Patents by Inventor Shuhei Miyazaki
Shuhei Miyazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11946989Abstract: A magnetic sensor device includes at least one magnetic sensor and a support. A center of gravity of an element layout area of the at least one magnetic sensor is deviated from a center of gravity of a reference plane of the support. The at least one magnetic sensor includes four resistor sections constituted by a plurality of magnetoresistive elements. Magnetization of a free layer in each of two of the resistor sections includes a component in a third magnetization direction. The magnetization of a free layer in each of the other two resistor sections includes a component in a fourth magnetization direction opposite to the third magnetization direction.Type: GrantFiled: May 16, 2023Date of Patent: April 2, 2024Assignee: TDK CORPORATIONInventors: Norikazu Ota, Hiraku Hirabayashi, Kazuma Yamawaki, Shuhei Miyazaki, Kazuya Watanabe
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Publication number: 20240085499Abstract: A magnetic sensor device includes a stacked structure including a sensor substrate and a sensor element circuitry. The sensor substrate has a surface and a perimeter. The sensor element circuitry is provided on the surface of the sensor substrate, has a perimeter, and includes one or more magnetic sensor elements. As viewed in a plane parallel to the surface, a portion or all of the perimeter of the sensor element circuitry is located at a position different from a position of the perimeter of the sensor substrate.Type: ApplicationFiled: August 11, 2023Publication date: March 14, 2024Applicant: TDK CORPORATIONInventors: Kazuma YAMAWAKI, Shuhei MIYAZAKI
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Publication number: 20240019505Abstract: A magnetic sensor device includes a sensor substrate and a sensor element circuitry. The sensor substrate has a surface. The sensor element circuitry is provided on the surface of the sensor substrate and includes one or more magnetic sensor elements. As viewed in a plane parallel to the surface, the sensor substrate has a perimeter that is substantially octagonal. The perimeter includes two short sides opposed to each other, two long sides opposed to each other, and four corners. The four corners are each chamfered entirely or partially in a thickness direction that is substantially orthogonal to the surface. A ratio of a length of each of the four corners along each of the two long sides of the sensor substrate to a length of each of the two long sides of the sensor substrate is less than or equal to 0.39.Type: ApplicationFiled: June 29, 2023Publication date: January 18, 2024Applicant: TDK CORPORATIONInventors: Kazuma YAMAWAKI, Shuhei MIYAZAKI
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Publication number: 20230417846Abstract: A magnetic sensor device includes a first chip including a first magnetic sensor, a second chip including a second magnetic sensor and a third magnetic sensor, and a support having a reference plane. The first magnetic sensor includes at least one first magnetic detection element, and detects a first component of an external magnetic field. The second magnetic sensor includes at least one second magnetic detection element, and detects a second component of the external magnetic field. The third magnetic sensor includes at least one third magnetic detection element, and detects a third component of the external magnetic field. The first chip and the second chip are mounted on the reference plane.Type: ApplicationFiled: September 7, 2023Publication date: December 28, 2023Applicant: TDK CORPORATIONInventors: Kenzo MAKINO, Shuhei MIYAZAKI
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Patent number: 11789094Abstract: A magnetic sensor device includes a first chip including a first magnetic sensor, a second chip including a second magnetic sensor and a third magnetic sensor, and a support having a reference plane. The first magnetic sensor includes at least one first magnetic detection element, and detects a first component of an external magnetic field. The second magnetic sensor includes at least one second magnetic detection element, and detects a second component of the external magnetic field. The third magnetic sensor includes at least one third magnetic detection element, and detects a third component of the external magnetic field. The first chip and the second chip are mounted on the reference plane.Type: GrantFiled: October 4, 2022Date of Patent: October 17, 2023Assignee: TDK CORPORATIONInventors: Kenzo Makino, Shuhei Miyazaki
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Patent number: 11774991Abstract: An information processing apparatus capable of controlling vibration in accordance with a situation in a case where the vibration is generated on the basis of an audio signal. The information processing apparatus can include: a vibrator; and a controller configured to detect a state of the information processing apparatus and control a state of the vibrator based on a detection result, in which the controller controls vibration the vibrator in accordance with reproduction of content while the content is being reproduced in the information processing apparatus, and, in a case where a predetermined condition is satisfied, restricts vibration of the vibrator even while the content is being reproduced in the information processing apparatus.Type: GrantFiled: December 26, 2018Date of Patent: October 3, 2023Assignee: SONY CORPORATIONInventors: Shuhei Miyazaki, Yugo Takeda, Takeshi Matsui, Taku Tomita, Seiji Muramatsu, Ryoko Amano, Risa Takahashi, Ikuo Yamano, Takeshi Ogita, Ayumi Kato, Ryo Yokoyama
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Publication number: 20230280420Abstract: A magnetic sensor device includes at least one magnetic sensor and a support. A center of gravity of an element layout area of the at least one magnetic sensor is deviated from a center of gravity of a reference plane of the support. The at least one magnetic sensor includes four resistor sections constituted by a plurality of magnetoresistive elements. Magnetization of a free layer in each of two of the resistor sections includes a component in a third magnetization direction. The magnetization of a free layer in each of the other two resistor sections includes a component in a fourth magnetization direction opposite to the third magnetization direction.Type: ApplicationFiled: May 16, 2023Publication date: September 7, 2023Applicant: TDK CORPORATIONInventors: Norikazu OTA, Hiraku HIRABAYASHI, Kazuma YAMAWAKI, Shuhei MIYAZAKI, Kazuya WATANABE
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Patent number: 11686788Abstract: A magnetic sensor device includes at least one magnetic sensor and a support. A center of gravity of an element layout area of the at least one magnetic sensor is deviated from a center of gravity of a reference plane of the support. The at least one magnetic sensor includes four resistor sections constituted by a plurality of magnetoresistive elements. Magnetization of a free layer in each of two of the resistor sections includes a component in a third magnetization direction. The magnetization of a free layer in each of the other two resistor sections includes a component in a fourth magnetization direction opposite to the third magnetization direction.Type: GrantFiled: May 2, 2022Date of Patent: June 27, 2023Assignee: TDK CORPORATIONInventors: Norikazu Ota, Hiraku Hirabayashi, Kazuma Yamawaki, Shuhei Miyazaki, Kazuya Watanabe
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Publication number: 20230140621Abstract: An electronic component package of an embodiment of the disclosure includes a base, a first plated layer, a first electronic component chip, a second plated layer, and a second electronic component chip. The base includes a first surface and a second surface. The first plated layer covers the first surface. The first electronic component chip is provided on the first plated layer with a first insulating layer being interposed therebetween. The second plated layer covers the second surface. The second electronic component chip is provided on the second plated layer with a second insulating layer being interposed therebetween. The first plated layer and the second plated layer each include a first metal material that is less likely to undergo an ion migration phenomenon than silver (Ag).Type: ApplicationFiled: December 29, 2022Publication date: May 4, 2023Applicant: TDK CorporationInventors: Yongfu CAI, Shuhei MIYAZAKI, Kazuma YAMAWAKI
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Publication number: 20230056523Abstract: A lead frame includes a die pad, a plurality of leads, at least one support lead, and a frame member. The frame member includes two first connection bars and two second connection bars. The plurality of leads include a plurality of specific leads. The plurality of specific leads are each connected to the first connection bar. At least one of the specific leads is connected to the second connection bar via the at least one support lead. The cross-sectional second-order moment of a cross section of the at least one support lead perpendicular to a Y direction around an X axis is equal to or more than the cross-sectional second-order moment of a cross section of the at least one support lead perpendicular to an X direction around a Y axis.Type: ApplicationFiled: July 5, 2022Publication date: February 23, 2023Applicant: TDK CORPORATIONInventors: Kazuma YAMAWAKI, Shuhei MIYAZAKI
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Publication number: 20230053559Abstract: A lead frame includes a die pad, a plurality of leads, a frame member, and at least one wire. The frame member includes two first connection bars and two second connection bars. The plurality of leads include a plurality of specific leads. Each of the specific leads is connected to the first connection bar. At least one of the specific leads is connected to the second connection bar via the at least one wire.Type: ApplicationFiled: July 5, 2022Publication date: February 23, 2023Applicant: TDK CORPORATIONInventors: Kazuma YAMAWAKI, Shuhei MIYAZAKI
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Patent number: 11569143Abstract: An electronic component package of an embodiment of the disclosure includes a base, a first plated layer, a first electronic component chip, a second plated layer, and a second electronic component chip. The base includes a first surface and a second surface. The first plated layer covers the first surface. The first electronic component chip is provided on the first plated layer with a first insulating layer being interposed therebetween. The second plated layer covers the second surface. The second electronic component chip is provided on the second plated layer with a second insulating layer being interposed therebetween. The first plated layer and the second plated layer each include a first metal material that is less likely to undergo an ion migration phenomenon than silver (Ag).Type: GrantFiled: May 9, 2019Date of Patent: January 31, 2023Assignee: TDK CORPORATIONInventors: Yongfu Cai, Shuhei Miyazaki, Kazuma Yamawaki
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Publication number: 20230028190Abstract: A magnetic sensor device includes a first chip including a first magnetic sensor, a second chip including a second magnetic sensor and a third magnetic sensor, and a support having a reference plane. The first magnetic sensor includes at least one first magnetic detection element, and detects a first component of an external magnetic field. The second magnetic sensor includes at least one second magnetic detection element, and detects a second component of the external magnetic field. The third magnetic sensor includes at least one third magnetic detection element, and detects a third component of the external magnetic field. The first chip and the second chip are mounted on the reference plane.Type: ApplicationFiled: October 4, 2022Publication date: January 26, 2023Applicant: TDK CORPORATIONInventors: Kenzo MAKINO, Shuhei MIYAZAKI
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Publication number: 20230008088Abstract: A magnetic sensor device includes at least one magnetic sensor and a support. A center of gravity of an element layout area of the at least one magnetic sensor is deviated from a center of gravity of a reference plane of the support. The at least one magnetic sensor includes four resistor sections constituted by a plurality of magnetoresistive elements. Magnetization of a free layer in each of two of the resistor sections includes a component in a third magnetization direction. The magnetization of a free layer in each of the other two resistor sections includes a component in a fourth magnetization direction opposite to the third magnetization direction.Type: ApplicationFiled: May 2, 2022Publication date: January 12, 2023Applicant: TDK CORPORATIONInventors: Norikazu OTA, Hiraku HIRABAYASHI, Kazuma YAMAWAKI, Shuhei MIYAZAKI, Kazuya WATANABE
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Patent number: 11493567Abstract: A magnetic sensor device includes a first chip including a first magnetic sensor, a second chip including a second magnetic sensor and a third magnetic sensor, and a support having a reference plane. The first magnetic sensor includes at least one first magnetic detection element, and detects a first component of an external magnetic field. The second magnetic sensor includes at least one second magnetic detection element, and detects a second component of the external magnetic field. The third magnetic sensor includes at least one third magnetic detection element, and detects a third component of the external magnetic field. The first chip and the second chip are mounted on the reference plane.Type: GrantFiled: March 31, 2021Date of Patent: November 8, 2022Assignee: TDK CORPORATIONInventors: Kenzo Makino, Shuhei Miyazaki
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Publication number: 20220317208Abstract: A magnetic sensor device includes a first chip including a first magnetic sensor, a second chip including a second magnetic sensor and a third magnetic sensor, and a support having a reference plane. The first magnetic sensor includes at least one first magnetic detection element, and detects a first component of an external magnetic field. The second magnetic sensor includes at least one second magnetic detection element, and detects a second component of the external magnetic field. The third magnetic sensor includes at least one third magnetic detection element, and detects a third component of the external magnetic field. The first chip and the second chip are mounted on the reference plane.Type: ApplicationFiled: March 31, 2021Publication date: October 6, 2022Applicant: TDK CORPORATIONInventors: Kenzo MAKINO, Shuhei MIYAZAKI
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Publication number: 20220208627Abstract: In an assembly in which a space between two elements is filled with a filler containing resin, a configuration that can limit both the size of the assembly and the cost of the fillers is provided. An assembly of stacked elements has: first element having first surface; resin layer that is arranged on first surface and that contains a plurality of fillers; and second element that is arranged on resin layer and that has second surface that is in contact with resin layer. In a section that is perpendicular to second surface, the average flattening ratio of fillers that are in contact with second surface is larger than the average flattening ratio of fillers that are not in contact with second surface. Here, the flattening ratio is a ratio of the maximum length of the filler in a direction parallel to second surface to the maximum thickness of the filler in a direction perpendicular to second surface.Type: ApplicationFiled: March 16, 2022Publication date: June 30, 2022Inventors: Yongfu CAI, Shuhei MIYAZAKI
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Patent number: 11322418Abstract: In an assembly in which a space between two elements is filled with a filler containing resin, a configuration that can limit both the size of the assembly and the cost of the fillers is provided. Assembly 10 of stacked elements has: first element 2 having first surface 21; resin layer 61 that is arranged on first surface 21 and that contains a plurality of fillers F; and second element 4 that is arranged on resin layer 61 and that has second surface 41 that is in contact with resin layer 61. In a section that is perpendicular to second surface 41, the average flattening ratio of fillers F2 that are in contact with second surface 41 is larger than the average flattening ratio of fillers F1, F3 that are not in contact with second surface 41. Here, the flattening ratio is a ratio of the maximum length of the filler in a direction parallel to second surface 41 to the maximum thickness of the filler in a direction perpendicular to second surface 41.Type: GrantFiled: November 15, 2019Date of Patent: May 3, 2022Assignee: TDK CorporationInventors: Yongfu Cai, Shuhei Miyazaki
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Publication number: 20200401164Abstract: To provide an information processing apparatus capable of controlling vibration in accordance with a situation in a case where the vibration is generated on the basis of an audio signal. Provided is an information processing apparatus including: a vibration unit; and a control unit configured to detect a state of the own apparatus and control a state of the vibration unit on the basis of a detection result, in which the control unit vibrates the vibration unit in accordance with reproduction of content while the content is being reproduced in the own apparatus, and, in a case where a predetermined condition is satisfied, restricts vibration of the vibration unit even while the content is being reproduced in the own apparatus.Type: ApplicationFiled: December 26, 2018Publication date: December 24, 2020Applicant: Sony CorporationInventors: Shuhei MIYAZAKI, Yugo TAKEDA, Takeshi MATSUI, Taku TOMITA, Seiji MURAMATSU, Ryoko AMANO, Risa TAKAHASHI, Ikuo YAMANO, Takeshi OGITA, Ayumi KATO, Ryo YOKOYAMA
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Publication number: 20200286802Abstract: In an assembly in which a space between two elements is filled with a filler containing resin, a configuration that can limit both the size of the assembly and the cost of the fillers is provided. Assembly 10 of stacked elements has: first element 2 having first surface 21; resin layer 61 that is arranged on first surface 21 and that contains a plurality of fillers F; and second element 4 that is arranged on resin layer 61 and that has second surface 41 that is in contact with resin layer 61. In a section that is perpendicular to second surface 41, the average flattening ratio of fillers F2 that are in contact with second surface 41 is larger than the average flattening ratio of fillers F1, F3 that are not in contact with second surface 41. Here, the flattening ratio is a ratio of the maximum length of the filler in a direction parallel to second surface 41 to the maximum thickness of the filler in a direction perpendicular to second surface 41.Type: ApplicationFiled: November 15, 2019Publication date: September 10, 2020Inventors: Yongfu CAI, Shuhei MIYAZAKI