Patents by Inventor Shozo Nagai

Shozo Nagai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110020166
    Abstract: The object of the present invention is to provide at a low cost iron-base heat- and corrosion-resistant brazing material which make it possible to braze parts made of a base metal selected from among various stainless steels, particularly ferritic stainless steels, at a practical temperature (of 1120° C. or lower) and are excellent in the wetting property against the base metal and which can attain excellent resistance to corrosion by sulfuric acid or nitric acid and high strength without coarsening the structure of the base metal. The iron-base heat- and corrosion-resistant brazing material is characterized by comprising 30 to 75 wt % of Fe, 35 wt % or less of Ni and 5 to 20 wt % of Cr in a total amount of Ni and Cr of 15 to 50 wt %, and 7 wt % or less of Si and 4 to 10 wt % of P in a total amount of Si and P of 9 to 13 wt %. The iron-base heat- and corrosion-resistant brazing material further comprising 0.5 to 5 wt % of Mo and/or 0.
    Type: Application
    Filed: August 28, 2008
    Publication date: January 27, 2011
    Inventors: Katsunori Otobe, Shozo Nagai
  • Patent number: 6696017
    Abstract: The present invention relates to a Ni-base brazing alloy. The alloy has a good wettability toward a material to be brazed when melting, an excellent corrosion resistance and a high strength. The alloy is used for process of joining two pieces of metal such as stainless steel. The alloy contains Cr in an mount of 25 to 35% by weight, P in an amount of 4 to 8% by weight, Si in an amount of 3 to 6% by weight, wherein the total amount of P and Si is 9 to 11.5% by weight, at least one selected from a group consisting of Al, Ca, Y and misch metal in an amount of 0.01 to 0.10% by weight, and the balance of Ni and unavoidable impurities.
    Type: Grant
    Filed: June 12, 2001
    Date of Patent: February 24, 2004
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Shozo Nagai, Kanichi Tanaka, Kensuke Hidaka
  • Publication number: 20020085943
    Abstract: The present invention relates to a Ni-base brazing alloy. The alloy has a good wettability toward a material to be brazed when melting, an excellent corrosion resistance and a high strength. The alloy is used for process of joining two pieces of metal such as stainless steel. The alloy contains Cr in an mount of 25 to 35% by weight, P in an amount of 4 to 8% by weight, Si in an amount of 3 to 6% by weight, wherein the total amount of P and Si is 9 to 11.5% by weight, at least one selected from a group consisting of Al, Ca, Y and misch metal in an amount of 0.01 to 0.10% by weight, and the balance of Ni and unavoidable impurities.
    Type: Application
    Filed: June 12, 2001
    Publication date: July 4, 2002
    Applicant: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Shozo Nagai, Kanichi Tanaka, Kensuke Hidaka
  • Patent number: 5843243
    Abstract: A wear-resistant copper-based alloy includes 10.0 to 30.0% by weight Ni, 2.0 to 15.0% by weight Fe, 2.0 to 15.0% by weight Co, 0.5 to 5.0% by weight Si, 1.0 to 10.0% by weight Cr, 2.0 to 15.0% by weight at least one first optional element selected from the group consisting of Mo, Ti, Zr, Nb and V, at least one second optional element selected from the group consisting of C and O, and the balance of Cu and inevitable impurities. A carbon content "X" and an oxygen content "Y" satisfy the following relationships; namely: 0.ltoreq."X".ltoreq.0.5, 0.ltoreq."Y".ltoreq.0.05, and "Y".gtoreq.(-0.8)("X")+0.04. The wear-resistant copper-based alloy enables to improve the toughness of weld bead, and to inhibit weld bead from cracking effectively in the solidifying process of a building-up operation.
    Type: Grant
    Filed: February 14, 1996
    Date of Patent: December 1, 1998
    Assignees: Toyota Jidosha Kabushiki Kaisha, Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Minoru Kawasaki, Noboru Takayanagi, Hiromi Nomura, Akio Sato, Isaka Kanazawa, Kensuke Hidaka, Shozo Nagai
  • Patent number: 5817194
    Abstract: A tin base soldering/brazing material contains 0.05 to 1.5 wt. % of P, 0.5 to 5.0 wt. % of Ni, if necessary, 30 wt. % or less of Cu, and/or 10 wt. % or less of Ag, and the balance of Sn and unavoidable impurities, wherein the total amount of Ni, Cu and Ag is 35 wt. % or less. This tin base soldering/brazing material is used as a tin base low melting point brazing material. Further, this tin base soldering/brazing material is used as a tin base lead-free solder wire having a diameter less than 100 .mu.m and pulling strength of the wire higher than a lead-tin solder wire, and a tin base lead-free solder ball having a diameter less than 1,000 .mu.m and a hardness higher than a tin base lead-free solder ball.
    Type: Grant
    Filed: January 6, 1997
    Date of Patent: October 6, 1998
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Shozo Nagai, Kensuke Hidaka, Kanichi Tanaka, Yoshinobu Yagita, Osamu Kajita