Patents by Inventor Shuji Tohyama

Shuji Tohyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11293820
    Abstract: A physical quantity measuring device includes: a metallic cylindrical case; a sensor module configured to detect a physical quantity; a synthetic-resin joint provided near a first open end of the cylindrical case, the joint being attached with the sensor module and provided with an introduction port for introducing a measurement target fluid; and a cover provided near a second open end of the cylindrical case. The cover includes a locking portion for locking the sensor module. The cylindrical case includes an engagement portion provided near the first open end and engaged with the joint and a crimp portion provided near the second open end, the crimp portion configured to be plastically deformed by crimping. The cover is attached to the cylindrical case by crimping the crimp portion.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: April 5, 2022
    Assignee: NAGANO KEIKI CO., LTD.
    Inventors: Yusuke Abe, Shuji Tohyama, Haruhiko Sekiya
  • Publication number: 20200309627
    Abstract: A physical quantity measuring device includes: a metallic cylindrical case; a sensor module configured to detect a physical quantity; a synthetic-resin joint provided near a first open end of the cylindrical case, the joint being attached with the sensor module and provided with an introduction port for introducing a measurement target fluid; and a cover provided near a second open end of the cylindrical case. The cover includes a locking portion for locking the sensor module. The cylindrical case includes an engagement portion provided near the first open end and engaged with the joint and a crimp portion provided near the second open end, the crimp portion configured to be plastically deformed by crimping. The cover is attached to the cylindrical case by crimping the crimp portion.
    Type: Application
    Filed: March 20, 2020
    Publication date: October 1, 2020
    Inventors: Yusuke Abe, Shuji Tohyama, Haruhiko Sekiya
  • Patent number: 10274388
    Abstract: A sensor module and a joint are made of different metal materials. The sensor module includes a first portion located near a diaphragm and a second portion having a large-diameter portion whose diameter is larger than that of the first portion. A step engaged with a peripheral edge of the large-diameter portion is formed on the joint. The large-diameter portion and the joint are mutually bonded through a bonding portion. The bonding portion is bonded by a plastic deformation bonding that is so-called metal flow. A space is defined between the joint and the module body.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: April 30, 2019
    Assignee: NAGANO KEIKI CO., LTD.
    Inventors: Haruhiko Sekiya, Shuji Tohyama, Nobuhiko Akimoto
  • Patent number: 10145749
    Abstract: A physical quantity measuring device includes: a sensor module provided with a diaphragm; a joint to which the sensor module is attached, the joint including a pressure inlet for delivering fluid to be measured to the sensor module. The joint is made of a synthetic resin and includes a joint body and an elastically deformable claw provided to the joint body and configured to lock the sensor module. Since the claw keeps the sensor module to be held by virtue of the elastic force of the claw, a further attachment process such as welding for attaching the sensor module to the joint is unnecessary. Since the joint body and the claw are integrally made of synthetic resin, it is not necessary to separately manufacture the joint body and the claw.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: December 4, 2018
    Assignee: NAGANO KEIKI CO., LTD.
    Inventors: Yusuke Abe, Shuji Tohyama, Haruhiko Sekiya
  • Patent number: 10113926
    Abstract: A physical quantity measuring sensor includes: a joint having a projection; a ceramic sensor module including a diaphragm and a cylindrical portion integrated with the diaphragm and provided to the projection; and an O-ring interposed between a sensor-module flat portion extending in a direction orthogonal to an axial direction of the cylindrical portion and a joint flat portion extending in a direction orthogonal to an axial direction of the projection.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: October 30, 2018
    Assignee: NAGANO KEIKI CO., LTD.
    Inventors: Hironori Kobayashi, Shuji Tohyama, Yusuke Abe, Haruhiko Sekiya
  • Publication number: 20170299453
    Abstract: A physical quantity measuring sensor includes: a joint having a projection; a ceramic sensor module including a diaphragm and a cylindrical portion integrated with the diaphragm and provided to the projection; and an O-ring interposed between a sensor-module flat portion extending in a direction orthogonal to an axial direction of the cylindrical portion and a joint flat portion extending in a direction orthogonal to an axial direction of the projection.
    Type: Application
    Filed: July 5, 2017
    Publication date: October 19, 2017
    Inventors: Hironori Kobayashi, Shuji Tohyama, Yusuke Abe, Haruhiko Sekiya
  • Publication number: 20170292885
    Abstract: A sensor module and a joint are made of different metal materials. The sensor module includes a first portion located near a diaphragm and a second portion having a large-diameter portion whose diameter is larger than that of the first portion. A step engaged with a peripheral edge of the large-diameter portion is formed on the joint. The large-diameter portion and the joint are mutually bonded through a bonding portion. The bonding portion is bonded by a plastic deformation bonding that is so-called metal flow. A space is defined between the joint and the module body.
    Type: Application
    Filed: March 30, 2017
    Publication date: October 12, 2017
    Inventors: Haruhiko Sekiya, Shuji Tohyama, Nobuhiko Akimoto
  • Patent number: 9772242
    Abstract: A physical quantity measuring sensor includes: a joint having a projection; a ceramic sensor module including a diaphragm and a cylindrical portion integrated with the diaphragm and provided to the projection; and an O-ring interposed between a sensor-module flat portion extending in a direction orthogonal to an axial direction of the cylindrical portion and a joint flat portion extending in a direction orthogonal to an axial direction of the projection.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: September 26, 2017
    Assignee: NAGANO KEIKI CO., LTD.
    Inventors: Hironori Kobayashi, Shuji Tohyama, Yusuke Abe, Haruhiko Sekiya
  • Publication number: 20170153157
    Abstract: A physical quantity measuring device includes: a sensor module provided with a diaphragm; a joint to which the sensor module is attached, the joint including a pressure inlet for delivering fluid to be measured to the sensor module. The joint is made of a synthetic resin and includes a joint body and an elastically deformable claw provided to the joint body and configured to lock the sensor module. Since the claw keeps the sensor module to be held by virtue of the elastic force of the claw, a further attachment process such as welding for attaching the sensor module to the joint is unnecessary. Since the joint body and the claw are integrally made of synthetic resin, it is not necessary to separately manufacture the joint body and the claw.
    Type: Application
    Filed: November 29, 2016
    Publication date: June 1, 2017
    Inventors: Yusuke Abe, Shuji Tohyama, Haruhiko Sekiya
  • Patent number: 9631991
    Abstract: A device includes: a sensor module; a housing that houses the sensor module; a connector provided to the housing; a terminal provided to the connector; and an elastic electrically conductive member provided in a space between the sensor module and the connector and interposed between the terminal and a pad. The sensor module includes: a ceramic module body including a diaphragm and a cylindrical portion integral with a periphery of the diaphragm; a detector provided on a flat surface of the diaphragm; and the pad and an electronic component provided on a flat surface of the cylindrical portion radially outwardly adjacent to the flat surface of the diaphragm. The pad is electrically connected to the electrically conductive member.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: April 25, 2017
    Assignee: NAGANO KEIKI CO., LTD.
    Inventors: Shuji Tohyama, Nobutaka Yamagishi, Naoki Yamashita, Yusuke Midorikawa
  • Patent number: 9389134
    Abstract: A sensor includes: a housing with a terminal; a joint including a projecting portion; a sensor module provided to the projecting portion and including a strain gauge; a conductive member connecting the terminal and the strain gauge; a cap-shaped synthetic resin base provided to the projecting portion, including a top with an opening in which the strain gauge is exposed and lateral portions intersecting the top, and having an inner circumferential surface slidable along an outer circumferential surface of the projecting portion; and an electronic component mounted on the lateral portions. The conductive member includes: a flexible circuit board having a first end connected to the terminal and a second end connected to the base; and a three-dimensional circuit connected to the electronic component, three-dimensionally arranged continuously along the top and the lateral portions of the base, and having one end connected to the flexible circuit board.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: July 12, 2016
    Assignee: NAGANO KEIKI CO., LTD.
    Inventors: Yukinobu Iimori, Hironori Kobayashi, Shuji Tohyama
  • Publication number: 20160091377
    Abstract: A device includes: a sensor module; a housing that houses the sensor module; a connector provided to the housing; a terminal provided to the connector; and an elastic electrically conductive member provided in a space between the sensor module and the connector and interposed between the terminal and a pad. The sensor module includes: a ceramic module body including a diaphragm and a cylindrical portion integral with a periphery of the diaphragm; a detector provided on a flat surface of the diaphragm; and the pad and an electronic component provided on a flat surface of the cylindrical portion radially outwardly adjacent to the flat surface of the diaphragm. The pad is electrically connected to the electrically conductive member.
    Type: Application
    Filed: September 25, 2015
    Publication date: March 31, 2016
    Inventors: Shuji Tohyama, Nobutaka Yamagishi, Naoki Yamashita, Yusuke Midorikawa
  • Publication number: 20150160085
    Abstract: A physical quantity measuring sensor includes: a joint having a projection; a ceramic sensor module including a diaphragm and a cylindrical portion integrated with the diaphragm and provided to the projection; and an O-ring interposed between a sensor-module flat portion extending in a direction orthogonal to an axial direction of the cylindrical portion and a joint flat portion extending in a direction orthogonal to an axial direction of the projection.
    Type: Application
    Filed: December 4, 2014
    Publication date: June 11, 2015
    Inventors: Hironori Kobayashi, Shuji Tohyama, Yusuke Abe, Haruhiko Sekiya
  • Publication number: 20140360277
    Abstract: A sensor includes: a housing with a terminal; a joint including a projecting portion; a sensor module provided to the projecting portion and including a strain gauge; a conductive member connecting the terminal and the strain gauge; a cap-shaped synthetic resin base provided to the projecting portion, including a top with an opening in which the strain gauge is exposed and lateral portions intersecting the top, and having an inner circumferential surface slidable along an outer circumferential surface of the projecting portion; and an electronic component mounted on the lateral portions. The conductive member includes: a flexible circuit board having a first end connected to the terminal and a second end connected to the base; and a three-dimensional circuit connected to the electronic component, three-dimensionally arranged continuously along the top and the lateral portions of the base, and having one end connected to the flexible circuit board.
    Type: Application
    Filed: June 5, 2014
    Publication date: December 11, 2014
    Inventors: Yukinobu Iimori, Hironori Kobayashi, Shuji Tohyama
  • Patent number: 8286496
    Abstract: In a sensor, a joint is provided with a sensor module, and the sensor module is accommodated in a housing. The housing is provided with a terminal, and a flexible circuit board electrically connects a diaphragm of the sensor module with the terminal. The joint is also provided with a cap-shaped base, and the top of the base is provided with an opening through which the diaphragm is exposed. A lateral surface of the base, which is crosswise with the top where the opening is provided, is provided with a part of the flexible circuit board, and the part is provided with an electronic component. With this arrangement, no plate-shaped circuit board for mounting the electronic component is required, thereby reducing the manufacturing cost. Moreover, since the electronic component is provided on the lateral surfaces of the base, the base and the electronic component are horizontally arranged.
    Type: Grant
    Filed: February 16, 2010
    Date of Patent: October 16, 2012
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Haruhiko Sekiya, Shuji Tohyama, Hironori Kobayashi, Nobuhiko Akimoto
  • Publication number: 20100206085
    Abstract: In a sensor, a joint is provided with a sensor module, and the sensor module is accommodated in a housing. The housing is provided with a terminal, and a flexible circuit board electrically connects a diaphragm of the sensor module with the terminal. The joint is also provided with a cap-shaped base, and the top of the base is provided with an opening through which the diaphragm is exposed. A lateral surface of the base, which is crosswise with the top where the opening is provided, is provided with a part of the flexible circuit board, and the part is provided with an electronic component. With this arrangement, no plate-shaped circuit board for mounting the electronic component is required, thereby reducing the manufacturing cost. Moreover, since the electronic component is provided on the lateral surfaces of the base, the base and the electronic component are horizontally arranged.
    Type: Application
    Filed: February 16, 2010
    Publication date: August 19, 2010
    Applicant: NAGANO KEIKI CO., LTD.
    Inventors: Haruhiko Sekiya, Shuji Tohyama, Hironori Kobayashi, Nobuhiko Akimoto
  • Patent number: 7640812
    Abstract: A cap is provided on a diaphragm, and a first end of a flexible board is connected to the cap. A cover is attached to the cap. The cover directs a second end of the flexible board in a direction away from the diaphragm held by a joint so that the flexible board is supported while being curved. Since the flexible board is not locally bent at an acute angle, a crack is not generated on a copper pattern provided on the flexible board.
    Type: Grant
    Filed: March 18, 2008
    Date of Patent: January 5, 2010
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Yukinobu Iimori, Nobuaki Yamada, Shuji Tohyama, Takayuki Yokoyama
  • Patent number: 7627943
    Abstract: A method of manufacturing a pressure sensor is provided whereby the pressure sensor includes a joint, a diaphragm, and an adapter disposed between the joint and the diaphragm. The adapter includes an axis portion and a flange projecting in a radial direction from the axis portion. The axis portion is disposed such that one end does not interfere with the joint and the other end is welded to the diaphragm. The diaphragm is welded to the adapter and the welded portion the welded portion is positioned on an inner side of an end face of the joint. The joint is caulked to a peripheral edge of the flange of the adapter.
    Type: Grant
    Filed: December 4, 2006
    Date of Patent: December 8, 2009
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Shuji Tohyama, Takayuki Yokoyama, Ikuya Miyahara
  • Patent number: 7581448
    Abstract: A pressure sensor is provided with a cap on a measuring portion of a diaphragm to which a first end of a flexible board is connected while a second end of the flexible board is connected to a circuit board spaced apart from the diaphragm. The flexible board is provided with the first end, a belt portion that is bent at an angle of ninety degrees or more relative to the first end in a direction to be away from the circuit board and is curved along the outer circumference of the diaphragm, and the second end that is bent at an angle of ninety degrees or more relative to the belt portion to be connected to the circuit board.
    Type: Grant
    Filed: March 13, 2008
    Date of Patent: September 1, 2009
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Yukinobu Iimori, Nobuaki Yamada, Shuji Tohyama, Takayuki Yokoyama
  • Patent number: 7484417
    Abstract: A pressure sensor includes: a main body case including a housing (1) and a joint (2); an electronic circuit (3) housed inside the main body case to convert detected pressure into electrical signals to send out; a connecting metal piece (5), one end (51)of which abuts on an electrode (31) of the electronic circuit (3); a terminal (4), one end (41) of which is joined to the other end (52) of the connecting metal piece (5) and the other end (42) of which is disposed outside the main body case; and a cushion (7) biasing the one end (51) to the electrode (31). The one end (51) and the electrode (31) are electrically connected by biasing force of the cushion (7), which eliminates welding, enabling manufacturing at low cost.
    Type: Grant
    Filed: March 28, 2005
    Date of Patent: February 3, 2009
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Shuji Tohyama, Ikuya Miyahara, Hayato Kobayashi