Patents by Inventor Shozo Takahashi

Shozo Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cleaning liquid supplying system, substrate processing apparatus and substrate processing system
    Patent number: 11090692
    Abstract: According to one embodiment, provided is a cleaning liquid supplying system including: a circulation line in which cleaning liquid flows, first end of the circulation line being connected to a supply port of a cleaning liquid supplying apparatus, second end of the circulation line being connected to a collection port of the cleaning liquid supplying apparatus; a branch pipe branched from the circulation line and connected to a substrate cleaning unit; a valve provided on the branch pipe and configured to control supply of cleaning liquid from the circulation line to the substrate cleaning unit; and a flow rate adjuster configured to adjust a flow rate of the cleaning liquid flowing in the circulation line.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: August 17, 2021
    Assignee: Ebara Corporation
    Inventors: Mitsuru Miyazaki, Akira Imamura, Takuya Inoue, Shozo Takahashi
  • CLEANING LIQUID SUPPLYING SYSTEM, SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM
    Publication number: 20190308223
    Abstract: According to one embodiment, provided is a cleaning liquid supplying system including: a circulation line in which cleaning liquid flows, first end of the circulation line being connected to a supply port of a cleaning liquid supplying apparatus, second end of the circulation line being connected to a collection port of the cleaning liquid supplying apparatus; a branch pipe branched from the circulation line and connected to a substrate cleaning unit; a valve provided on the branch pipe and configured to control supply of cleaning liquid from the circulation line to the substrate cleaning unit; and a flow rate adjuster configured to adjust a flow rate of the cleaning liquid flowing in the circulation line.
    Type: Application
    Filed: April 2, 2019
    Publication date: October 10, 2019
    Applicant: Ebara Corporation
    Inventors: Mitsuru MIYAZAKI, Akira IMAMURA, Takuya INOUE, Shozo TAKAHASHI
  • Polishing pad and chemical mechanical polishing apparatus for polishing a workpiece, and method of polishing a workpiece using the chemical mechanical polishing apparatus
    Patent number: 9821429
    Abstract: A polishing pad for polishing a workpiece to a mirror finish is attached to a rotatable polishing table of a chemical mechanical polishing apparatus. The workpiece, such as a metal body, is held by a carrier and pressed against the polishing pad. This polishing pad includes: an elastic pad having a polishing surface; a deformable base layer that supports the elastic pad; and an adhesive layer that joins the elastic pad to the base layer.
    Type: Grant
    Filed: May 10, 2013
    Date of Patent: November 21, 2017
    Assignee: EBARA CORPORATION
    Inventors: Yu Ishii, Kenya Ito, Shozo Takahashi, Mika Suzuki
  • Organic semiconductor compositions and solid electrolytic capacitor using the same
    Patent number: 4590541
    Abstract: Organic semiconductor compositions comprising CN group-bearing semiconductive salts and an additive capable of suppressing evolution of a toxic gas such as HCN upon excessive heating of the salts. The additive is selected from polyhydric alcohols, saccharides, and fine powder of metals such as iron, nickel and cobalt. Solid electrolytic capacitors using the organic semiconductor compositions are also described.
    Type: Grant
    Filed: April 5, 1985
    Date of Patent: May 20, 1986
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shozo Takahashi, Susumu Yoshimura, Junji Ozaki