Patents by Inventor Shozo Toda

Shozo Toda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4904571
    Abstract: A remover solution for photoresist comprising (a) a solvent which is typically water, (b) an inorganic or organic alkaline compound such as sodium and potassium hydroxides, and (c) a borohydride compound such as sodium and lithium borohydrides and organic amine borane compounds. When used for removing patterned photoresist layer in the manufacturing process of, for example, electronic circuit board substrates. The method gives quite satisfactory results without discoloration or denaturation of the copper surface and solder surface, consequently leading to the production of high-quality products.
    Type: Grant
    Filed: July 15, 1988
    Date of Patent: February 27, 1990
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Tsuyoshi Miyashita, Shigeru Ohtawa, Hiroyuki Tohda, Shozo Toda, Hisashi Nakane
  • Patent number: 4694040
    Abstract: The invention provides a novel means for providing a highly heat-resistant and corrosion-resistant coating film on the surface of a substrate such as a semiconductor silicon wafer or glass plate by coating the surface with a liquid coating composition which is a solution of an oligomeric organopolysiloxane as a partial dehydration-condensation product of a monohydrocarbylsilane triol RSi(OH).sub.3, optionally, with admixture of a dihydrocarbylsilane diol R.sub.2 Si(OH).sub.2, R being a monovalent hydrocarbon group, e.g. methyl or phenyl, in an organic solvent followed by baking of the coated substrate to convert the coating layer into a cured resin film.
    Type: Grant
    Filed: August 25, 1986
    Date of Patent: September 15, 1987
    Assignee: Tokyo Denshi Kagaku Kabushiki Kaisha
    Inventors: Akira Hashimoto, Toshihiro Nishimura, Muneo Nakayama, Hisashi Nakane, Shozo Toda
  • Patent number: 4525276
    Abstract: The inventive liquid separator of laboratory use can overcome the problems in the conventional separatory funnels used for liquid-liquid phase separation. The inventive apparatus comprises (a) a first bottle-like vessel with a mouth, (b) a second bottle-like vessel with a mouth connected with the first vessel at the mouths with air-tightness but disconnectable therefrom, (c) a porous membrane partitioning the first and the second vessels and made, preferably, of a sintered body of a water-repellent plastic resin such as a fluorocarbon polymer, and (d) an air-passage tubing opening at the ends in the first and the second vessels. When a two-phase mixture of an aqueous liquid and an organic liquid is taken in the first vessel positioned above the second vessel, the organic liquid can pass through the porous membrane to be transferred into the second vessel but the aqueous liquid is retained in the first vessel by virtue of the water-repellency of the fluorocarbon polymer.
    Type: Grant
    Filed: November 26, 1980
    Date of Patent: June 25, 1985
    Assignee: Tokyo Ohka Kogyo Kabushiki Kaisha
    Inventors: Shozo Toda, Kenji Yasuda, Shozo Kokubo
  • Patent number: 4277525
    Abstract: Liquid compositions suitable for providing silica-based coating films on to various substrate surfaces are prepared by the reaction of an alkoxy-containing silane, a lower carboxylic acid and an alcohol in the presence of a reaction accelerator which is an organic acid different from the above mentioned lower carboxylic acid. The reaction proceeds very smoothly even in the absence of any halogen-containing compounds, and the resultant liquid coating compositions are free from the problem of corrosion due to the presence of a halogen-containing ingredient.
    Type: Grant
    Filed: March 24, 1980
    Date of Patent: July 7, 1981
    Assignees: Tokyo Ohka Kogyo Kabushiki Kaisha, Tokyo Denshi Kagaku Kabushiki Kaisha
    Inventors: Muneo Nakayama, Toshihiro Nishimura, Hisashi Nakane, Shozo Toda, Yoshio Hotta, Mitsuaki Minato
  • Patent number: 4245154
    Abstract: An improved apparatus for plasma treatment of silicon semiconductor wafers is proposed in which the end point of the plasma etching or ashing can be readily detected by monitoring with an optical fiberscope penetrating the wall of the plasma reaction chamber with one terminal located inside the plasma reaction chamber with a condenser lens attached thereto and the other terminal located outside the plasma reaction chamber at a distanced position free from the influence of the high frequency electric field inherent to plasma generation which otherwise interferes with the photoelectric recording by the photocell connected to the outer terminal of the optical fiberscope.
    Type: Grant
    Filed: June 28, 1978
    Date of Patent: January 13, 1981
    Assignee: Tokyo Ohka Kogyo Kabushiki Kaisha
    Inventors: Akira Uehara, Hiroyuki Kiyota, Hisashi Nakane, Shozo Toda