectly joined to the electrode portion than in the conventional art which vibrates the bump only after reaching the join-completed-contact area. Larger join strength is achieved than in the conventional art.Type: ApplicationFiled: September 28, 2001Publication date: January 24, 2002Inventors: Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa
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Patent number: 6321973Abstract: The present invention provides a bump-joining apparatus, a bump-joining method, and a semiconductor component-manufacturing apparatus whereby bumps and electrode portions of circuit board are perfectly joined, with higher join strength than in the conventional art. The apparatus includes a vibration generation device, a pressing device and a control unit, wherein bumps are pressed to electrode portions of a circuit board and vibrated with ultrasonic waves after reaching an initial contact area before reaching a join-completed-contact area at a completion of the joining, so that the bumps are more perfectly joined to the electrode portion than in the conventional art which vibrates the bump only after reaching the join-completed-contact area. Larger join strength is achieved than in the conventional art.Type: GrantFiled: July 15, 1999Date of Patent: November 27, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa
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Publication number: 20010026012Abstract: A divided component separated individually beforehand is supplied in a state while stored in a storage body, taken outside by a take-out and storage unit, and a component is mounted on the divided component by a mounting unit, and thereby a divided component with the component is produced. A plurality of the produced divided components with the components mounted thereon are collected into the storage body. Since the component is mounted on the already divided component, as compared with the prior art, no trouble is given rise to at a junction part between the divided component and the component, thus contributing to an improvement in product quality.Type: ApplicationFiled: June 5, 2001Publication date: October 4, 2001Inventors: Shozo Minamitani, Takashi Shimizu, Shinji Kanayama, Kenji Takahashi, Kazushi Higashi, Satoshi Shida, Naoto Hosotani
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Patent number: 6264704Abstract: A divided component separated individually beforehand is supplied in a state while stored in a storage body, taken outside by a take-out and storage unit, and a component is mounted on the divided component by a mounting unit, and thereby a divided component with the component is produced. A plurality of the produced divided components with the components mounted thereon are collected into the storage body.Type: GrantFiled: March 12, 1999Date of Patent: July 24, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shozo Minamitani, Takashi Shimizu, Shinji Kanayama, Kenji Takahashi, Kazushi Higashi, Satoshi Shida, Naoto Hosotani