Abstract: A 2D layered thin film structure is disclosed. The 2D layered thin film structure can be applied to the growth of monocrystalline or polycrystalline group III nitrides and other 2D materials. The 2D layered thin film structure can be easily separated from the 2D layered thin film structure growth substrate, so that a single or composite nanopillar array structure formed by the monocrystalline or polycrystalline group III nitride or other 2D materials, or the 2D layered thin film structure can be transferred to any other substrate. In addition, the 2D layered thin film structure has excellent light transmittance, flexibility and component integration.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A fan module for failure backup includes a flow guide structure and a first and a second fan disposed coaxially. The first and second fans are accommodated in the flow guide structure, and the flow guide structure has an air inlet and two vents respectively corresponding to the first and the second fan. The two vents respectively have a movable cover plate. The first and the second fan operate at a low speed in a normal state, such that the cover plate assumes an open state to provide a low speed air flow. When one of the fans fails to operate, the cover plate thereof assumes a closed state, and the other fan operates in a high speed to provide a high speed air flow, thereby achieving a purpose of failure backup.

Abstract: A heat sink includes a base, a set of fins mounted to the base and a plurality of fixing portions, wherein the fixing portions extend from a surface of the base and the set of fins are mounted on an opposite surface of the base. The heat sink is secured to a printed circuit board with at least one heat generating component through the fixing portion of the base. The heat sink is improved by forming one or more slots at lateral sides of the base such that one or more deformable portions can be defined on the base. Thus, the deformable length of the base is increased and the heat stress is relaxed.

Abstract: A miniaturized fan module can be accommodated in an electronic system (such as a server) to provide heat dissipation. The miniaturized fan module has a smaller structural size than that of a conventional fan module, such that a larger bump-preventing buffer space between the miniaturized fan module and a framework of the server is provided for preventing the fan module from bumping against the server framework due to vibration generated in practical operation, without degrading a heat dissipating effect and structural strength of the fan module.

Abstract: A radiator structure includes a radiator frame, a radiator and a plurality of elastic latch members. The radiator frame is mounted onto a main board corresponding to an electronic element, and has a plurality of coupling sections and an opening corresponding to the electronic element and the surface of the electronic element exceeds its peripheral edges. The radiator is mounted on the radiator frame in contact with the surface of the electronic element, and has a plurality of latch sections corresponding to the coupling sections. The elastic latch member coupled on the latch section is bent to form a force applying section, a latch arm and a swinging arm. After the force applying section receives a force, the swinging arm coupled on the latch section is turned to enable the latch arm to latch on the coupling section thereby to anchor the radiator on the radiator frame to disperse heat.

Abstract: A heat sink includes a base, a set of fins and at least an elastic fixing member mounted on a surface of the base. The elastic fixing member includes an elastic sheet mounted on the base, a supporting portion disposed on the elastic sheet and a fixing portion disposed on the supporting portion. The heat sink is secured to a printed circuit board through the fixing portion of the elastic fixing member, with the base of the heat sink being in direct contact with a heat generating component mounted on the printed circuit board. The distance between the base of the heat sink and the heat generating component can be controlled so as to even pressure on the heat generating component and efficiently decrease heat stress.

Abstract: A heat sink includes a base, a set of fins mounted to the base and a plurality of fixing portions, wherein the fixing portions extend from a surface of the base and the set of fins are mounted on an opposite surface of the base. The heat sink is secured to a printed circuit board with at least one heat generating component through the fixing portion of the base. The heat sink is improved by forming one or more slots at lateral sides of the base such that one or more deformable portions can be defined on the base. Thus, the deformable length of the base is increased and the heat stress is relaxed.

Abstract: A radiation board consists of a case and a lid. The case has a plurality of circulation channels formed on an inner wall. The lid seals the case to confine an operation fluid in the circulation channels of the case. The lid has miniature flutes corresponding to the circulation channels. Heat generated by a heat-generating element during operation is transferred through the lid to the operation fluid to vaporize the operation fluid. The miniature flutes help to condense the vaporized operation fluid into a liquid again. The operation fluid circulates in the case through the circulation channels to evenly distribute heat to the entire device. The radiation board is easy to fabricate at a low cost.

Abstract: A serial fan set and rotation speed-matching curve generation method thereof are provided. The serial fan set comprises a rotation speed control module, a first fan and a second fan, in which the rotation speed control module is used to receive the power signal and produce the rotation speed driving signal corresponding to the power signal in accordance with the relations of the rotation speed-matching curve, so that the first fan and the second fan are operated at the matching rotation speed, thus producing the optimum operation efficiency and achieving the purpose of controlling the serial fan set.

Abstract: A serial fan set and rotation speed-matching curve generation method thereof are provided. The serial fan set comprises a rotation speed control module, a first fan and a second fan, in which the rotation speed control module is used to receive the power signal and produce the rotation speed driving signal corresponding to the power signal in accordance with the relations of the rotation speed-matching curve, so that the first fan and the second fan are operated at the matching rotation speed, thus producing the optimum operation efficiency and achieving the purpose of controlling the serial fan set.

Abstract: A fan fixation structure for a server is provided, comprising a first scarfing portion disposed on the server, a first connection portion disposed on the server, a second scarfing portion disposed at a rear end of the fan and may be scarfed to the first scarfing portion, a first extension member disposed at a front end of the fan and has a proper elasticity, a second connection portion formed integrally with the first extension member and movable back and forth with the extension member between a first position and a second position and capable of locking with the first connection portion at the first position. As such, a user may rapidly detach or install each fan from or into the server separately without any tool.

Abstract: A fan-driven heat dissipating device with an enhanced air blowing efficiency is provided, which is designed for use in conjunction with a casing of an electronic system, such as a server, for providing the server with a fan-driven heat-dissipating function, and which is characterized by the provision of a special casing structure that allows the maximum allowable blade length of the fan unit to be increased as compared to the prior art, allowing the fan unit to provide an enhanced air blowing efficiency so that it can more efficiently blow away the heat produced by the server during operation.

Abstract: A closed loop heat dissipation apparatus includes a heat transfer seat containing an operation fluid, a seal lid attaching to a heat generating element and sealing one side of the heat transfer seat to hold the operation fluid therein, a tube made of flexible metal to couple on the heat transfer seat in a bendable manner and a radiation fin assembly mounted on the tube. The operation fluid absorbs the heat energy of the heat generating element and circulates in the tube to evenly distribute the heat energy, and is condensed to liquid phase to flow back to the heat transfer seat. The apparatus may be fabricated at a lower cost and achieve an improved heat dissipation effect.

Abstract: A miniaturized fan module can be accommodated in an electronic system (such as a server) to provide heat dissipation. The miniaturized fan module has a smaller structural size than that of a conventional fan module, such that a larger bump-preventing buffer space between the miniaturized fan module and a framework of the server is provided for preventing the fan module from bumping against the server framework due to vibration generated in practical operation, without degrading a heat dissipating effect and structural strength of the fan module.

Abstract: A radiator structure includes a radiator frame, a radiator and a plurality of elastic latch members. The radiator frame is mounted onto a main board corresponding to an electronic element, and has a plurality of coupling sections and an opening corresponding to the electronic element and the surface of the electronic element exceeds its peripheral edges. The radiator is mounted on the radiator frame in contact with the surface of the electronic element, and has a plurality of latch sections corresponding to the coupling sections. The elastic latch member coupled on the latch section is bent to form a force applying section, a latch arm and a swinging arm. After the force applying section receives a force, the swinging arm coupled on the latch section is turned to enable the latch arm to latch on the coupling section thereby to anchor the radiator on the radiator frame to disperse heat.

Abstract: A radiator, adopted on electronic devices with radiator fans installed in series, includes a case, two or more radiator fans and a membrane check valve. The radiator fans are located on the inner wall surface of the case. The membrane check valve has a frame, at least one bracing bracket and membrane petals. The frame is located between the radiator fan and the inner wall surface of the case. The bracing bracket is located in the frame to form a plurality of cells with the frame. The membrane petals' one end attaches to one side of the frame and is more directed towards air outlets of the radiator fans than the bracing bracket. When any radiator fans stops operation, air inside the electronic devices flow outwards in the positive direction to balance the pressure and prevent heat dissipation efficiency of the electronic devices from dropping excessively.

Abstract: A radiator, adopted on electronic devices with radiator fans installed in series, includes a case, two or more radiator fans and a membrane check valve. The radiator fans are located on the inner wall surface of the case. The membrane check valve has a frame, at least one bracing bracket and membrane petals. The frame is located between the radiator fan and the inner wall surface of the case. The bracing bracket is located in the frame to form a plurality of cells with the frame. The membrane petals' one end attaches to one side of the frame and is more directed towards air outlets of the radiator fans than the bracing bracket. When any radiator fans stops operation, air inside the electronic devices flow outwards in the positive direction to balance the pressure and prevent heat dissipation efficiency of the electronic devices from dropping excessively.

Abstract: A central processing unit (CPU) that has a die on one side and a radiator mounting onto the side of the CPU where the die is located includes a protection wall surrounding the die. The protection wall prevents the radiator from directly hitting the CPU during mounting thereby protects the CPU from being damaged and facilitates installation of the radiator.

Abstract: A plate evaporator includes a first thermal conductive element and a second thermal conducive element. The rim of the first thermal conductive element is formed with a first joining portion. The second thermal conductive element is like a cap having a second joining portion at the rim and correspondent to the first joining portion of the first thermal conductive element. Therefore, upon assembling the two thermal conductive elements, the first and second joining portions are engaged. When brazing, only the joining portions are at high temperature. The temperature rise does not apply to the whole thermal conductive elements and does not influence the strength of the structure.