Abstract: The invention provides a material surface treatment equipment, which is applied to a material substrate. The material surface treatment equipment includes a surface treatment device and at least one waveguide device. The surface treatment device is used to carry the material substrate to perform a surface treatment process. Each waveguide device is used for introducing electromagnetic waves to the material substrate to assist in performing the surface treatment process. Through the introduction of electromagnetic waves, the surface treatment process of the material substrate is easy to perform and can achieve the strengthening effect.

Abstract: A multi-chip device includes a first material within a substrate. The first material has a first coefficient of thermal expansion different than a second coefficient of thermal expansion of the substrate. A first chip overlies a first portion of the first material and a first portion of the substrate. A second chip overlies a second portion of the first material and a second portion of the substrate. The first material is between the first portion of the substrate and the second portion of the substrate.

Abstract: A method for making a semiconductor structure includes: providing a substrate with a contact feature thereon; forming a dielectric layer on the substrate; etching the dielectric layer to form an interconnect opening exposing the contact feature; forming a metal layer on the dielectric layer and outside of the contact feature; and forming a graphene conductive structure on the metal layer, the graphene conductive structure filling the interconnect opening, being electrically connected to the contact feature, and having at least one graphene layer that extends in a direction substantially perpendicular to the substrate.

Abstract: A semiconductor structure includes a dielectric layer over a substrate, a via conductor over the substrate and in the dielectric layer, and a first graphene layer disposed over the via conductor. In some embodiments, a top surface of the via conductor and a top surface of the dielectric layer are level. In some embodiments, the first graphene layer overlaps the via conductor from a top view. In some embodiments, the semiconductor structure further includes a second graphene layer under the via conductor and a third graphene layer between the dielectric layer and the via conductor. In some embodiments, the second graphene layer is between the substrate and the via conductor.

Abstract: A method for manufacturing a semiconductor structure includes forming a first interconnect feature in a first dielectric feature, the first interconnect feature including a first conductive element exposed from the first dielectric feature; forming a first cap feature over the first conductive element, the first cap feature including a first cap element which includes a two-dimensional material; forming a second dielectric feature with a first opening that exposes the first cap element; forming a barrier layer over the second dielectric feature while exposing the first cap element from the barrier layer; removing a portion of the first cap element exposed from the barrier layer; and forming a second conductive element in the first opening.

Abstract: The present invention relates to a Plasticizer, which is fabricated by mixing monomers of biodegradable polymer with bio-molecules subsequently to deal the mixture with thermal treatment. The Biodegradable material comprising the Plasticizer has high melt index which is contributive for the processing of thermal processing, and the microwave-tolerance and water-resistance of the material makes the material suitable for food packaging.

Abstract: The present invention relates to a Plasticizer, which is fabricated by mixing monomers of biodegradable polymer with bio-molecules subsequently to deal the mixture with thermal treatment. The Biodegradable material comprising the Plasticizer has high melt index which is contributive for the processing of thermal processing, and the microwave-tolerance and water-resistance of the material makes the material suitable for food packaging.

Abstract: A polyester based blend includes: a polyester to be formed into a polymer matrix for a packaging article when the polyester based blend is melted and extruded; an oxidative catalyst to be dispersed in the polymer matrix; and an additive of an aldehyde that is to be dispersed in the polymer matrix, that is catalytically reactive with oxygen at room temperature in the presence of the oxidative catalyst, and that has a melting point greater than room temperature. A packaging article made from the melt-extruded polyester based blend is also disclosed.

Abstract: The present invention relates to a Plasticizer, which is fabricated by mixing monomers of biodegradable polymer with bio-molecules subsequently to deal the mixture with thermal treatment. The Biodegradable material comprising the Plasticizer has high melt index which is contributive for the processing of thermal processing, and the microwave-tolerance and water-resistance of the material makes the material suitable for food packaging.

Abstract: A tool coupler/knife combination includes a sleeve and a casing slidably mounted in the sleeve and having a blade mounted therein. The blade is slidable relative to the casing to a positioning in which an end of the blade is exposed for cutting. A tool coupler is mounted to the sleeve for releasably engaging with a tool bit. The casing includes a receptacle for receiving a telescopic rod with a magnetic end for attracting screws. Longitudinal position of the casing relative to the sleeve may be adjusted to thereby change the arm of force for cutting objects or driving fasteners.

Abstract: A tool handle includes a polygonal first end and a rectangular second end adapted to engage with a tool bit. The first end has a plurality of spaced first arcuate corner sections. The second end has a plurality of spaced second arcuate corner sections. Each first arcuate corner section of the first end is connected via a skew connecting face to an associated arcuate corner section of the second end. A skew recessed area is formed between each two adjacent said connecting faces.

Abstract: A ratcheting tool includes a handle having a first drive end and a second end. An illumination device includes a base securely attached to the second end of the handle and a cover removably attached to the base. The base and the cover together define a compartment for receiving a lamp that is adapted to provide direct illumination to a fastener to be tightened/loosened by the ratcheting tool. The illumination device further includes a battery unit for supplying electricity to the lamp.