Abstract: There is provided an IC socket for an IC package having plural pads disposed in a matrix manner on the lower face thereof, on which the IC package can be loaded with a small number of operations, and after the loading, the electrical connection between the pads and contacts can be ensured. The IC socket includes: a load support member having both side walls each provided with guide grooves having cam surfaces; a pressure application cover changing position between a load position which applies load to an IC package thereby pressing the pads against elastic contacts and a no-load position, and having nail sections sliding along the cam surfaces in the guide grooves; a lever including a crankshaft section causing the nail sections to slide along the cam surfaces in the guide grooves thereby causing the pressure application cover to change position between the load position and the no-load position.

Abstract: An IC package is guided to the proper position therefore on a mounting surface of an IC socket with good mounting workability, while preventing buckling and deformation of contacts. In addition, a guide member is enabled to be urged upward stably, without increasing the number of parts. The IC socket includes: an insulative housing that holds a plurality of contacts; a cover plate; and a lever. A guide member, which includes: a pair of guide rails for guiding the IC package; and a link member for linking the guide rails to each other, is attached to the housing. Spring arms for urging the guide member upward are provided on the guide rails and the link member. Regulating members that regulate upward movement of the guide member at a position, where the guided IC package does not contact the electrical contacts, are provided on the housing and the guide member.

Abstract: There is provided an IC socket for an IC package having plural pads disposed in a matrix manner on the lower face thereof, on which the IC package can be loaded with a small number of operations, and after the loading, the electrical connection between the pads and contacts can be ensured. The IC socket includes: a load support member having both side walls each provided with guide grooves having cam surfaces; a pressure application cover changing position between a load position which applies load to an IC package thereby pressing the pads against elastic contacts and a no-load position, and having nail sections sliding along the cam surfaces in the guide grooves; a lever including a crankshaft section causing the nail sections to slide along the cam surfaces in the guide grooves thereby causing the pressure application cover to change position between the load position and the no-load position.

Abstract: There is provided an IC socket for an IC package having plural pads disposed in a matrix manner on the lower face thereof, on which the IC package can be loaded with a small number of operations, and after the loading, the electrical connection between the pads and contacts can be ensured. The IC socket includes: a load support member having both side walls each provided with guide grooves having cam surfaces; a pressure application cover changing position between a load position which applies load to an IC package thereby pressing the pads against elastic contacts and a no-load position, and having nail sections sliding along the cam surfaces in the guide grooves; a lever including a crankshaft section causing the nail sections to slide along the cam surfaces in the guide grooves thereby causing the pressure application cover to change position between the load position and the no-load position.

Abstract: An IC package is guided to the proper position therefore on a mounting surface of an IC socket with good mounting workability, while preventing buckling and deformation of contacts. In addition, a guide member is enabled to be urged upward stably, without increasing the number of parts. The IC socket includes: an insulative housing that holds a plurality of contacts; a cover plate; and a lever. A guide member, which includes: a pair of guide rails for guiding the IC package; and a link member for linking the guide rails to each other, is attached to the housing. Spring arms for urging the guide member upward are provided on the guide rails and the link member. Regulating members that regulate upward movement of the guide member at a position, where the guided IC package does not contact the electrical contacts, are provided on the housing and the guide member.

Abstract: The present invention provides a cable connector that can reduce the stress that is generated in the solder connections between the contacts of the connector and the circuit board. The cable connector comprises a plurality of contacts, each having a contact part configured to contact a mating contact on one end, and a soldering part on the other end, a circuit board that is soldered to the soldering part of the contacts and is soldered to a cable, a housing that accommodates the contacts, the housing having a mating part disposed on the front thereof configured to mate with the mating connector and circuit board supporting parts that support the circuit board and extend rearward from both ends of the mating part, and locking arms disposed in the housing and configured to lock with a mating connector. The locking arms extend along both sides of the mating part and extend along the circuit board supporting parts.

Abstract: An IC package is guided to the proper position therefore on a mounting surface of an IC socket with good mounting workability, while preventing buckling and deformation of contacts. In addition, a guide member is enabled to be urged upward stably, without increasing the number of parts. The IC socket includes: an insulative housing that holds a plurality of contacts; a cover plate; and a lever. A guide member, which includes: a pair of guide rails for guiding the IC package; and a link member for linking the guide rails to each other, is attached to the housing. Spring arms for urging the guide member upward are provided on the guide rails and the link member. Regulating members that regulate upward movement of the guide member at a position, where the guided IC package does not contact the electrical contacts, are provided on the housing and the guide member.

Abstract: There is provided an IC socket for an IC package having plural pads disposed in a matrix manner on the lower face thereof, on which the IC package can be loaded with a small number of operations, and after the loading, the electrical connection between the pads and contacts can be ensured. The IC socket includes: a load support member having both side walls each provided with guide grooves having cam surfaces; a pressure application cover changing position between a load position which applies load to an IC package thereby pressing the pads against elastic contacts and a no-load position, and having nail sections sliding along the cam surfaces in the guide grooves; a lever including a crankshaft section causing the nail sections to slide along the cam surfaces in the guide grooves thereby causing the pressure application cover to change position between the load position and the no-load position.

Abstract: Solder balls are offset in the horizontal direction from fixing portions while their positional accuracy is ensured, and signal paths are shortened in a ball grid array IC socket. Contacts fixed to contact hosing apertures of a housing include base portions, contact arms, and terminal portions that extend from the lower ends of the base portions toward a circuit board. The contact arms protrude so as to extend upward and then are bent unidirectionally. The terminal portions are constituted by transition portions that link solder ball pads to the base portions, while offsetting the solder ball pads in the same direction as the contact arms. The transition portions include vertical portions which are substantially perpendicular to the solder ball pads or inclined portions angled upwardly from the solder ball pads. The vertical or inclined portions prevent movement of the solder balls, thereby preventing positional misalignment and deformation thereof.

Abstract: The present invention provides a cable connector that can reduce the stress that is generated in the solder connections between the contacts of the connector and the circuit board. The cable connector comprises a plurality of contacts, each having a contact part configured to contact a mating contact on one end, and a soldering part on the other end, a circuit board that is soldered to the soldering part of the contacts and is soldered to a cable, a housing that accommodates the contacts, the housing having a mating part disposed on the front thereof configured to mate with the mating connector and circuit board supporting parts that support the circuit board and extend rearward from both ends of the mating part, and locking arms disposed in the housing and configured to lock with a mating connector. The locking arms extend along both sides of the mating part and extend along the circuit board supporting parts.

Abstract: Solder balls are offset in the horizontal direction from fixing portions while their positional accuracy is ensured, and signal paths are shortened in a ball grid array IC socket. Contacts fixed to contact hosing apertures of a housing include base portions, contact arms, and terminal portions that extend from the lower ends of the base portions toward a circuit board. The contact arms protrude so as to extend upward and then are bent unidirectionally. The terminal portions are constituted by transition portions that link solder ball pads to the base portions, while offsetting the solder ball pads in the same direction as the contact arms. The transition portions include vertical portions which are substantially perpendicular to the solder ball pads or inclined portions angled upwardly from the solder ball pads. The vertical or inclined portions prevent movement of the solder balls, thereby preventing positional misalignment and deformation thereof.

Abstract: The electrical connector is provided with a locking member which is disposed on the base housing so that the locking member can move between an open position and a locking position in a direction that is perpendicular to the direction of movement of the slide member. The locking member is positioned in the open position when the slide member is in a first position. Furthermore, when the slide member is in a second position, in which pins of an electronic component and contacts of the electrical connector are in contact, the locking member moves to the locking position and contacts the slide member, so that the movement of the slide member is checked. Furthermore, an engaging part, which engages with a tool that is used to move the locking member, is disposed in the upper surface of the locking member.

Abstract: The electrical connector is provided with a locking member which is disposed on the base housing so that this locking member can move between an open position and a locking position in a direction that is perpendicular to the direction of movement of the slide member. The locking member is positioned in the open position when the slide member is in the first position. Furthermore, when the slide member is in the second position, in which the pins of the electronic component and the contacts of the electrical connector are in contact, the locking member moves to the locking position and contacts the slide member, so that the movement of the slide member is checked. Furthermore, an engaging part which engages with the tool T that is used to move the locking member is disposed in the upper surface of the locking member.

Abstract: A conductive supporting plate (150) is fastened to the engaging end part (130) of a flexible circuit board (190) so that the conductive supporting plate (150) is connected to the ground surface of the flexible circuit board (190). The conductive supporting plate is installed on the engaging end part 130 of the flexible circuit board (190). The flexible circuit board (190) is accommodated together with the conductive supporting plate (150) in a board-mounted connector (20) on a mating side, and is fastened to the board-mounted connector (20) by screw means (105). The conductive supporting plate (150) is pressed against grounding means (70) installed on the board-mounted connector (20) by the screw means (105).

Abstract: The present invention provides a plug 2 and receptacle 100 each having shells 6,104. When the connectors 2,100 are engaged, the shell 104 of the receptacle 100 slides in contact with the shell 6 of the plug 2. The steps 152 of the shell 104 are positioned beneath the steps 14 of the shell 6, so that openings 118 and 34 formed in the respective steps 152 and 14 are aligned with each other when the connectors are completely engaged with each other. During the process of engagement, the claws 32 of the latching arms 10 move along the steps 152, advance into the openings 118 by the action of the plate springs 47, to latch the plug and receptacle together. To disengage, the release sections of the latching arms 10 are pressed whereupon the engaging members 30 open so that the claws 32 exit the openings 118.

Abstract: The present invention provides a plug 2 and receptacle 100 each having shells 6,104. When the connectors 2,100 are engaged, the shell 104 of the receptacle 100 slides in contact with the shell 6 of the plug 2. The steps 152 of the shell 104 are positioned beneath the steps 14 of the shell 6, so that openings 118 and 34 formed in the respective steps 152 and 14 are aligned with each other when the connectors are completely engaged with each other. During the process of engagement, the claws 32 of the latching arms 10 move along the steps 152, advance into the openings 118 by the action of the plate springs 47, to latch the plug and receptacle together. To disengage, the release sections of the latching arms 10 are pressed whereupon the engaging members 30 open so that the claws 32 exit the openings 118.

Abstract: In a connector assembly for mounting on printed circuit boards and consisting of a receptacle connector (10) and a plug connector (20), the plug-side board mount (26) has a contact tab (26c), and the receptacle-side board mount (16) has a spring arm contact section (16c) that engages the contact tab (26c) of the plug-side board mount (26) when the connectors are mated. The spring arm contact section (16c) is disposed within a vertical through-cavity (12b) of the receptacle connector (10). When the connectors are mated, the spring arm contact section (16c) located in the through-cavity (12b) of the receptacle connector fits into the through-cavity (22b) of the plug connector where it engages with the contact tab (26c).

Abstract: A cap housing (30,130,300,400,500) for mounting electrical connectors (80,180,380,480,580,680) thereto comprises cap portions (40,60,140,160,310,410,511,512) for receiving mating sections of connector housings containing contact portions (84b,184b,384,484,584,684) of electrical contacts (84,184,383,483,583,683) for protecting the contact portions, the mounting sections of the connector housings containing tine portions (84a,184a,386,486,586,686) that are to be positioned on a circuit board and soldered thereto, and engaging members (48,68,148,168,313,420,513,514) of the cap portions for engaging the electrical connectors thereby maintaining the electrical connectors on the cap portions.

Abstract: FPC connector (20) has multiple beam-shaped primary contacts (50) arranged on one side of an opening (30a) in housing (30) and multiple U-shaped secondary contacts (60) arranged along the other side of the opening. A tongue (45) of outer housing (40) together with the contact edge of the FPC (10) is inserted in the U-shaped portions of these U-shaped secondary contacts (60). This results in the forming of electrical contact between contact points (65, 53) of the contacts (60) and the primary contacts (50) with the conductive pads (12, 13) arranged in two rows along the contacting edge of the FPC (10).

Abstract: Contacts fabricated from a thin metal sheet by stamping in the form of a lead frame are used as U-shaped contact assemblies 30 which are straddled over and secured to side walls 22, 23 of the insulating housing 20 or are molded as an integral part thereof. Due to the fact that a gap G is formed between the outer surface 36 of contacts 31 of the contact assembly 30 and outside surface of side walls 22, 23 of the insulating housing 20, the connector 10 can move in a lateral direction relative to the printed circuit board 50.