Patents by Inventor Shuji Tohyama
Shuji Tohyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11293820Abstract: A physical quantity measuring device includes: a metallic cylindrical case; a sensor module configured to detect a physical quantity; a synthetic-resin joint provided near a first open end of the cylindrical case, the joint being attached with the sensor module and provided with an introduction port for introducing a measurement target fluid; and a cover provided near a second open end of the cylindrical case. The cover includes a locking portion for locking the sensor module. The cylindrical case includes an engagement portion provided near the first open end and engaged with the joint and a crimp portion provided near the second open end, the crimp portion configured to be plastically deformed by crimping. The cover is attached to the cylindrical case by crimping the crimp portion.Type: GrantFiled: March 20, 2020Date of Patent: April 5, 2022Assignee: NAGANO KEIKI CO., LTD.Inventors: Yusuke Abe, Shuji Tohyama, Haruhiko Sekiya
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Publication number: 20200309627Abstract: A physical quantity measuring device includes: a metallic cylindrical case; a sensor module configured to detect a physical quantity; a synthetic-resin joint provided near a first open end of the cylindrical case, the joint being attached with the sensor module and provided with an introduction port for introducing a measurement target fluid; and a cover provided near a second open end of the cylindrical case. The cover includes a locking portion for locking the sensor module. The cylindrical case includes an engagement portion provided near the first open end and engaged with the joint and a crimp portion provided near the second open end, the crimp portion configured to be plastically deformed by crimping. The cover is attached to the cylindrical case by crimping the crimp portion.Type: ApplicationFiled: March 20, 2020Publication date: October 1, 2020Inventors: Yusuke Abe, Shuji Tohyama, Haruhiko Sekiya
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Patent number: 10274388Abstract: A sensor module and a joint are made of different metal materials. The sensor module includes a first portion located near a diaphragm and a second portion having a large-diameter portion whose diameter is larger than that of the first portion. A step engaged with a peripheral edge of the large-diameter portion is formed on the joint. The large-diameter portion and the joint are mutually bonded through a bonding portion. The bonding portion is bonded by a plastic deformation bonding that is so-called metal flow. A space is defined between the joint and the module body.Type: GrantFiled: March 30, 2017Date of Patent: April 30, 2019Assignee: NAGANO KEIKI CO., LTD.Inventors: Haruhiko Sekiya, Shuji Tohyama, Nobuhiko Akimoto
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Patent number: 10145749Abstract: A physical quantity measuring device includes: a sensor module provided with a diaphragm; a joint to which the sensor module is attached, the joint including a pressure inlet for delivering fluid to be measured to the sensor module. The joint is made of a synthetic resin and includes a joint body and an elastically deformable claw provided to the joint body and configured to lock the sensor module. Since the claw keeps the sensor module to be held by virtue of the elastic force of the claw, a further attachment process such as welding for attaching the sensor module to the joint is unnecessary. Since the joint body and the claw are integrally made of synthetic resin, it is not necessary to separately manufacture the joint body and the claw.Type: GrantFiled: November 29, 2016Date of Patent: December 4, 2018Assignee: NAGANO KEIKI CO., LTD.Inventors: Yusuke Abe, Shuji Tohyama, Haruhiko Sekiya
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Patent number: 10113926Abstract: A physical quantity measuring sensor includes: a joint having a projection; a ceramic sensor module including a diaphragm and a cylindrical portion integrated with the diaphragm and provided to the projection; and an O-ring interposed between a sensor-module flat portion extending in a direction orthogonal to an axial direction of the cylindrical portion and a joint flat portion extending in a direction orthogonal to an axial direction of the projection.Type: GrantFiled: July 5, 2017Date of Patent: October 30, 2018Assignee: NAGANO KEIKI CO., LTD.Inventors: Hironori Kobayashi, Shuji Tohyama, Yusuke Abe, Haruhiko Sekiya
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Publication number: 20170299453Abstract: A physical quantity measuring sensor includes: a joint having a projection; a ceramic sensor module including a diaphragm and a cylindrical portion integrated with the diaphragm and provided to the projection; and an O-ring interposed between a sensor-module flat portion extending in a direction orthogonal to an axial direction of the cylindrical portion and a joint flat portion extending in a direction orthogonal to an axial direction of the projection.Type: ApplicationFiled: July 5, 2017Publication date: October 19, 2017Inventors: Hironori Kobayashi, Shuji Tohyama, Yusuke Abe, Haruhiko Sekiya
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Publication number: 20170292885Abstract: A sensor module and a joint are made of different metal materials. The sensor module includes a first portion located near a diaphragm and a second portion having a large-diameter portion whose diameter is larger than that of the first portion. A step engaged with a peripheral edge of the large-diameter portion is formed on the joint. The large-diameter portion and the joint are mutually bonded through a bonding portion. The bonding portion is bonded by a plastic deformation bonding that is so-called metal flow. A space is defined between the joint and the module body.Type: ApplicationFiled: March 30, 2017Publication date: October 12, 2017Inventors: Haruhiko Sekiya, Shuji Tohyama, Nobuhiko Akimoto
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Patent number: 9772242Abstract: A physical quantity measuring sensor includes: a joint having a projection; a ceramic sensor module including a diaphragm and a cylindrical portion integrated with the diaphragm and provided to the projection; and an O-ring interposed between a sensor-module flat portion extending in a direction orthogonal to an axial direction of the cylindrical portion and a joint flat portion extending in a direction orthogonal to an axial direction of the projection.Type: GrantFiled: December 4, 2014Date of Patent: September 26, 2017Assignee: NAGANO KEIKI CO., LTD.Inventors: Hironori Kobayashi, Shuji Tohyama, Yusuke Abe, Haruhiko Sekiya
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Publication number: 20170153157Abstract: A physical quantity measuring device includes: a sensor module provided with a diaphragm; a joint to which the sensor module is attached, the joint including a pressure inlet for delivering fluid to be measured to the sensor module. The joint is made of a synthetic resin and includes a joint body and an elastically deformable claw provided to the joint body and configured to lock the sensor module. Since the claw keeps the sensor module to be held by virtue of the elastic force of the claw, a further attachment process such as welding for attaching the sensor module to the joint is unnecessary. Since the joint body and the claw are integrally made of synthetic resin, it is not necessary to separately manufacture the joint body and the claw.Type: ApplicationFiled: November 29, 2016Publication date: June 1, 2017Inventors: Yusuke Abe, Shuji Tohyama, Haruhiko Sekiya
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Patent number: 9631991Abstract: A device includes: a sensor module; a housing that houses the sensor module; a connector provided to the housing; a terminal provided to the connector; and an elastic electrically conductive member provided in a space between the sensor module and the connector and interposed between the terminal and a pad. The sensor module includes: a ceramic module body including a diaphragm and a cylindrical portion integral with a periphery of the diaphragm; a detector provided on a flat surface of the diaphragm; and the pad and an electronic component provided on a flat surface of the cylindrical portion radially outwardly adjacent to the flat surface of the diaphragm. The pad is electrically connected to the electrically conductive member.Type: GrantFiled: September 25, 2015Date of Patent: April 25, 2017Assignee: NAGANO KEIKI CO., LTD.Inventors: Shuji Tohyama, Nobutaka Yamagishi, Naoki Yamashita, Yusuke Midorikawa
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Patent number: 9389134Abstract: A sensor includes: a housing with a terminal; a joint including a projecting portion; a sensor module provided to the projecting portion and including a strain gauge; a conductive member connecting the terminal and the strain gauge; a cap-shaped synthetic resin base provided to the projecting portion, including a top with an opening in which the strain gauge is exposed and lateral portions intersecting the top, and having an inner circumferential surface slidable along an outer circumferential surface of the projecting portion; and an electronic component mounted on the lateral portions. The conductive member includes: a flexible circuit board having a first end connected to the terminal and a second end connected to the base; and a three-dimensional circuit connected to the electronic component, three-dimensionally arranged continuously along the top and the lateral portions of the base, and having one end connected to the flexible circuit board.Type: GrantFiled: June 5, 2014Date of Patent: July 12, 2016Assignee: NAGANO KEIKI CO., LTD.Inventors: Yukinobu Iimori, Hironori Kobayashi, Shuji Tohyama
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Publication number: 20160091377Abstract: A device includes: a sensor module; a housing that houses the sensor module; a connector provided to the housing; a terminal provided to the connector; and an elastic electrically conductive member provided in a space between the sensor module and the connector and interposed between the terminal and a pad. The sensor module includes: a ceramic module body including a diaphragm and a cylindrical portion integral with a periphery of the diaphragm; a detector provided on a flat surface of the diaphragm; and the pad and an electronic component provided on a flat surface of the cylindrical portion radially outwardly adjacent to the flat surface of the diaphragm. The pad is electrically connected to the electrically conductive member.Type: ApplicationFiled: September 25, 2015Publication date: March 31, 2016Inventors: Shuji Tohyama, Nobutaka Yamagishi, Naoki Yamashita, Yusuke Midorikawa
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Publication number: 20150160085Abstract: A physical quantity measuring sensor includes: a joint having a projection; a ceramic sensor module including a diaphragm and a cylindrical portion integrated with the diaphragm and provided to the projection; and an O-ring interposed between a sensor-module flat portion extending in a direction orthogonal to an axial direction of the cylindrical portion and a joint flat portion extending in a direction orthogonal to an axial direction of the projection.Type: ApplicationFiled: December 4, 2014Publication date: June 11, 2015Inventors: Hironori Kobayashi, Shuji Tohyama, Yusuke Abe, Haruhiko Sekiya
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Publication number: 20140360277Abstract: A sensor includes: a housing with a terminal; a joint including a projecting portion; a sensor module provided to the projecting portion and including a strain gauge; a conductive member connecting the terminal and the strain gauge; a cap-shaped synthetic resin base provided to the projecting portion, including a top with an opening in which the strain gauge is exposed and lateral portions intersecting the top, and having an inner circumferential surface slidable along an outer circumferential surface of the projecting portion; and an electronic component mounted on the lateral portions. The conductive member includes: a flexible circuit board having a first end connected to the terminal and a second end connected to the base; and a three-dimensional circuit connected to the electronic component, three-dimensionally arranged continuously along the top and the lateral portions of the base, and having one end connected to the flexible circuit board.Type: ApplicationFiled: June 5, 2014Publication date: December 11, 2014Inventors: Yukinobu Iimori, Hironori Kobayashi, Shuji Tohyama
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Patent number: 8286496Abstract: In a sensor, a joint is provided with a sensor module, and the sensor module is accommodated in a housing. The housing is provided with a terminal, and a flexible circuit board electrically connects a diaphragm of the sensor module with the terminal. The joint is also provided with a cap-shaped base, and the top of the base is provided with an opening through which the diaphragm is exposed. A lateral surface of the base, which is crosswise with the top where the opening is provided, is provided with a part of the flexible circuit board, and the part is provided with an electronic component. With this arrangement, no plate-shaped circuit board for mounting the electronic component is required, thereby reducing the manufacturing cost. Moreover, since the electronic component is provided on the lateral surfaces of the base, the base and the electronic component are horizontally arranged.Type: GrantFiled: February 16, 2010Date of Patent: October 16, 2012Assignee: Nagano Keiki Co., Ltd.Inventors: Haruhiko Sekiya, Shuji Tohyama, Hironori Kobayashi, Nobuhiko Akimoto
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Publication number: 20100206085Abstract: In a sensor, a joint is provided with a sensor module, and the sensor module is accommodated in a housing. The housing is provided with a terminal, and a flexible circuit board electrically connects a diaphragm of the sensor module with the terminal. The joint is also provided with a cap-shaped base, and the top of the base is provided with an opening through which the diaphragm is exposed. A lateral surface of the base, which is crosswise with the top where the opening is provided, is provided with a part of the flexible circuit board, and the part is provided with an electronic component. With this arrangement, no plate-shaped circuit board for mounting the electronic component is required, thereby reducing the manufacturing cost. Moreover, since the electronic component is provided on the lateral surfaces of the base, the base and the electronic component are horizontally arranged.Type: ApplicationFiled: February 16, 2010Publication date: August 19, 2010Applicant: NAGANO KEIKI CO., LTD.Inventors: Haruhiko Sekiya, Shuji Tohyama, Hironori Kobayashi, Nobuhiko Akimoto
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Patent number: 7640812Abstract: A cap is provided on a diaphragm, and a first end of a flexible board is connected to the cap. A cover is attached to the cap. The cover directs a second end of the flexible board in a direction away from the diaphragm held by a joint so that the flexible board is supported while being curved. Since the flexible board is not locally bent at an acute angle, a crack is not generated on a copper pattern provided on the flexible board.Type: GrantFiled: March 18, 2008Date of Patent: January 5, 2010Assignee: Nagano Keiki Co., Ltd.Inventors: Yukinobu Iimori, Nobuaki Yamada, Shuji Tohyama, Takayuki Yokoyama
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Patent number: 7627943Abstract: A method of manufacturing a pressure sensor is provided whereby the pressure sensor includes a joint, a diaphragm, and an adapter disposed between the joint and the diaphragm. The adapter includes an axis portion and a flange projecting in a radial direction from the axis portion. The axis portion is disposed such that one end does not interfere with the joint and the other end is welded to the diaphragm. The diaphragm is welded to the adapter and the welded portion the welded portion is positioned on an inner side of an end face of the joint. The joint is caulked to a peripheral edge of the flange of the adapter.Type: GrantFiled: December 4, 2006Date of Patent: December 8, 2009Assignee: Nagano Keiki Co., Ltd.Inventors: Shuji Tohyama, Takayuki Yokoyama, Ikuya Miyahara
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Patent number: 7581448Abstract: A pressure sensor is provided with a cap on a measuring portion of a diaphragm to which a first end of a flexible board is connected while a second end of the flexible board is connected to a circuit board spaced apart from the diaphragm. The flexible board is provided with the first end, a belt portion that is bent at an angle of ninety degrees or more relative to the first end in a direction to be away from the circuit board and is curved along the outer circumference of the diaphragm, and the second end that is bent at an angle of ninety degrees or more relative to the belt portion to be connected to the circuit board.Type: GrantFiled: March 13, 2008Date of Patent: September 1, 2009Assignee: Nagano Keiki Co., Ltd.Inventors: Yukinobu Iimori, Nobuaki Yamada, Shuji Tohyama, Takayuki Yokoyama
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Patent number: 7484417Abstract: A pressure sensor includes: a main body case including a housing (1) and a joint (2); an electronic circuit (3) housed inside the main body case to convert detected pressure into electrical signals to send out; a connecting metal piece (5), one end (51)of which abuts on an electrode (31) of the electronic circuit (3); a terminal (4), one end (41) of which is joined to the other end (52) of the connecting metal piece (5) and the other end (42) of which is disposed outside the main body case; and a cushion (7) biasing the one end (51) to the electrode (31). The one end (51) and the electrode (31) are electrically connected by biasing force of the cushion (7), which eliminates welding, enabling manufacturing at low cost.Type: GrantFiled: March 28, 2005Date of Patent: February 3, 2009Assignee: Nagano Keiki Co., Ltd.Inventors: Shuji Tohyama, Ikuya Miyahara, Hayato Kobayashi