Patents by Inventor Shu-Cheng Yang

Shu-Cheng Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11997828
    Abstract: A vapor chamber and an assembly method thereof are provided. The vapor chamber includes a mesh structure including a main body and an extension part. The main body and the extension part have a capillary-wick structure, respectively. The extension part is extended outwardly from a side of the main body and folded along an intersection between the extension part and the main body. The extension part is stacked on the main body. An overlapping area is formed by stacking the extension part on the main body, and the overlapping area fails to contact with a support structure. The main body is disposed on a first concave of the lower case. The upper case covers the lower case and is assembled with the lower case. A second concave of the upper case and the first concave collaboratively form a space. The mesh structure is accommodated within the space.
    Type: Grant
    Filed: March 6, 2023
    Date of Patent: May 28, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventor: Shu-Cheng Yang
  • Publication number: 20240032236
    Abstract: A heat dissipation assembly is disclosed and includes a fan, a vapor chamber and a heat dissipation fin set. The fan includes a fan frame, an impeller and a fan cover. The impeller is disposed on the fan frame and accommodated in an accommodation space. The impeller includes plural metal blades and a hub, and the plural metal blades are radially arranged on the periphery of the hub to form a dense-metal-blade impeller. The fan cover is assembled with the fan frame to form an outlet, and the fan cover includes an inlet. The vapor chamber includes an upper plate and a lower plate assembled with each other. The upper plate or the lower plate is connected to the fan cover, and the vapor chamber and the fan cover are coplanar. The heat dissipation fin set is connected to the lower plate and spatially corresponding to the outlet.
    Type: Application
    Filed: November 7, 2022
    Publication date: January 25, 2024
    Inventors: Chin-Ting Chen, Chih-Wei Yang, Shu-Cheng Yang, Che-Wei Chang, Wen-Cheng Huang, Chin-Hung Lee, Chih-Wei Chan
  • Publication number: 20230209777
    Abstract: A vapor chamber and an assembly method thereof are provided. The vapor chamber includes a mesh structure including a main body and an extension part. The main body and the extension part have a capillary-wick structure, respectively. The extension part is extended outwardly from a side of the main body and folded along an intersection between the extension part and the main body. The extension part is stacked on the main body. An overlapping area is formed by stacking the extension part on the main body, and the overlapping area fails to contact with a support structure. The main body is disposed on a first concave of the lower case. The upper case covers the lower case and is assembled with the lower case. A second concave of the upper case and the first concave collaboratively form a space. The mesh structure is accommodated within the space.
    Type: Application
    Filed: March 6, 2023
    Publication date: June 29, 2023
    Inventor: Shu-Cheng Yang
  • Patent number: 11632877
    Abstract: A vapor chamber and an assembly method thereof are provided. The vapor chamber includes a mesh structure including a main body and an extension part. The main body and the extension part have a capillary-wick structure, respectively. The extension part is extended outwardly from a side of the main body and folded along an intersection between the extension part and the main body. The extension part is stacked on the main body. An overlapping area is formed by stacking the extension part on the main body, and the overlapping area fails to contact with a support structure. The main body is disposed on a first concave of the lower case. The upper case covers the lower case and is assembled with the lower case. A second concave of the upper case and the first concave collaboratively form a space. The mesh structure is accommodated within the space.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: April 18, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventor: Shu-Cheng Yang
  • Publication number: 20230021686
    Abstract: An internal structure of vapor chamber is provided. A first plate has an inner surface. A periphery of the first plate has a sealing edge extending outwardly; a level difference exists between the first plate and the sealing edge. Multiple supporting protrusions are formed on the inner surface of the first plate. A second plate has an inner surface spaced apart from the inner surface of the first plate. The brazing structure has a sealing portion and connecting portions, the sealing portion is fixed between the second plate and the sealing edges of the first plate, and the connecting portions are respectively disposed between the corresponding supporting portions of the first plate and of the second plate. The sealing portion is disposed around a periphery of the second plate to align and contact with the sealing edge.
    Type: Application
    Filed: October 4, 2022
    Publication date: January 26, 2023
    Inventors: Shih-Lin HUANG, Wen-Shiang CHEN, Shu-Cheng YANG
  • Patent number: 11009301
    Abstract: A heat dissipating fin assembly includes a bottom, a plurality of first heat dissipating fins, a plurality of second heat dissipating fins, an inner cover and an outer cover. The first heat dissipating fins extend from an inner end toward an outer end. The second heat dissipating fins are arranged between two of the first heat dissipating fins in staggered. The inner cover is disposed near the inner end and connected to the first heat dissipating fins. The outer cover is disposed near the outer end and connected to the second heat dissipating fins. The inner cover and the outer cover are separated to form an opening, and the dusts entering the heat dissipating fin assembly through the inner end are ejected via the opening. The second heat dissipating fins extend from around the opening to the outer end.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: May 18, 2021
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shu-Cheng Yang, Shih-Chou Chen
  • Publication number: 20210144886
    Abstract: A vapor chamber and an assembly method thereof are provided. The vapor chamber includes a mesh structure including a main body and an extension part. The main body and the extension part have a capillary-wick structure, respectively. The extension part is extended outwardly from a side of the main body and folded along an intersection between the extension part and the main body. The extension part is stacked on the main body. An overlapping area is formed by stacking the extension part on the main body, and the overlapping area fails to contact with a support structure. The main body is disposed on a first concave of the lower case. The upper case covers the lower case and is assembled with the lower case. A second concave of the upper case and the first concave collaboratively form a space. The mesh structure is accommodated within the space.
    Type: Application
    Filed: June 18, 2020
    Publication date: May 13, 2021
    Inventor: Shu-Cheng Yang
  • Publication number: 20200309470
    Abstract: A vapor chamber having a first plate, a second plate and a brazing structure is provided. The first plate has an outer surface and an inner surface. A periphery of the first plate has a sealing edge extending outwardly; a level difference exists between the first plate and the sealing edge. Multiple supporting portions are formed on the inner surface of the first plate. The second plate also has an outer surface and an inner surface spaced apart from the inner surface of the first plate, and the second plate covers the first plate to enclose a chamber. The brazing structure has a sealing portion and a plurality of connecting portions, the sealing portion is fixed between the second plate and the sealing edges of the first plate, and the connecting portions are respectively disposed between the corresponding supporting portions of the first plate and of the second plate.
    Type: Application
    Filed: June 15, 2020
    Publication date: October 1, 2020
    Inventors: Shih-Lin HUANG, Wen-Shiang CHEN, Shu-Cheng YANG
  • Publication number: 20200064082
    Abstract: A heat dissipating fin assembly includes a bottom, a plurality of first heat dissipating fins, a plurality of second heat dissipating fins, an inner cover and an outer cover. The first heat dissipating fins extend from an inner end toward an outer end. The second heat dissipating fins are arranged between two of the first heat dissipating fins in staggered. The inner cover is disposed near the inner end and connected to the first heat dissipating fins. The outer cover is disposed near the outer end and connected to the second heat dissipating fins. The inner cover and the outer cover are separated to form an opening, and the dusts entering the heat dissipating fin assembly through the inner end are ejected via the opening. The second heat dissipating fins extend from around the opening to the outer end.
    Type: Application
    Filed: October 29, 2019
    Publication date: February 27, 2020
    Inventors: Shu-Cheng YANG, Shih-Chou CHEN
  • Fan
    Patent number: 10385873
    Abstract: A fan includes a hub, a plurality of blades, and a heat dissipation module. The blades surround the hub. The heat dissipation module includes a plurality of fins. The fins are disposed around the hub with respect to the blades. The end face of each fin facing the blades includes a noise reduction structure. The noise reduction structure is an inclined plane.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: August 20, 2019
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shu-Cheng Yang, Ya-Ting Chang
  • FAN
    Publication number: 20170191501
    Abstract: A fan includes a hub, a plurality of blades, and a heat dissipation module. The blades surround the hub. The heat dissipation module includes a plurality of fins. The fins are disposed around the hub with respect to the blades. The end face of each fin facing the blades includes a noise reduction structure. The noise reduction structure is an inclined plane.
    Type: Application
    Filed: April 28, 2016
    Publication date: July 6, 2017
    Inventors: Shu-Cheng YANG, Ya-Ting CHANG
  • Publication number: 20150382500
    Abstract: A heat dissipating device includes a fan, a heat dissipating fin assembly and a block. The fan includes a fan frame, an impeller and a motor. The fan frame includes an outlet. The impeller and the motor are disposed in the fan frame, and the motor is connected with the impeller and drives the impeller to rotate. The heat dissipating fin assembly is disposed at the outlet and has a plurality of heat dissipating fins, which are arranged side by side so as to form a plurality of heat dissipating channels. The block is connected with the heat dissipating fin assembly and moveable between a first open position and a first close position. The block shields the heat dissipating channels when the block is located at the first closing position. A hole is configured on a side wall of the fan frame adjacent to the outlet.
    Type: Application
    Filed: April 30, 2015
    Publication date: December 31, 2015
    Inventors: Shih-Chou CHEN, Chih-Hsiang CHANG, Shu-Cheng YANG
  • Publication number: 20150377564
    Abstract: A heat dissipating fin assembly includes a bottom plate, a plurality of first heat dissipating fins, a plurality of second heat dissipating fins, an inner cover plate and an outer cover plate. The first heat dissipating fins extend from an inner end to an outer end. The second heat dissipating fins are located between two of the first heat dissipating fins. The inner cover plate is disposed at the inner end and connected to the first heat dissipating fins. The outer cover plate is disposed at the outer end and connected to the second heat dissipating fins. The outer cover plate and the inner cover plate are separated so as to form an opening. The second heat dissipating fins extend from around the opening to the outer end. The length of the first heat dissipating fins is larger than that of the second heat dissipating fins.
    Type: Application
    Filed: March 31, 2015
    Publication date: December 31, 2015
    Inventors: Shu-Cheng YANG, Chih-Hsiang CHANG, Shih-Chou CHEN
  • Patent number: 8247698
    Abstract: An exemplary electronic device includes a circuit board defining apertures therein, an electronic component arranged on the circuit board and surrounded by the apertures, a heat spreader arranged on the electronic component, and a latching mechanism fixing the heat spreader to the electronic component. The latching mechanism includes latching arms extending outwards from the heat spreader and elastic poles. Each latching arm defines a latching hole aligned with one of the apertures of the circuit board. The poles respectively extend through the apertures and the latching holes in turn. Each pole includes a main body engaged in the corresponding latching hole and a head resiliently abutting against the latching arm.
    Type: Grant
    Filed: May 7, 2010
    Date of Patent: August 21, 2012
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Ching-Bai Hwang, Hung-Nien Chiu, Shu-Cheng Yang
  • Publication number: 20110247861
    Abstract: An exemplary electronic device includes a circuit board defining apertures therein, an electronic component arranged on the circuit board and surrounded by the apertures, a heat spreader arranged on the electronic component, and a latching mechanism fixing the heat spreader to the electronic component. The latching mechanism includes latching arms extending outwards from the heat spreader and elastic poles. Each latching arm defines a latching hole aligned with one of the apertures of the circuit board. The poles respectively extend through the apertures and the latching holes in turn. Each pole includes a main body engaged in the corresponding latching hole and a head resiliently abutting against the latching arm.
    Type: Application
    Filed: May 7, 2010
    Publication date: October 13, 2011
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHING-BAI HWANG, HUNG-NIEN CHIU, SHU-CHENG YANG
  • Patent number: 7565923
    Abstract: A rotary total heat exchange apparatus includes at least an air-providing member, a first air passage and a second air passage, a sensible heat exchanger (21), and a total heat exchange wheel (1). The air-providing member provides a first airflow from outdoors and a second airflow from indoors into the rotary total heat exchange apparatus. The first and second air passages isolate from each other for guiding the first and second airflows respectively passing through. The sensible heat exchanger spans across the first and second air passages simultaneously for conducting a sensible heat exchange between the first and second airflows. The total heat exchange wheel is capable of rotating through the first and second air passages for conducting a total heat exchange between the first and second airflows.
    Type: Grant
    Filed: August 25, 2005
    Date of Patent: July 28, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Shu-Cheng Yang, Chih-Peng Lee
  • Patent number: 7445038
    Abstract: A rotary total heat exchange apparatus (30) includes at least an air-providing member (3301), a first air passage and a second air passage, and a total heat exchange wheel (3311). The air-providing member provides a first airflow from outdoors and a second airflow from indoors into the rotary total heat exchange apparatus. The first and second air passages isolate from each other for guiding the first and second airflows respectively passing through the heat exchange wheel. The total heat exchange wheel faces to the first and second airflows provided by the air-providing member, and is capable of rotating through the first and second air passages for conducting a total heat exchange between the first and second airflows.
    Type: Grant
    Filed: October 20, 2005
    Date of Patent: November 4, 2008
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Ming-Chun Lee, Lien-Jin Chiang, Shu-Cheng Yang
  • Publication number: 20060213636
    Abstract: A rotary total heat exchange apparatus (30) includes at least an air-providing member (3301), a first air passage and a second air passage, and a total heat exchange wheel (3311). The air-providing member provides a first airflow from outdoors and a second airflow from indoors into the rotary total heat exchange apparatus. The first and second air passages isolate from each other for guiding the first and second airflows respectively passing through the heat exchange wheel. The total heat exchange wheel faces to the first and second airflows provided by the air-providing member, and is capable of rotating through the first and second air passages for conducting a total heat exchange between the first and second airflows.
    Type: Application
    Filed: October 20, 2005
    Publication date: September 28, 2006
    Inventors: Tay-Jian Liu, Ming-Chun Lee, Lien-Jin Chiang, Shu-Cheng Yang
  • Publication number: 20060137852
    Abstract: A rotary total heat exchange apparatus includes at least an air-providing member, a first air passage and a second air passage, a sensible heat exchanger (21), and a total heat exchange wheel (1). The air-providing member provides a first airflow from outdoors and a second airflow from indoors into the rotary total heat exchange apparatus. The first and second air passages isolate from each other for guiding the first and second airflows respectively passing through. The sensible heat exchanger spans across the first and second air passages simultaneously for conducting a sensible heat exchange between the first and second airflows. The total heat exchange wheel is capable of rotating through the first and second air passages for conducting a total heat exchange between the first and second airflows.
    Type: Application
    Filed: August 25, 2005
    Publication date: June 29, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Shu-Cheng Yang, Chih-Peng Lee