Abstract: In a laminated ceramic electronic component in which, by directly carrying out a plating process on an outer surface of a component main body, an external electrode is formed thereon, an attempt is made to improve the adhesion strength between a plated film forming the external electrode and the component main body. A brazing material containing Ti is applied to at least one portion of a surface on which external electrodes of a component main body is formed, and by baking this brazing material, a metal layer containing Ti is formed. Moreover, the external electrodes are formed by a plating process so as to coat at least the metal layer, and a heating process is then carried out so as to cause counter diffusion between the metal layer and the plated film that is to form the external electrodes.

Abstract: A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.

Abstract: A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.

Abstract: A method for manufacturing a monolithic ceramic electronic component includes a plating substep of depositing precipitates primarily composed of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated layer, wherein the specific metal is different from that of the internal electrodes, and the same or substantially the same metal that defines the internal electrodes is distributed throughout the plated layer.

Abstract: A method for manufacturing a monolithic ceramic electronic component includes a plating substep of depositing precipitates primarily composed of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated layer, wherein the specific metal is different from that of the internal electrodes, and the same or substantially the same metal that defines the internal electrodes is distributed throughout the plated layer.

Abstract: In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.

Abstract: An electronic device including a first body having a first battery; and a second body having a second battery, the second body being configured to be electrically connected to the first body and separatable from the first body; the first body including: receiving a request for charge of battery from the first body or the second body; retrieving a remaining amount of battery inside the first body and the second body; comparing the battery of the first body and the battery of the second battery on the basis of the retrieved remaining amount of battery; carrying out a charging process for the requested battery indicated by the received request in case that a power source including the not-requested battery satisfies a predetermined requirement as a result of the comparing.

Abstract: A thermoelectric conversion module which has a P-type thermoelectric conversion material and an N-type thermoelectric conversion material electrically connected to each other. The P-type thermoelectric conversion material and the N-type thermoelectric conversion material are joined with insulating material particles (ceramic spherical particles) interposed therebetween, so as not to be electrically connected to each other.

Abstract: A thermoelectric conversion module is formed by bonding a P-type thermoelectric conversion material and an N-type thermoelectric conversion material together with an insulating material including spherical ceramic grains having an index of grain size dispersion, 3CV, of about 20% or less interposed therebetween. The P-type thermoelectric conversion material and the N-type thermoelectric conversion material are electrically connected to each other in a region other than a region in which the P-type thermoelectric conversion material and the N-type thermoelectric conversion material are bonded together with the insulating material interposed therebetween. The spherical ceramic grains have an average grain size of about 0.05 mm to about 0.6 mm, and the insulating material is an insulating glass material.

Abstract: In a laminated ceramic electronic component in which, by directly carrying out a plating process on an outer surface of a component main body, an external electrode is formed thereon, an attempt is made to improve the adhesion strength between a plated film forming the external electrode and the component main body. A brazing material containing Ti is applied to at least one portion of a surface on which external electrodes of a component main body is formed, and by baking this brazing material, a metal layer containing Ti is formed. Moreover, the external electrodes are formed by a plating process so as to coat at least the metal layer, and a heating process is then carried out so as to cause counter diffusion between the metal layer and the plated film that is to form the external electrodes.

Abstract: A method for producing a multilayer ceramic electronic component includes a plating step including depositing a plating material on the ends of internal electrodes exposed at a predetermined surface of a laminate to form plating deposits primarily composed of a specific metal and growing the plating deposits so as to connect the plating deposits to each other to form a continuous plated layer. The specific metal primarily defining the plated layer is different from a metal defining the internal electrodes. The same or substantially the same metal as the metal defining the internal electrodes is present throughout the plated layer.

Abstract: This invention provides cosmetics containing a multi-functional composite powder having the properties of (a) an excellent adhesiveness, (b) an excellent extendability, (c) an appropriate glossy effect, (d) a homogeneous cosmetic film, (e) an appropriate covering capability, (f) a cosmetic film not causing a white masking, (g) a high compatibility between a color appearance of cosmetics and a color tone of the cosmetic film, (h) an excellent soft-focusing capability, (i) an excellent ultraviolet protective effect, and the like. The multi-functional composite powder is constituted by a scale-like base material, a group of particles comprising at least fine particles of titanium dioxide deposited on a surface of the scale-like base material, and a thin film of a composite oxide containing titanium and iron coated thereon.

Abstract: A method for manufacturing a monolithic ceramic electronic component includes a plating substep of depositing precipitates primarily composed of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated layer, wherein the specific metal is different from that of the internal electrodes, and the same or substantially the same metal that defines the internal electrodes is distributed throughout the plated layer.

Abstract: A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.

Abstract: An automated control system is described for a conveying system including an input conveyor supplying a product, a segmented output conveyor delivering a product in a pattern, and one or more synchronizing conveyors disposed between the input conveyor and the output conveyor. The control system comprises a plurality of product position sensors for sensing position of product on each synchronizing conveyor. A conveyor sensor senses segment position of the output conveyor. A plurality of drives, one for each respective conveyor, control the respective conveyors. A database stores a plurality of template pattern algorithms each defining a control algorithm for a distinct product pattern to be delivered from the segmented output conveyor. A controller is operatively connected to the product position sensors, the conveyor sensor and the drives for controlling the conveyors responsive to sensed product position and segment position.

Abstract: Disclosed are a mammalian trehalose receptor which comprises a protein comprising any of the amino acid sequences of SEQ ID NOs: 1, 2, 3 and 5; or a protein comprising any of the amino acid sequences of SEQ ID NOs: 1, 4 and 5; and a method for detecting trehalose using an animal cell in which the trehalose receptor has been expressed.

Abstract: Provided is an electroconductive paste comprising copper powders, a glass powder, and an organic vehicle, wherein: the copper powders comprise (1) from about 50% to 90% by weight of a copper powder A containing from about 1% to 3% by weight of oxygen and having an average particle size of from about 0.9 to 1.5 &mgr;m; and (2) from about 10% to 50% by weight of a copper powder B containing from about 0.2% to 3% by weight of oxygen and having an average particle size of not more than about 0.6 &mgr;m. It has an excellent electroconductivity as well as a sufficiently large bonding strength to a board.

Abstract: A conductive paste which can form a thick film conductor containing no lead, being able to be fired at a middle temperature, superior in conductivity, and having sufficient adhesive strength to a substrate, and a printed wiring board formed using the conductive paste are provided. The conductive paste contains a Cu containing powder; a glass frit; and an organic vehicle, wherein the glass has a composition represented by xBi2O3—yB2O3—zSiO2, where x, y, and z are indicated in mole %, and a composition ratio (x, y, z) within the range surrounded by point A (15, 35, 50), point B (25, 60, 15), point C (45, 40, 15) and point D (45, 20, 35) in a ternary compositional diagram, and a mean particle diameter of about 0.1 to 1.0 &mgr;m.

Abstract: A conductive paste which can form a thick film conductor containing no lead, being able to be fired at a middle temperature, superior in conductivity, and having sufficient adhesive strength to a substrate, and a printed wiring board formed using the conductive paste are provided. The conductive paste contains a Cu containing powder; a glass frit; and an organic vehicle, wherein the glass has a composition represented by xBi2O3—yB2O3—zSiO2, where x, y, and z are indicated in mole %, and a composition ratio (x, y, z) within the range surrounded by point A (15, 35, 50), point B (25, 60, 15), point C (45, 40, 15) and point D (45, 20, 35) in a ternary compositional diagram, and a mean particle diameter of about 0.1 to 1.0 &mgr;m.

Abstract: Provided is an electroconductive paste comprising copper powders, a glass powder, and an organic vehicle, wherein: the copper powders comprise (1) from about 50% to 90% by weight of a copper powder A containing from about 1% to 3% by weight of oxygen and having an average particle size of from about 0.9 to 1.5 &mgr;m; and (2) from about 10% to 50% by weight of a copper powder B containing from about 0.2% to 3% by weight of oxygen and having an average particle size of not more than about 0.6 &mgr;m. It has an excellent electroconductivity as well as a sufficiently large bonding strength to a board.