Abstract: A semiconductor device includes a substrate; a memory array over the substrate, the memory array including first magnetic tunnel junctions (MTJs), where the first MTJs are in a first dielectric layer over the substrate; and a resistor circuit over the substrate, the resistor circuit including second MTJs, where the second MTJs are in the first dielectric layer.

Abstract: In an embodiment, a method includes: forming a first inter-metal dielectric (IMD) layer over a semiconductor substrate; forming a bottom electrode layer over the first IMD layer; forming a magnetic tunnel junction (MTJ) film stack over the bottom electrode layer; forming a first top electrode layer over the MTJ film stack; forming a protective mask covering a first region of the first top electrode layer, a second region of the first top electrode layer being uncovered by the protective mask; forming a second top electrode layer over the protective mask and the first top electrode layer; and patterning the second top electrode layer, the first top electrode layer, the MTJ film stack, the bottom electrode layer, and the first IMD layer with an ion beam etching (IBE) process to form a MRAM cell, where the protective mask is etched during the IBE process.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes an insulation layer. A bottom electrode via is disposed in the insulation layer. The bottom electrode via includes a conductive portion and a capping layer over the conductive portion. A barrier layer surrounds the bottom electrode via. A magnetic tunneling junction (MTJ) is disposed over the bottom electrode via.

Abstract: A method includes forming Magnetic Tunnel Junction (MTJ) stack layers, which includes depositing a bottom electrode layer; depositing a bottom magnetic electrode layer over the bottom electrode layer; depositing a tunnel barrier layer over the bottom magnetic electrode layer; depositing a top magnetic electrode layer over the tunnel barrier layer; and depositing a top electrode layer over the top magnetic electrode layer. The method further includes patterning the MTJ stack layers to form a MTJ; and performing a passivation process on a sidewall of the MTJ to form a protection layer. The passivation process includes reacting sidewall surface portions of the MTJ with a process gas comprising elements selected from the group consisting of oxygen, nitrogen, carbon, and combinations thereof.

Abstract: Described herein are T cells engineered to express a chimeric antigen receptor (CAR), such as an anti-mesothelin CAR alone or in combination with a follicle-stimulating hormone receptor (FSHR) binding domain and/or a dominant negative transforming growth factor-? receptor II (dnTGF?RII) for the treatment of diseases associated with mesothelin expression. Also described are T cells engineered to express a modified T cell receptor (TCR).

Abstract: The present application relates to a compound having the functions of being an antidepressant, improving anxiety and post-traumatic stress syndrome, anesthetizing, easing pain, improving cognitive function, protecting the lungs, preventing or treating amyotrophic lateral sclerosis or preventing or treating complex regional pain syndrome. Compared with existing known HNK compounds, the compound of the present invention has a longer drug efficacy period, and the compound of the present invention essentially does not lead to addiction.

Abstract: The present application relates to a compound having the effects of being an antidepressant, anesthetizing, alleviating pain, improving cognitive functions, protecting lungs, preventing or treating amyotrophic lateral sclerosis or preventing or treating complex regional pain syndrome. Compared with existing known HNK compounds, the compound provided in the present application has a longer drug efficacy period. Moreover the compound provided in the present application basically does not produce addiction.

Abstract: A liquid-cooling heat-dissipation structure is provided, which includes a first structure having a plurality of skived fins and a second structure having a plurality of guide fins. The first structure and the second structure are combined to each other, so that a chamber is formed between the first structure and the second structure for receiving a working fluid, and the skived fins and the guide fins are disposed in the chamber.

Abstract: A two-phase immersion heat dissipation structure is provided. The two-phase immersion heat dissipation structure includes an immersion-type heat dissipation substrate, a fin assembly, and a metal reinforcement frame. The immersion-type heat dissipation substrate has an upper surface having the fin assembly arranged vertically thereon and a lower surface used for contacting a heat generating element. The metal reinforcement frame is surroundingly in contact with a peripheral wall of the immersion-type heat dissipation substrate, and the metal reinforcement frame has two reinforcement side walls correspondingly protruding from a surface thereof. The two reinforcement side walls are arranged opposite to each other, and a height of the reinforcement side wall is between 5 mm and 15 mm. Each of the two reinforcement side walls has a plurality of through holes that horizontally pass through the reinforcement side wall and that are used for a replenishment of a two-phase coolant.

Abstract: A two-phase immersion-type heat dissipation substrate structure which is used for contacting a heat generating element provided. The two-phase immersion-type heat dissipation substrate structure includes an immersion-type heat dissipation substrate and a fin assembly. The immersion-type heat dissipation substrate has a front side and a back side that is opposite to the front side, the back side is used for contacting the heat generating element, and the front side has the fin assembly arranged thereon. The fin assembly includes a plurality of fins that are perpendicular to the front side, and the front side and the back side are not parallel to each other, so that an extension direction of each of the plurality of fins is neither perpendicular to nor parallel to a direction along which vapor bubbles escape.

Abstract: An immersion-type heat dissipation structure and a method for manufacturing the same are provided. The immersion-type heat dissipation structure includes a first heat dissipation member and a second heat dissipation member that has a plurality of heat dissipation columns and is disposed on the first heat dissipation member. The second heat dissipation member has a porous structure, the first heat dissipation member has a solid structure, and a thermal conductivity of the first heat dissipation member is greater than that of the second heat dissipation member. A shortest distance between two bottoms of any two adjacent ones of the heat dissipation columns is between 0.2 mm and 1.2 mm, a minimum diameter of a top surface of the heat dissipation column is between 0.2 mm and 1.2 mm, and a draft angle formed on a side surface of the heat dissipation column is between 1° and 5°.

Abstract: A two-phase immersion type heat dissipation substrate is in contact with a heat generating element, and includes an immersion type heat dissipation base and at least one first and at least one second fin assembly that are formed on an upper surface thereof. The at least one first fin assembly is located directly above at least one high-temperature heat source area of the heat generating element, and the at least one second fin assembly is located directly above an area that is not the at least one high-temperature heat source area of the heat generating element. The at least one first and at least one second fin assembly include multiple first fins and multiple second fins, respectively. An arrangement density of the first fins is greater than that of the second fins, and a fin height of the first fins is greater than that of the second fins.

Abstract: An immersion-type heat dissipation substrate having a microporous structure is provided. The immersion-type heat dissipation substrate includes a surface having a plurality of micropores for facilitating generation of vapor bubbles. A pore diameter of each of the plurality of micropores is between 5 ?m and 150 ?m, and the plurality of micropores cover 3% to 40% of an area of the surface.

Abstract: An immersion-type porous heat dissipation structure is provided. The immersion-type porous heat dissipation structure includes a porous heat dissipation substrate, a macroscopic fin structure, and at least one reinforcement structure. The porous heat dissipation substrate has a porosity greater than 8%, and has a fin surface and a non-fin surface that are opposite to each other. The fin surface is connected to the macroscopic fin structure, and the macroscopic fin structure includes at least one macroscopic fin. The at least one reinforcement structure protrudes from the fin surface, and is connected to and integrated with the fin surface. A ratio of an area of a connecting part between the at least one reinforcement structure and the fin surface to an area of a connecting part between the at least one macroscopic fin and the fin surface is two or more.

Abstract: An immersion-type porous heat dissipation structure is provided. The immersion-type porous heat dissipation structure includes a porous heat dissipation material in a form of a sheet. A surface of the porous heat dissipation material has a plurality of open pores that are configured to generate air bubbles. A 1 mm2 cross-sectional area of the surface of the porous heat dissipation has at least five of the open pores each having a depth greater than 25 ?m.

Abstract: An immersion heat dissipation structure is provided. The immersion heat dissipation structure includes a porous metal heat dissipation material, an integrated heat spreader, and a thermal interface material. The porous metal heat dissipation material has a porosity greater than 8%. The porous metal heat dissipation material and the integrated heat spreader have the thermal interface material arranged therebetween so that a thermal connection is formed therebetween. A connection surface of the porous metal heat dissipation material and a connection surface of the thermal interface material have a sealing layer or a sealing material arranged therebetween.

Abstract: A liquid cooling heat dissipation substrate structure with partial compression reinforcement is provided. The liquid cooling heat dissipation substrate structure with partial compression reinforcement includes a heat dissipation base that integrally has a heat dissipation main structure and a compression reinforcement structure. The heat dissipation main structure and the compression reinforcement structure are formed through different processes. The heat dissipation main structure and the compression reinforcement structure have different metallographic microstructures. Crystallites of the metallographic microstructure of the heat dissipation main structure are not all arranged in one specific direction, and crystallites of the metallographic microstructure of the compression reinforcement structure are stacked and arranged in a direction that is perpendicular to a compression direction.

Abstract: A liquid cooling heat dissipation substrate with partial compression reinforcement is provided. The liquid cooling heat dissipation substrate with partial compression reinforcement includes a heat dissipation base and a compression reinforcement structure. The heat dissipation base integrally has an upper surface and a lower surface opposite to each other, and the compression reinforcement structure is partially formed on at least one of the upper surface and the lower surface. A ratio of a sum of an area of an orthogonal projection of the compression reinforcement structure on the upper surface and an area of an orthogonal projection of the compression reinforcement structure on the lower surface to a sum of an area of the upper surface and an area of the lower surface is from 10% to 60%.

Abstract: An immersion heat dissipation structure having a macroscopic fin structure and an immersion heat dissipation structure having a fin structure are provided. The immersion heat dissipation structure having a macroscopic fin structure includes a surface having at least two contact angles. At least one part of the surface has one of the at least two contact angles between an immersion cooling liquid that is greater than 90 degrees, and at least another part of the surface has another one of the at least two contact angles between the immersion cooling liquid that is from 0 degrees to 90 degrees.

Abstract: An immersion-type porous heat dissipation substrate structure is provided. The immersion-type porous heat dissipation substrate structure includes a porous heat dissipation base formed by sintering of metal powder. The porous heat dissipation base is immersed in a two-phase coolant for increasing an amount of bubbles that is generated, and has a porosity that is controlled to be between 5% and 50%. Or, the porous heat dissipation base has more than one porosity.