Patents by Inventor Shu-Hua Lin
Shu-Hua Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11997842Abstract: A fan-out package includes a redistribution structure having redistribution-side bonding structures, a plurality of semiconductor dies including a respective set of die-side bonding structures that is attached to a respective subset of the redistribution-side bonding structures through a respective set of solder material portions, and an underfill material portion laterally surrounding the redistribution-side bonding structures and the die-side bonding structures of the plurality of semiconductor dies. A subset of the redistribution-side bonding structures is not bonded to any of the die-side bonding structures of the plurality of semiconductor dies and is laterally surrounded by the underfill material portion, and is used to provide uniform distribution of the underfill material during formation of the underfill material portion.Type: GrantFiled: August 31, 2021Date of Patent: May 28, 2024Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Ming-Chih Yew, Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng
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Publication number: 20240163947Abstract: A method for multi-link operation (MLO) is provided. The method for MLO may be applied to an apparatus. The method for MLO may include the following steps. A multi-chip controller of the apparatus may assign different data to a plurality of chips of the apparatus, wherein each chip corresponds to one link of multi-links. Each chip may determine whether transmission of the assigned data has failed. A first chip of the chips may transmit the assigned data to an access point (AP) in response to the first chip determining that the transmission of the assigned data has not failed.Type: ApplicationFiled: November 8, 2023Publication date: May 16, 2024Inventors: Cheng-Ying WU, Wei-Wen LIN, Shu-Min CHENG, Hui-Ping TSENG, Chi-Han HUANG, Chih-Chun KUO, Yang-Hung PENG, Hao-Hua KANG
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Patent number: 11984378Abstract: A semiconductor package structure includes an interposer substrate formed over a package substrate. The structure also includes a die disposed over the interposer substrate. The structure also includes a first heat spreader disposed over the package substrate. The structure also includes a second heat spreader disposed over the die and connected to the first heat spreader. The coefficient of thermal expansion (CTE) of the first heat spreader and the coefficient of thermal expansion of the second heat spreader are different.Type: GrantFiled: May 13, 2021Date of Patent: May 14, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shu-Shen Yeh, Po-Yao Lin, Chin-Hua Wang, Yu-Sheng Lin, Shin-Puu Jeng
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Publication number: 20240153839Abstract: A semiconductor package structure includes an interposer substrate formed over a package substrate. The structure also includes a die disposed over the interposer substrate. The structure also includes a first heat spreader disposed over the package substrate. The structure also includes a second heat spreader disposed over the die and connected to the first heat spreader. The coefficient of thermal expansion (CTE) of the first heat spreader and the coefficient of thermal expansion of the second heat spreader are different.Type: ApplicationFiled: January 12, 2024Publication date: May 9, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shu-Shen YEH, Po-Yao LIN, Chin-Hua WANG, Yu-Sheng LIN, Shin-Puu JENG
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Patent number: 11973001Abstract: Semiconductor devices and methods of manufacture which utilize lids in order to constrain thermal expansion during annealing are presented. In some embodiments lids are placed and attached on encapsulant and, in some embodiments, over first semiconductor dies. As such, when heat is applied, and the encapsulant attempts to expand, the lid will work to constrain the expansion, reducing the amount of stress that would otherwise accumulate within the encapsulant.Type: GrantFiled: May 5, 2023Date of Patent: April 30, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shu-Shen Yeh, Chin-Hua Wang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng
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Patent number: 11967582Abstract: A multi-chip device includes a first material within a substrate. The first material has a first coefficient of thermal expansion different than a second coefficient of thermal expansion of the substrate. A first chip overlies a first portion of the first material and a first portion of the substrate. A second chip overlies a second portion of the first material and a second portion of the substrate. The first material is between the first portion of the substrate and the second portion of the substrate.Type: GrantFiled: April 24, 2023Date of Patent: April 23, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Chin-Hua Wang, Po-Chen Lai, Shu-Shen Yeh, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng
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Patent number: 11967547Abstract: Some embodiments relate to a semiconductor structure. The semiconductor structure includes a first substrate including a first plurality of conductive pads that are laterally spaced apart from one another on the first substrate. A first plurality of conductive bumps are disposed on the first plurality of conductive pads, respectively. A multi-tiered solder-resist structure is disposed on the first substrate and arranged between the first plurality of conductive pads. The multi-tiered solder-resist structure has different widths at a different heights over the first substrate and contacts sidewalls of the first plurality of conductive bumps to separate the first plurality of conductive bumps from one another.Type: GrantFiled: August 26, 2021Date of Patent: April 23, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chin-Hua Wang, Shu-Shen Yeh, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng
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Organometallic complex, catalyst composition employing the same, and method for preparing polyolefin
Patent number: 11958929Abstract: An organometallic complex, a catalyst composition employing the same, and a method for preparing polyolefin are provided. The organometallic compound has a structure represented by Formula (I) wherein M is Ti, Zr, or Hf; X is —O—, or —NR6—; R1 and R2 are independently hydrogen, C1-6 alkyl group, C6-12 aryl group, or R1 and R2 are combined with the carbon atoms, to which they are attached, to form an C6-12 aryl moiety; R3, R4 and R5 are independently fluoride, chloride, bromide, C1-6 alkyl group, C6-12 aryl group, C3-6 hetero aryl group, C7-13 aryl alkyl group or C7-12 alkyl aryl group; and R6 is hydrogen, C6-12 aryl group or C7-12 alkyl aryl group.Type: GrantFiled: June 24, 2022Date of Patent: April 16, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chien-Wei Hsu, Jyun-Wei Hong, Pao Tsern Lin, Shu-Hua Chan -
Publication number: 20240120294Abstract: A chip package includes a substrate, a semiconductor chip, and a thermal conductive structure. The chip package includes a first and a second support structures below the thermal conductive structure. The first and the second support structures connect the substrate and corners of the thermal conductive structure. The thermal conductive structure has a side edge connecting the first and the second support structures. The first and the second support structures and the side edge together define of an opening exposing a space surrounding the semiconductor chip. The first and the second support structures are disposed along a side of the substrate. The first support structure is laterally separated from the side of the substrate by a first lateral distance. The side edge of the thermal conductive structure is laterally separated from the side of the substrate by a second lateral distance different than the first lateral distance.Type: ApplicationFiled: December 21, 2023Publication date: April 11, 2024Inventors: Shu-Shen YEH, Chin-Hua WANG, Kuang-Chun LEE, Po-Yao LIN, Shyue-Ter LEU, Shin-Puu JENG
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Publication number: 20240096731Abstract: A semiconductor package is provided, which includes a first chip disposed over a first package substrate, a molding compound surrounding the first chip, a first thermal interface material disposed over the first chip and the molding compound, a heat spreader disposed over the thermal interface material, and a second thermal interface material disposed over the heat spreader. The first thermal interface material and the second thermal interface material have an identical width.Type: ApplicationFiled: November 29, 2023Publication date: March 21, 2024Inventors: Chin-Hua WANG, Po-Yao LIN, Feng-Cheng HSU, Shin-Puu JENG, Wen-Yi LIN, Shu-Shen YEH
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Publication number: 20240088061Abstract: A method includes forming a first dielectric layer, forming a first redistribution line comprising a first via extending into the first dielectric layer, and a first trace over the first dielectric layer, forming a second dielectric layer covering the first redistribution line, and patterning the second dielectric layer to form a via opening. The first redistribution line is revealed through the via opening. The method further includes forming a second via in the second dielectric layer, and a conductive pad over and contacting the second via, and forming a conductive bump over the conductive pad. The conductive pad is larger than the conductive bump, with a first center of conductive pad being offsetting from a second center of the conductive bump. The second via is further offset from the second center of the conductive bump.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Inventors: Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng, Chia-Hsiang Lin
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Publication number: 20240088095Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.Type: ApplicationFiled: November 24, 2023Publication date: March 14, 2024Inventors: Chin-Hua WANG, Shin-Puu JENG, Po-Yao LIN, Po-Chen LAI, Shu-Shen YEH, Ming-Chih YEW, Yu-Sheng LIN
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Publication number: 20240087974Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.Type: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Sheng Lin, Chin-Hua Wang, Shu-Shen Yeh, Chien-Hung Chen, Po-Yao Lin, Shin-Puu Jeng
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Publication number: 20240088063Abstract: A semiconductor package provided herein includes a wiring substrate, a semiconductor component, conductor terminals, a bottom stiffener and a top stiffener. The wiring substrate has a first surface and a second surface opposite to the first surface. The semiconductor component is disposed on the first surface of the wiring substrate. The conductor terminals are disposed on the second surface of the wiring substrate and electrically connected to the semiconductor component through the wiring substrate. The bottom stiffener is disposed on the second surface of the wiring substrate and positioned between the conductor terminals. The top stiffener is disposed on the first surface of the wiring substrate. The top stiffener is laterally spaced further away from the semiconductor component than the bottom stiffener.Type: ApplicationFiled: November 23, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chin-Hua Wang, Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng
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Patent number: 8769845Abstract: A shoe that is conveniently put on and taken off includes an outsole, an upper, a supporting piece, and a guiding piece. The upper is attached on the outsole and has a counter and a collar extending upward from the counter and configured as a shoehorn. The supporting piece is attached to the counter and the collar of the upper. The guiding piece is attached to an instep of the upper. Because of the supporting piece having a predetermined hardness and the collar having a shape like a shoehorn, the rear of the upper can be served as a shoehorn for helping a user's foot in slipping into the shoe. In addition, the guiding piece can avoid the instep of the upper from becoming crease and unsmooth. As a result, the shoe is convenient for the user to put on without bending his back and using his hand.Type: GrantFiled: January 18, 2011Date of Patent: July 8, 2014Inventor: Shu-Hua Lin
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Patent number: 8418317Abstract: A hinge includes a base, an arm, a mounting member, a hinge spring, a fixing pin member, and a damping device. Two ends of the arm are pivotably connected to the base and the mounting member, with the hinge spring exerting elastic force on the base and the arm. The damping device is mounted in the base and includes a fixed seat mounted in the base, a sliding block movably received in the fixed seat, a damping member mounted between the sliding block and the fixing pin member and abutting the base, and an elastic element. The sliding block includes a front portion facing the arm and a rear portion connected to the elastic element pressing against the fixed seat.Type: GrantFiled: January 21, 2011Date of Patent: April 16, 2013Assignee: Kunshan Huhua Metal Products Co., Ltd.Inventors: Yi Tai Wu, Hsin Hung Lin, Shu Hua Lin, Shu Jiuan Lin
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Patent number: 8276241Abstract: A hinge includes a base, a crank, a bottom board, a crank engagement seat, and a fixed seat. The crank is pivotably connected to the base. The bottom board includes at least one retaining portion, a first rivet hole and a vertical elongated hole. The crank engagement seat is connected to the crank and located between the fixed seat and the bottom board. The crank engagement seat includes first and second through-holes and a second rivet hole. The fixed seat includes first and second adjusting holes. A first adjusting member is extended through the first adjusting hole and the first through-hole into the first rivet hole. A second adjusting member is extended through the second adjusting hole into the second rivet hole. The bottom board and the crank engagement seat can be slightly moved in the vertical direction. The crank engagement seat can be slightly moved in the horizontal direction.Type: GrantFiled: January 17, 2011Date of Patent: October 2, 2012Assignee: Kunshan Huhua Metal Products Co., Ltd.Inventors: Yi Tai Wu, Hsin Hung Lin, Shu Hua Lin, Shu Jiuan Lin
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Publication number: 20120180338Abstract: A shoe that is conveniently put on and taken off includes an outsole, an upper, a supporting piece, and a guiding piece. The upper is attached on the outsole and has a counter and a collar extending upward from the counter and configured as a shoehorn. The supporting piece is attached to the counter and the collar of the upper. The guiding piece is attached to an instep of the upper. Because of the supporting piece having a predetermined hardness and the collar having a shape like a shoehorn, the rear of the upper can be served as a shoehorn for helping a user's foot in slipping into the shoe. In addition, the guiding piece can avoid the instep of the upper from becoming crease and unsmooth. As a result, the shoe is convenient for the user to put on without bending his back and using his hand.Type: ApplicationFiled: January 18, 2011Publication date: July 19, 2012Inventor: Shu-Hua LIN
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Publication number: 20120174338Abstract: A hinge includes a base, an arm, a mounting member, a hinge spring, a fixing pin member, and a damping device. Two ends of the arm are pivotably connected to the base and the mounting member, with the hinge spring exerting elastic force on the base and the arm. The damping device is mounted in the base and includes a fixed seat mounted in the base, a sliding block movably received in the fixed seat, a damping member mounted between the sliding block and the fixing pin member and abutting the base, and an elastic element. The sliding block includes a front portion facing the arm and a rear portion connected to the elastic element pressing against the fixed seat.Type: ApplicationFiled: January 21, 2011Publication date: July 12, 2012Inventors: Yi Tai WU, Hsin Hung LIN, Shu Hua LIN, Shu Jiuan LIN
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Patent number: D676641Type: GrantFiled: May 25, 2011Date of Patent: February 26, 2013Inventor: Shu-Hua Lin