Patents by Inventor Shuib Bin Hassan

Shuib Bin Hassan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tray for storing semiconductor chips
    Patent number: 6612442
    Abstract: A thermo-formed tray and tray assembly designed for the storage and transportation of integrated circuit packages for instance of the type known as a pin grid array or a flip chip pin grid array. The storage tray consists of a number of compartments or recesses usually in a layout of two or three rows by five columns. Each recess includes a central pedestal to support the integrated circuit package and an array of supports so that the chip can be held on both the obverse and reverse side of the package. The formed trays can be nested when empty and may provide storage space savings. The tray assembly includes a thermoformed tray and rigid peripheral frame, that may be injection molded peripheral frame, to give better rigidity to the assembly.
    Type: Grant
    Filed: March 1, 2001
    Date of Patent: September 2, 2003
    Assignee: Texchem-Pack (M) BHD
    Inventors: Swee Chuan Soh, Tee Hock Lim, Geap Wooi Goh, Shuib Bin Hassan
  • Tray for storing semiconductor chips
    Publication number: 20020066694
    Abstract: A thermo-formed tray and tray assembly designed for the storage and transportation of integrated circuit packages for instance of the type known as a pin grid array or a flip chip pin grid array. The storage tray consists of a number of compartments or recesses usually in a layout of two or three rows by five columns. Each recess includes a central pedestal to support the integrated circuit package and an array of supports so that the chip can be held on both the obverse and reverse side of the package. The formed trays can be nested when empty and may provide storage space savings. The tray assembly includes a thermoformed tray and rigid peripheral frame, that may be injection molded peripheral frame, to give better rigidity to the assembly.
    Type: Application
    Filed: March 1, 2001
    Publication date: June 6, 2002
    Inventors: Swee Chuan Soh, Tee Hock Lim, Geap Wooi Goh, Shuib Bin Hassan
  • Tray for semiconductor packaging
    Patent number: D457434
    Type: Grant
    Filed: January 26, 2001
    Date of Patent: May 21, 2002
    Assignee: Texchem-Pack (M) SDN BHD
    Inventors: Swee Chuan Soh, Tee Hock Lim, Geap Wooi Goh, Shuib Bin Hassan