Abstract: The embodiments of the invention relate to a device having a first substrate comprising a transistor; a second substrate; an insulating layer in between and adjoining the first and second substrates; and an opening within the second substrate, the opening being aligned with the transistor; wherein the transistor is configured to detect an electrical charge change within the opening. Other embodiments relate to a method including providing a substrate comprising a first part, a second part, and an insulating layer in between and adjoining the first and second parts; fabricating a transistor on the first part; and fabricating an opening within the second part, the opening being aligned with the transistor; wherein the transistor is configured to detect an electrical charge change within the opening.

Abstract: Embodiments of the invention provide a first component with a compliant interconnect bonded to a second component with a land pad by a metal to metal bond. In some embodiments, the first component may be a microprocessor die and the second component a package substrate.

Abstract: An embodiment of the invention relates to a portable or handheld device for performing NMR analysis. The device comprises a console and a strip which can be placed into the console through a slot or other means. The strip comprises a sample holding place and a microcoil for generating an excitation magnetic field across a sample in the sample holding space. A permanent magnet is provided either by the console or the strip and generates a static magnetic field which, together with the excitation magnetic field, creates NMR within the sample. Other embodiments of the invention also encompass method of performing NMR analysis using the portable device and method of making such devices.

Abstract: In various aspects, the present inventions provide methods for forming corrosion resistant oxide coatings on metals and/or improving the corrosion resistance of existing native oxide coatings. In various aspects, provided are methods for forming corrosion resistant oxide coatings on metals surfaces that are immersed in an aqueous solution. Various embodiments of various aspects of the present inventions can provide a scalable process for the formation of corrosion resistant coatings on metals in a manner that does not require high-vacuum technology, can be adapted to large structures, such as ships or aircraft, and in various aspects and embodiments can improve quality of existing oxide films on a metal or alloy surface.

Abstract: Embodiments of the invention provide a first component with a compliant interconnect bonded to a second component with a land pad by a metal to metal bond. In some embodiments, the first component may be a microprocessor die and the second component a package substrate.

Abstract: An apparatus includes a metallization region including a plurality of metal layers on a device layer of a substrate, a via extending through the substrate and the device layer, and a heat spreading and stress engineering region in the substrate and adjacent to the device layer. The via contacts a metal layer in the metallization region.

Abstract: In one embodiment, the present invention includes a hybrid device having a first die including a semiconductor device and a second die coupled to the first die, where the second die includes a magnetic structure. The first die may be a semiconductor substrate, while the second die may be a magnetic substrate, and the first die may be stacked on the second die, in one embodiment. Other embodiments are described and claimed.

Abstract: A method of forming channels on a die or other substrate. Also disclosed are liquid cooling systems including such channels.

Abstract: A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one embodiment, the thermoelectric elements are integrated between conductive interconnection elements on an active side of the die. In another embodiment, the thermoelectric elements are on a backside of the die and electrically connected to a carrier substrate on a front side of the die. In a further embodiment, the thermoelectric elements are formed on a secondary substrate and transferred to the die.

Abstract: Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.

Abstract: A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one embodiment, the thermoelectric elements are integrated between conductive interconnection elements on an active side of the die. In another embodiment, the thermoelectric elements are on a backside of the die and electrically connected to a carrier substrate on a front side of the die. In a further embodiment, the thermoelectric elements are formed on a secondary substrate and transferred to the die.

Abstract: In various aspects, provided are solid oxide fuel cells with an operational temperature of less than about 500° C. that can provide, in various embodiments, a power density of greater than about 0. 1 W/cm2 and/or have an ionic conductivity of greater than about 0.00001 ohm?1 cm?1. In various embodiments, provided are solid oxide fuel cells comprising a solid oxide electrolyte layer that is both an electronic and ionic conductor. In various aspects, provided are methods of making solid oxide fuel cells. In various aspects, provided are solid oxide materials comprising a polycrystalline ceramic layer less than about 100 nm thick having a ionic conductivity of greater than about 0.00001 ohm?1 cm?1 at a temperature less than about 500° C.

Abstract: Backside connections for 3D integrated circuits and methods to fabricate thereof are described. A stack of a first wafer over a second wafer that has a substrate of the first wafer on top of the stack, is formed. The substrate of the first wafer is thinned. A first dielectric layer is deposited on the thinned substrate. First vias extending through the substrate to the first wafer are formed in the first dielectric layer. A conductive layer is deposited in the first vias and on the first dielectric layer to form thick conductive lines. Second dielectric layer is formed on the conductive layer. Second vias extending to the conductive lines are formed in the second dielectric layer. Conductive bumps extending into the second vias and offsetting the first vias are formed on the second dielectric layer.

Abstract: A method of forming channels on a die or other substrate. Also disclosed are liquid cooling systems including such channels.

Abstract: A method of forming self-passivating interconnects. At least one of two mating bond structures is formed, at least in part, from an alloy of a first metal and a second metal (or other element). The second metal is capable of migrating through the first metal to free surfaces of the mating bond structures. During bonding, the two mating bond structures are bonded together to form an interconnect, and the second metal segregates to free surfaces of this interconnect to form a passivation layer. Other embodiments are described and claimed.

Abstract: A method of forming channels on a die or other substrate. Also disclosed are liquid cooling systems including such channels.

Abstract: An embodiment of the invention relates to a portable or handheld device for performing NMR analysis. The device comprises a console and a strip which can be placed into the console through a slot or other means. The strip comprises a sample holding place and a microcoil for generating an excitation magnetic field across a sample in the sample holding space. A permanent magnet is provided either by the console or the strip and generates a static magnetic field which, together with the excitation field, creates NMR within the sample. Other embodiments of the invention also encompass method of performing NMR analysis using the portable device and method of making such devices.

Abstract: Numerous embodiments of a stacked device filler and a method of formation are disclosed. In one embodiment, a method of forming a stacked device filler comprises forming a material layer between two or more substrates of a stacked device, and causing a reaction in at least a portion of the material, wherein the reaction may comprise polymerization, and the material layer may be one or a combination of materials, such as nonconductive polymer materials, for example.

Abstract: An embodiment of the invention relates to a device for performing NMR or ESR analysis. The device comprises a detection unit, a magnet, and a disk having a magnetic pattern. The detection unit comprises a sample holding space for holding a sample and a microcoil for detecting NMR or ESR signals generated within the sample. The magnet generates a static magnetic field within the sample. The disk and magnetic pattern, when rotating, generate an excitation magnetic field, which, together with the static magnetic field, creates an NMR or ESR within the sample. Other embodiments of the invention encompass methods for performing NMR or ESR analysis using the device and methods of making such devices.

Abstract: An embodiment of the invention relates to a portable or handheld device for performing NMR analysis. The device comprises a console and a strip which can be placed into the console through a slot or other means. The strip comprises a sample holding place and a microcoil for generating an excitation magnetic field across a sample in the sample holding space. A permanent magnet is provided either by the console or the strip and generates a static magnetic field which, together with the excitation magnetic field, creates NMR within the sample. Other embodiments of the invention also encompass method of performing NMR analysis using the portable device and method of making such devices.