Abstract: A medium transport device includes a first transporter configured to transport a medium by nipping the medium along with rotation, a second transporter configured to transport the medium and disposed on an upstream side of the first transporter in a transport direction of the medium, a first adjuster configured to adjust a position of the medium in a width direction by moving the first transporter and the second transporter in the width direction of the medium with the medium nipped by the first transporter and the second transporter, and a second adjuster configured to adjust a contact pressure of the first transporter for the medium and a contact pressure of the second transporter for the medium based on resistance caused when the medium is moved in the width direction.

Abstract: A sheet transporting device includes: a skew correcting component configured to correct any skew of a sheet by executing speed-gap driving in which first and second transporting components that are arranged at respective positions in a direction intersecting a direction of sheet transport are driven for a predetermined time period with a speed gap between the first and second transporting components; and a changing component configured to change, with reference to a characteristic relevant to sheet transport, a state of the speed-gap driving of the skew correcting component.

Abstract: A sheet transporting device includes first and second position correcting components provided at respective positions in a direction of sheet transport and each being configured to correct a position of a sheet in a direction intersecting the direction of sheet transport by being shifted in the direction intersecting the direction of sheet transport while holding the sheet, and a changing component capable of changing an amount of correction of the position of the sheet individually for the first and second position correcting components.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming an organosilicon compound layer on a surface of an oxide semiconductor substrate, heating the oxide semiconductor substrate provided with the organosilicon compound layer at a first temperature to form a silicon diffusion layer inside the oxide semiconductor substrate, and removing the organosilicon compound layer from the surface of the oxide semiconductor substrate after heating the oxide semiconductor substrate at the first temperature.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming an organosilicon compound layer on a surface of an oxide semiconductor substrate, heating the oxide semiconductor substrate provided with the organosilicon compound layer at a first temperature to form a silicon diffusion layer inside the oxide semiconductor substrate, and removing the organosilicon compound layer from the surface of the oxide semiconductor substrate after heating the oxide semiconductor substrate at the first temperature.

Abstract: The present invention eliminates the shortage of bus numbers in routing control using PCIe switches. A system port address (SPA) is associated with a destination bus number and is assigned to a port (external port) connected to a server and a device. When packets sent from the server or the device are received at the external port, the system port address (SPA) corresponding to the destination bus number having the packets is determined, and the SPA is added to the packets as a label. This SPA is used to route the packets sent between ports (internal ports) that connect switches. When the packets arrive at the external port to which the target server or device is connected, the destination bus number having packets is used to send the packets to the server or device connected to the external port.

Abstract: In a computer on the transmission side, an NW driver, which is recognized, by the OS, as an NIC driver, stores data to be transmitted and a destination SPA into a memory, and outputs a transaction layer packet (TLP), which has been generated by a first computer, to a PCIe switch. A first NIC logic of the PCIe switch of the PCIe switch corresponding to the first computer on the transmission side adds a system port address (SPA) to the TLP transferred from the first computer, and transfers the data of the TLP to a port associated with a second NIC logic and having an address indicated by the SPA (destination SPA). The second NIC logic having received the data writes the receive data into a memory of a second computer, on the reception side, which is connected to another PCIe switch where the second NIC logic exists.

Abstract: In a computer on the transmission side, an NW driver, which is recognized, by the OS, as an NIC driver, stores data to be transmitted and a destination SPA into a memory, and outputs a transaction layer packet (TLP), which has been generated by a first computer, to a PCIe switch. A first NIC logic of the PCIe switch of the PCIe switch corresponding to the first computer on the transmission side adds a system port address (SPA) to the TLP transferred from the first computer, and transfers the data of the TLP to a port associated with a second NIC logic and having an address indicated by the SPA (destination SPA). The second NIC logic having received the data writes the receive data into a memory of a second computer, on the reception side, which is connected to another PCIe switch where the second NIC logic exists.

Abstract: The present invention eliminates the shortage of bus numbers in routing control using PCIe switches. A system port address (SPA) is associated with a destination bus number and is assigned to a port (external port) connected to a server and a device. When packets sent from the server or the device are received at the external port, the system port address (SPA) corresponding to the destination bus number having the packets is determined, and the SPA is added to the packets as a label. This SPA is used to route the packets sent between ports (internal ports) that connect switches. When the packets arrive at the external port to which the target server or device is connected, the destination bus number having packets is used to send the packets to the server or device connected to the external port.