Patents by Inventor SHU-KWAN LAU
SHU-KWAN LAU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220195617Abstract: An apparatus as disclosed herein relates to a chamber body design for use within a thermal deposition chamber, such as an epitaxial deposition chamber. The chamber body is a segmented chamber body design and includes an inject ring and a base plate. The base plate includes a substrate transfer passage and one or more exhaust passages disposed therethrough. The inject ring includes a plurality of gas inject passages disposed therethrough. The inject ring is disposed on top of the base plate and attached to the base plate. The one or more exhaust passages and the gas inject passages are disposed opposite one another. One or more seal scaling grooves are formed in both the base plate and the inject ring to enable the inject ring and the base plate to seal to one another as well as other components within the process chamber.Type: ApplicationFiled: December 22, 2020Publication date: June 23, 2022Inventors: Shu-Kwan LAU, Zhiyuan YE, Richard O. COLLINS, Brian Hayes BURROWS
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Publication number: 20220155148Abstract: An apparatus for controlling temperature profile of a substrate within an epitaxial chamber includes a bottom center pyrometer and a bottom outer pyrometer to respectively measure temperatures at a center location and an outer location of a first surface of a susceptor of an epitaxy chamber, a top center pyrometer and a top outer pyrometer to respectively measure temperatures at a center location and an outer location of a substrate disposed on a second surface of the susceptor opposite the first surface, a first controller to receive signals, from the bottom center pyrometer and the bottom outer pyrometer, and output a feedback signal to a first heating lamp module that heats the first surface based on the measured temperatures of the first surface, and a second controller to receive signals, from the top center pyrometer, the top outer pyrometer, the bottom center pyrometer, and the bottom outer pyrometer, and output a feedback signal to a second heating lamp module that heats the substrate based on the meaType: ApplicationFiled: June 29, 2020Publication date: May 19, 2022Inventors: Zuoming ZHU, Shu-Kwan LAU, Enle CHOO, Ala MORADIAN, Flora Fong-Song CHANG, Maxim D. SHAPOSHNIKOV, Bindusagar MARATH SANKARATHODI, Zhepeng CONG, Zhiyuan YE, Vilen K. NESTOROV, Surendra Singh SRIVASTAVA, Saurabh CHOPRA, Patricia M. LIU, Errol Antonio C. SANCHEZ, Jenny C. LIN, Schubert S. CHU
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Publication number: 20220090293Abstract: The present invention provides methods and apparatus for processing semiconductor substrates in an epitaxy chamber configured to map a temperature profile for both substrates and interior chamber components. In one embodiment, the semiconductor processing chamber has a body having ceiling and a lower portion defining an interior volume. A substrate support is disposed in the interior volume. A mounting plate is coupled to the ceiling outside the interior volume. A movement assembly is coupled to the mounting plate. A sensor is coupled to the movement assembly and moveable relative to the ceiling. The sensor is configured to detect a temperature location in the interior volume.Type: ApplicationFiled: September 21, 2020Publication date: March 24, 2022Inventors: Ala MORADIAN, Zuoming ZHU, Patricia M. LIU, Shu-Kwan LAU, Flora Fong-Song CHANG, Enle CHOO, Zhiyuan YE
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Patent number: 11261538Abstract: The present invention provides methods and apparatus for processing semiconductor substrates in an epitaxy chamber configured to map a temperature profile for both substrates and interior chamber components. In one embodiment, the semiconductor processing chamber has a body having ceiling and a lower portion defining an interior volume. A substrate support is disposed in the interior volume. A mounting plate is coupled to the ceiling outside the interior volume. A movement assembly is coupled to the mounting plate. A sensor is coupled to the movement assembly and moveable relative to the ceiling. The sensor is configured to detect a temperature location in the interior volume.Type: GrantFiled: September 21, 2020Date of Patent: March 1, 2022Assignee: Applied Materials, Inc.Inventors: Ala Moradian, Zuoming Zhu, Patricia M. Liu, Shu-Kwan Lau, Flora Fong-Song Chang, Enle Choo, Zhiyuan Ye
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Patent number: 11177144Abstract: Embodiments of the present disclosure provide a thermal process chamber that includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate alters temperature profile. The shape of the beam spot produced by the spot heating module can be modified without making changes to the optics of the spot heating module.Type: GrantFiled: May 9, 2019Date of Patent: November 16, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Shu-Kwan Lau, Zhiyuan Ye, Zuoming Zhu, Koji Nakanishi, Toshiyuki Nakagawa, Nyi O. Myo, Schubert S. Chu
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Publication number: 20210285105Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.Type: ApplicationFiled: May 26, 2021Publication date: September 16, 2021Inventors: Shu-Kwan LAU, Koji NAKANISHI, Toshiyuki NAKAGAWA, Zuoming ZHU, Zhiyuan YE, Joseph M. RANISH, Nyi O. MYO, Errol Antonio C. SANCHEZ, Schubert S. CHU
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Patent number: 11060203Abstract: Embodiments disclosed herein describe a liner assembly including a plurality of individually separated gas passages. The liner assembly provides control of flow parameters, such as velocity, density, direction and spatial location, across a substrate being processed. The processing gas across the substrate being processed may be specially tailored for individual processes with a liner assembly according to the present embodiments.Type: GrantFiled: August 13, 2015Date of Patent: July 13, 2021Assignee: Applied Materials, Inc.Inventors: Shu-Kwan Lau, Mehmet Tugrul Samir, Aaron Miller
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Patent number: 11021795Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.Type: GrantFiled: October 25, 2018Date of Patent: June 1, 2021Assignee: Applied Materials, Inc.Inventors: Shu-Kwan Lau, Koji Nakanishi, Toshiyuki Nakagawa, Zuoming Zhu, Zhiyuan Ye, Joseph M. Ranish, Nyi O. Myo, Errol Antonio C. Sanchez, Schubert S. Chu
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Patent number: 10995419Abstract: Embodiment disclosed herein include a liner assembly, comprising an injector plate liner, a gas injector liner coupled to the injector plate liner, an upper process gas liner coupled to the gas injector liner, a lower process gas liner coupled to the upper process gas liner, and an injector plate positioned between the injector plate liner and the upper process gas liner, wherein a cooling fluid channel is formed in the injector plate adjacent to the gas injector liner.Type: GrantFiled: May 31, 2019Date of Patent: May 4, 2021Assignee: Applied Materials, Inc.Inventors: Brian H. Burrows, Ala Moradian, Kartik Shah, Shu-Kwan Lau
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Publication number: 20210028075Abstract: A method for processing a substrate within a processing chamber comprises receiving a first radiation signal corresponding to a film on a target element disposed within the processing chamber, analyzing the first radiation signal, and controlling the processing of the substrate based on the analyzed first radiation signal. The processing chamber includes a substrate support configured to support the substrate within a processing volume and a controller coupled to a first sensing device configured to receive the first radiation signal.Type: ApplicationFiled: July 24, 2020Publication date: January 28, 2021Inventors: Zuoming ZHU, Shu-Kwan LAU, Ala MORADIAN, Enle CHOO, Flora Fong-Song CHANG, Vilen K. NESTOROV, Zhiyuan YE, Bindusagar MARATH SANKARATHODI, Maxim D. SHAPOSHNIKOV, Surendra Singh SRIVASTAVA, Zhepeng CONG, Patricia M. LIU, Errol C. SANCHEZ, Jenny C. LIN, Schubert S. CHU, Balakrishnam R. JAMPANA
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Publication number: 20200373195Abstract: Embodiments of the disclosure include methods and apparatus for a thermal chamber with a low thermal mass. In one embodiment, a chamber is disclosed that includes a body, a susceptor positioned within the body, a first set of heating devices positioned in an upper portion of the body above the susceptor and a second set of heating devices positioned in a lower portion of the body below the susceptor, wherein each of the first set of heating devices have a heating element having a longitudinal axis extending in a first direction, and each of the second set of heating devices have a heating element having a longitudinal axis extending in a second direction that is orthogonal to the first direction, and wherein each of the heating elements have ends that are exposed to ambient environment.Type: ApplicationFiled: April 21, 2020Publication date: November 26, 2020Inventors: Shu-Kwan Lau, Zhiyuan Ye, Martin A. Hilkene
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Publication number: 20200332437Abstract: Embodiment disclosed herein include a liner assembly, comprising an injector plate liner, a gas injector liner coupled to the injector plate liner, an upper process gas liner coupled to the gas injector liner, a lower process gas liner coupled to the upper process gas liner, and an injector plate positioned between the injector plate liner and the upper process gas liner, wherein a cooling fluid channel is formed in the injector plate adjacent to the gas injector liner.Type: ApplicationFiled: May 31, 2019Publication date: October 22, 2020Inventors: Brian H. BURROWS, Ala MORADIAN, Kartik SHAH, Shu-Kwan LAU
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Patent number: 10760161Abstract: Embodiments of the present invention provide a liner assembly including an inject insert. The inject insert enables tenability of flow parameters, such as velocity, density, direction and spatial location, across a substrate being processed. The processing gas across the substrate being processed may be specially tailored for individual processes with a liner assembly according to embodiment of the present invention.Type: GrantFiled: December 29, 2014Date of Patent: September 1, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Shu-Kwan Lau, Mehmet Tugrul Samir, Aaron Miller
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Publication number: 20200071832Abstract: Embodiments described herein generally relate to apparatus for fabricating semiconductor devices. A gas injection apparatus is coupled to a first gas source and a second gas source. Gases from the first gas source and second gas source may remain separated until the gases enter a process volume in a process chamber. A coolant is flowed through a channel in the gas injection apparatus to cool the first gas and the second gas in the gas injection apparatus. The coolant functions to prevent thermal decomposition of the gases by mitigating the influence of thermal radiation from the process chamber. In one embodiment, the channel surrounds a first conduit with the first gas and a second conduit with the second gas.Type: ApplicationFiled: August 13, 2019Publication date: March 5, 2020Inventors: Shu-Kwan LAU, Lit Ping LAM, Preetham RAO, Kartik SHAH, Ian ONG, Nyi O. MYO, Brian H. BURROWS
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Publication number: 20190371631Abstract: Embodiments of the present disclosure provide a thermal process chamber that includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate alters temperature profile. The shape of the beam spot produced by the spot heating module can be modified without making changes to the optics of the spot heating module.Type: ApplicationFiled: May 9, 2019Publication date: December 5, 2019Inventors: Shu-Kwan LAU, Zhiyuan YE, Zuoming ZHU, Koji NAKANISHI, Toshiyuki NAKAGAWA, Nyi O. MYO, Schubert S. CHU
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Patent number: 10453733Abstract: In one embodiment, a substrate support assembly includes a susceptor for supporting a substrate, and a supporting transfer mechanism coupled to the susceptor, the supporting transfer mechanism having a surface for supporting a peripheral edge of the substrate, the supporting transfer mechanism being movable relative to an upper surface of the susceptor.Type: GrantFiled: February 26, 2018Date of Patent: October 22, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Masato Ishii, Mehmet Tugrul Samir, Shu-Kwan Lau, Jeffrey Tobin
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Publication number: 20190127851Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.Type: ApplicationFiled: October 25, 2018Publication date: May 2, 2019Inventors: Shu-Kwan LAU, Koji NAKANISHI, Toshiyuki NAKAGAWA, Zuoming ZHU, Zhiyuan YE, Joseph M. RANISH, Nyi O. MYO, Errol Antonio C. SANCHEZ, Schubert S. CHU
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Patent number: 10170342Abstract: Embodiments of the present disclosure provide a liner assembly including a plurality of individually separated gas passages. The liner assembly enables tenability of flow parameters, such as velocity, density, direction and spatial location, across a substrate being processed. The processing gas across the substrate being processed may be specially tailored for individual processes with a liner assembly according to embodiment of the present disclosure.Type: GrantFiled: September 26, 2017Date of Patent: January 1, 2019Assignee: Applied Materials, Inc.Inventors: Mehmet Tugrul Samir, Shu-Kwan Lau
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Patent number: 10132003Abstract: Embodiments disclosed herein generally related to a processing chamber, and more specifically a heat modulator assembly for use in a processing chamber. The heat modulator assembly includes a heat modulator housing and a plurality of heat modulators. The heat modulator housing includes a housing member defining a housing plane, a sidewall, and an annular extension. The sidewall extends perpendicular to the housing plane. The annular extension extends outward from the sidewall. The plurality of heat modulators is positioned in the housing member.Type: GrantFiled: July 21, 2017Date of Patent: November 20, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Shu-Kwan Lau, Surajit Kumar, Joseph M. Ranish, Zhiyuan Ye, Kartik Shah, Mehmet Tugrul Samir, Errol Antonio C. Sanchez
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Patent number: 10047457Abstract: Embodiments of the present disclosure generally relate to a process chamber having a pre-heat ring for heating the process gas. In one embodiment, the process chamber includes a chamber body defining an interior processing region, a substrate support disposed within the chamber body, the substrate support having a substrate support surface for supporting a substrate, and a pre-heat ring positioned on a ring support disposed within the chamber body, wherein a portion of the pre-heat ring is tilted downwardly by a predetermined angle towards the gas exhaust side with respect to the substrate support surface to promote the purge gas flowing more through the gas exhaust side than the gas injection side.Type: GrantFiled: August 15, 2014Date of Patent: August 14, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Kartik Shah, Shu-Kwan Lau