Abstract: This is a technology for non-contact power transmission to the laboratory animal biological information acquisition device 12 embedded in the multiple laboratory animals in the breeding cage 14, and provides the power reception device, which can observe the behavior of laboratory animals from outside without covering the breeding cage 14 with the power transmission side, and which can continuously supply power regardless of the direction and position of the laboratory animals. The secondary coil part 22 includes a magnetic core 31 having a circular cross-section perpendicular to the longitudinal direction, and a plurality of spiral coils 40a and 40b formed by winding a conductor so that the outer shape is substantially rectangular.

Abstract: A resin sheet includes a porous structure. The porous structure is configured to adjust transmission of a millimeter wave. The porous structure has a relative permittivity varying in stages in a thickness direction of the resin sheet from a plane on which the millimeter wave is incident, the relative permittivity varying such that a difference between average relative permittivities in two adjacent layer portions is a predetermined value or less, the layer portions each having a particular thickness smaller than a wavelength of the millimeter wave. The porous structure has, as pores, only pores each having a pore diameter equal to or less than 10% of the wavelength of the millimeter wave.

Abstract: A heater member (1a) includes a support (10), a heating element (20), and at least one pair of power supply electrodes (30). The support (10) is made of an organic polymer and has a sheet shape. The heating element (20) is made of a polycrystalline material containing indium oxide as a main component and in contact with one principal surface of the support (10). The power supply electrodes (30) are in contact with one principal surface of the heating element (20). The heating element (20) has a sheet resistance in the range from 10 to 150 ?/sq. The heating element (20) has a thickness of more than 20 nm and not more than 200 nm. The internal stress of the heating element (20) as measured by an X-ray stress measurement method is 500 MPa or less.

Abstract: A heater 1a includes: a substrate 10 made of a resin; a conductive film 20 being a heating element; and a power supply electrode 30. The power supply electrode 30 is electrically connected to the conductive film 20 and is arranged along a surface of the conductive film 20. The power supply electrode 30 includes a conductive filler 30p and a binder 30m. The binder 30m binds the conductive filler 30p. The power supply electrode 30 has a specific resistance of 100 µ?•cm or less. The heater 1a satisfies a relation |Rd ? Ri|/Ri ? 0.2. Rd is an electrical resistance [?] of the heater 1a, the electrical resistance being obtained after an environment of the heater 1a is maintained at a temperature of 85° C. and a relative humidity of 85% for 1000 hours. Ri is an initial electrical resistance Ri of the heater 1a.

Abstract: Provided is a technique for improving the radio wave transmission of a dielectric member, which reflects radio waves, without requiring a design change of the dielectric member itself. Provided is an antireflection material that is used by being laminated on a dielectric member, which reflects radio waves, to reduce the reflection of the radio waves. The dielectric member includes a base layer and a coating layer laminated on the base layer. The base layer has a thickness TYB of 1.2 mm or more and 3.5 mm or less. The coating layer has a relative permittivity ?YC of 3.0 or higher. The antireflection material has a thickness TX of 10 mm or less. The antireflection material has a relative permittivity ?X of 2.0 or more and 7.0 or less.

Abstract: A technology disclosed in the present specification is a power supply device 10 configured to supply electric power to a seat S that can slide and rotate with respect to a floor part F of a vehicle. The power supply device 10 comprises: a power transmission unit 40 that is provided on the floor part F and extends along a sliding direction in which the seat S slides; and a power reception unit 70 that is provided on the seat S and receives electric power from the power transmission unit 40 in a contactless manner, wherein the power transmission unit 40 is provided such that the length dimension in the sliding direction is longer than the length dimension in a direction orthogonal to the sliding direction, and a portion of the power reception unit 70, which receives electric power from the power transmission unit 40, is disposed within an installation range of the power transmission unit 40 in a state of being close to the power transmission unit 40 while the seat S is sliding and rotating.

Abstract: A heater (1a) includes: a substrate (10); a heat-generation layer (20) that is a conductive metal oxide layer (22); a pair of power supply electrodes (30); and a pressure-sensitive adhesive bonding laminate (40). The substrate (10) is formed of an organic polymer. The heat-generation layer (20) is disposed in contact with the substrate (10) in the thickness direction of the substrate (10). The pair of power supply electrodes (30) are electrically connected to the heat-generation layer (20). The pressure-sensitive adhesive bonding laminate (40) has a pressure-sensitive adhesive surface (41a) used for pressure-sensitive adhesive bonding with an adherend. In the pressure-sensitive adhesive bonding laminate (40), a plurality of pressure-sensitive adhesive layers (41, 42) and at least one support (45) for the plurality of pressure-sensitive adhesive layers are alternately laminated between the pressure-sensitive adhesive surface (41a) and the heat-generating layer (20).

Abstract: A heater (1a) includes a substrate (10), a transparent conductive oxide layer (20), a first power supply electrode (31), and a second power supply electrode (32). The ratio of the sum of the electric resistance of the first power supply electrode (31) in a particular direction and the electric resistance of the second power supply electrode (32) in the particular direction to the electric resistance of the transparent conductive oxide layer (20) between the first power supply electrode (31) and the second power supply electrode (32) is 45% or less. The transparent conductive oxide layer (20) has a thickness from 20 to 250 nm and is formed of a material having a specific resistance from 1.4×10?4 to 3.0×10?4 ?·cm.

Abstract: Provided is a masking tape for a shot peening process, including: a substrate having a first surface and a second surface; and a pressure-sensitive adhesive layer disposed on the first surface of the substrate. The masking tape has a breaking strength of 55 N/15 mm or more and exhibits an impact absorption rate of 20% or more in a falling ball impact test. Further, the masking tape has a displacement distance of 2 mm or less after 1 h from an initial position in a holding power test at 40° C. which is performed by applying a load of 500 g.

Abstract: This is a technology for non-contact power transmission to the laboratory animal biological information acquisition device 12 embedded in the multiple laboratory animals in the breeding cage 14, and provides the power reception device, which can observe the behavior of laboratory animals from outside without covering the breeding cage 14 with the power transmission side, and which can continuously supply power regardless of the direction and position of the laboratory animals. The secondary coil part 22 includes a magnetic core 31 having a circular cross-section perpendicular to the longitudinal direction, and a plurality of spiral coils 40a and 40b formed by winding a conductor so that the outer shape is substantially rectangular.

Abstract: A heater member (1a) includes a support (10), a heating element (20), and at least one pair of power supply electrodes (30). The support (10) is made of an organic polymer and has a sheet shape. The heating element (20) is made of a polycrystalline material containing indium oxide as a main component and in contact with one principal surface of the support (10). The power supply electrodes (30) are in contact with one principal surface of the heating element (20). The heating element (20) has a sheet resistance in the range from 10 to 150 ?/sq. The heating element (20) has a thickness of more than 20 nm and not more than 200 nm. The internal stress of the heating element (20) as measured by an X-ray stress measurement method is 500 MPa or less.

Abstract: In a power transmission system for transmitting electric power from the primary side power feeding coil to the secondary side power receiving coil without their mutual contact and using electromagnetic induction, the power coils on each of the primary and secondary sides include a pair of planar spiral coils which are shaped in the form of a figure 8 and connected differentially to power supply, and each of the spiral coils is D-shaped having a semicircular portion and a linear portion combined together, the two spiral coils having their linear portions laid one on the other to form a planar figure-8 coil. Plates of soft magnetic material 4 and 41 are disposed each on a side of the power coil on one of the primary and secondary sides which is opposite to the side that faces the power coil on the other of the primary and secondary sides.

Abstract: Provided is a masking tape for a shot peening process, including: a substrate having a first surface and a second surface; and a pressure-sensitive adhesive layer disposed on the first surface of the substrate. The masking tape has a breaking strength of 55 N/15 mm or more and exhibits an impact absorption rate of 20% or more in a falling ball impact test. Further, the masking tape has a displacement distance of 2 mm or less after 1 h from an initial position in a holding power test at 40° C. which is performed by applying a load of 500 g.

Abstract: An electro-conductive pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive layer containing a resin component and an electro-conductive particle. The electro-conductive particle has at least one peak top existing in a particle size range from about 15 ?m or more to about 50 ?m or less and at least one further peak top existing in a particle size range from about 1 ?m or more to about 12 ?m or less in a particle size distribution curve thereof. The electro-conductive particle is contained in the pressure-sensitive adhesive layer in an amount of 40 mass % or more but 80 mass % or less, and has a true density in a level of larger than zero but smaller than 8 g/cm3.

Abstract: An electroconductive pressure-sensitive adhesive cushioning member includes an electroconductive resin foam layer, an electroconductive composite layer, and an electroconductive intermediate layer disposed between the electroconductive resin foam layer and the electroconductive composite layer. The electroconductive composite layer includes an electroconductive base layer and an electroconductive attachment layer disposed on a surface of the electroconductive base layer and having an attachment surface to be attached to an obstacle. Thus, the electroconductive cushioning member is excellent in conductivity, an electromagnetic waves shieling property, and a cushioning property.

Abstract: An electro-conductive pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive layer containing a resin component and an electro-conductive particle. The electro-conductive particle has at least one peak top existing in a particle size range from about 15 ?m or more to about 50 ?m or less and at least one further peak top existing in a particle size range from about 1 ?m or more to about 12 ?m or less in a particle size distribution curve thereof. The electro-conductive particle is contained in the pressure-sensitive adhesive layer in an amount of 40 mass % or more but 80 mass % or less, and has a true density in a level of larger than zero but smaller than 8 g/cm3.

Abstract: Certain embodiments provide a method for producing a solid-state imaging device including the steps of forming an interconnection layer, forming a passivation film, forming a resist layer, forming a plurality of protruding portions and an opening, and forming an electrode pad. In the step of forming the interconnection layer, the interconnection layer is formed on the surface of the semiconductor substrate having a photodiode. In the step of forming the resist layer, the resist layer is formed on the passivation film such that the resist layer has a plurality of first openings above the photodiode and has a second opening above the interconnection of the interconnection layer. In the step of forming the plurality of protruding portions and the opening, the plurality of protruding portions and the opening are formed by etching the passivation film via the resist layer.

Abstract: A solid-state imaging device producing method includes the steps of: applying a resist material onto a substrate in which a channel region is formed; forming a resist layer by exposure and development of the resist material using a mask, the resist layer having an opening and a thin-film portion, the mask having a first region through which light is transmitted and a second region through which a smaller quantity of light than that the light transmitted through the first region is transmitted; subjecting the substrate to ion implantation using the resist layer as a mask to form an impurity region; etching the substrate using the resist layer as a mask after the ion implantation to form an alignment mark; and forming an electrode on the impurity region and part of the channel region using the alignment mark as a reference.

Abstract: Certain embodiments provide a method for producing a solid-state imaging device including the steps of forming an interconnection layer, forming a passivation film, forming a resist layer, forming a plurality of protruding portions and an opening, and forming an electrode pad. In the step of forming the interconnection layer, the interconnection layer is formed on the surface of the semiconductor substrate having a photodiode. In the step of forming the resist layer, the resist layer is formed on the passivation film such that the resist layer has a plurality of first openings above the photodiode and has a second opening above the interconnection of the interconnection layer. In the step of forming the plurality of protruding portions and the opening, the plurality of protruding portions and the opening are formed by etching the passivation film via the resist layer.

Abstract: A solid-state imaging device producing method includes the steps of: applying a resist material onto a substrate in which a channel region is formed; forming a resist layer by exposure and development of the resist material using a mask, the resist layer having an opening and a thin-film portion, the mask having a first region through which light is transmitted and a second region through which a smaller quantity of light than that the light transmitted through the first region is transmitted; subjecting the substrate to ion implantation using the resist layer as a mask to form an impurity region; etching the substrate using the resist layer as a mask after the ion implantation to form an alignment mark; and forming an electrode on the impurity region and part of the channel region using the alignment mark as a reference.