Patents by Inventor Shui-Town Lin

Shui-Town Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for soldering through-hole components on circuit board
    Patent number: 6305596
    Abstract: A method for breaking off solder bridges between pins of a through-hole component on a printed circuit board, comprises the following steps: (1) providing a soldering apparatus, the apparatus having an opening corresponding to the through-hole component, the opening defining an opening wall surface, providing a slit at a predetermined position of the opening wall surface; and (2) blowing a gas of a predetermined temperature and a predetermined pressure at a predetermined time to the position of the solder bridges through the slit for removing the solder bridges from the through-hole component.
    Type: Grant
    Filed: December 23, 1998
    Date of Patent: October 23, 2001
    Assignee: Asustek Computer Inc.
    Inventors: Shui-Town Lin, Shih-Ren Chuang