Patents by Inventor Shun Huang

Shun Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11998584
    Abstract: The present invention relates to the conjugation of a tubulysin analog compound to a cell-binding molecule with branched/side-chain linkers for having better delivery of the conjugate compound and targeted treatment of abnormal cells. It also relates to a branched-linkage method of conjugation of a tubulysin analog molecule to a cell-binding ligand, as well as methods of using the conjugate in targeted treatment of cancer, infection and autoimmune disease.
    Type: Grant
    Filed: December 31, 2017
    Date of Patent: June 4, 2024
    Assignee: Hangzhou DAC Biotech Co., Ltd.
    Inventors: Robert Yongxin Zhao, Qingliang Yang, Yuanyuan Huang, Linyao Zhao, Shun Gai, Hangbo Ye, Jun Lei, Yifang Xu, Mingjun Cao, Huihui Guo, Junxiang Jia, Qianqian Tong, Wenjun Li, Xiaomai Zhou, Hongsheng Xie, Lu Bai, Xiang Cai, Xiaotao Zhuo, Xiuzheng Zhang, Jun Zheng
  • Patent number: 11995256
    Abstract: Provided are a display panel, a preparation method thereof, and a display device. The display panel includes a display substrate and a touch panel. The touch panel includes multiple touch electrodes. At least one of the touch electrodes includes multiple grid patterns enclosed by metal wires. At least one of the grid patterns includes a first edge, second edge, third edge and fourth edge that form a ring. The first edge and the third edge extend in a second direction. The second edge and the fourth edge extend in a first direction. A shape of the grid pattern includes a first curved ring, a second curved ring, a third curved ring, or a fourth curved ring. A first edge and third edge of the first curved ring are curves curved towards a direction opposite to the first direction.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: May 28, 2024
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Shun Zhang, Yi Zhang, Ping Wen, Peng Xu, Chang Luo, Linhong Han, Weiyun Huang, Youngyik Ko, Yuanqi Zhang, Cong Fan
  • Publication number: 20240170396
    Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.
    Type: Application
    Filed: January 30, 2024
    Publication date: May 23, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yung-Shun CHANG, Sheng-Wen YANG, Teck-Chong LEE, Yen-Liang HUANG
  • Publication number: 20240162425
    Abstract: A cathode material and a method for preparing the same, lithium ion battery provided. The cathode material includes secondary particle which includes a plurality of primary particles, where the primary particle includes an active material having a chemical formula LibNixCoyMzRwO2, where 0.95?b?1.10, 0.8?x<1, 0<y+z+w?0.2, x+y+z+w=1, 0.0001?w?0.003; M is selected from at least one of Mn and Al, R is a metal; Phosphate compound coating layer are uniformly distributed on the surface of the cathode material, including a first coating layer and a second coating layer, where the first coating layer forms on the surface of the primary particle, the second coating layer forms on the surface of the secondary particle. The cathode material of this application can effectively improve the rate performance, thermal and cycling stability of lithium battery, and has the characteristics of low cost and easy large-scale production.
    Type: Application
    Filed: February 22, 2022
    Publication date: May 16, 2024
    Inventors: Youyuan HUANG, Shunyi YANG, Xiong SONG, Hongxu ZHANG, Wuwei YAN, Liang LUO, Shun NOMURA, Koki MORITA, Takuya SHINOMIYA
  • Publication number: 20240157665
    Abstract: An apparatus and method for expanding a box blank into a box, the apparatus comprising an arm assembly, a controller, a camera and a box blank conveyor. The arm assembly includes a folding arm having a position in a first direction and a rotational angle controlled by the controller based on a position of a feature of the box blank in the field of view of the camera. The camera captures images of the box blank which are used to position the arm assembly and to evaluate the need to reject a box blank.
    Type: Application
    Filed: January 17, 2024
    Publication date: May 16, 2024
    Inventors: Szu-Chen HUANG, Po-Hsien CHIU, Mao-Jung CHIU, Mao-Shun LIEN, Fu-Hsien LI
  • Publication number: 20240128666
    Abstract: A motherboard includes a circuit board and a connector mounted on the circuit board. The connector comprises a socket and a latch pivotally mounted on one end of the socket. The latch comprises a body, a pressing member connected to one side of the body and extending outward from one side of the body to the outside of the socket, exposing an area from a side of the interface card for finger pressing. The supporting member is connected to another side of the body, and when the pressing member is pressed, it drives the body to pivot and causes the pushing portion to lift the interface card, and the supporting member stop the body from pivoting by resting against the circuit board.
    Type: Application
    Filed: September 22, 2023
    Publication date: April 18, 2024
    Inventors: CHIH-MING LAI, YUNG-SHUN KAO, TZU-HSIANG HUANG
  • Publication number: 20240128283
    Abstract: A detection substrate including a substrate and a plurality of detection units disposed on a side of the substrate, each detection unit including at least an inorganic transistor, an organic transistor, and a photoelectric sensor element, the organic transistor including an organic semiconductor part, in a direction perpendicular to a plane of the substrate, a film layer where the organic semiconductor part is located being located on the side of the film layer where the inorganic transistor is located away from the substrate, the film layer where the organic semiconductor part is located being located on the side of a film layer where the photoelectric sensor element is located away from the substrate, the organic transistor of the detection unit being connected to a sensing electrode, the sensing electrode being located on the side of the film layer where the inorganic transistor is located away from the substrate.
    Type: Application
    Filed: December 28, 2022
    Publication date: April 18, 2024
    Inventors: Haotian LU, Linzhi WANG, Baiquan LIN, Kerui XI, Shun GONG, Yukun HUANG, Fan XU, Kaidi ZHANG
  • Patent number: 11961919
    Abstract: A method of forming a semiconductor device includes: forming a fin protruding above a substrate, where a top portion of the fin comprises a layer stack that includes alternating layers of a first semiconductor material and a second semiconductor material; forming a dummy gate structure over the fin; forming openings in the fin on opposing sides of the dummy gate structure; forming source/drain regions in the openings; removing the dummy gate structure to expose the first semiconductor material and the second semiconductor material under the dummy gate structure; performing a first etching process to selectively remove the exposed first semiconductor material, where after the first etching process, the exposed second semiconductor material form nanostructures, where each of the nanostructures has a first shape; and after the first etching process, performing a second etching process to reshape each of the nanostructures into a second shape different from the first shape.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Chung Chang, Hsiu-Hao Tsao, Ming-Jhe Sie, Shun-Hui Yang, Chen-Huang Huang, An Chyi Wei, Ryan Chia-Jen Chen
  • Publication number: 20240119895
    Abstract: Provided is a pixel circuit. The pixel circuit includes a semiconductor layer on a side of a base substrate, wherein the semiconductor layer is configured to form an active layer of each of various transistors in the pixel circuit; a first metal layer on the side of the base substrate, wherein the first metal layer is configured to form a gate electrode of the transistor and a first capacitive electrode of a storage capacitor in the pixel circuit; and a second metal layer on the side of the base substrate, wherein the second metal layer is configured to form a second capacitive electrode of the storage capacitor.
    Type: Application
    Filed: March 29, 2021
    Publication date: April 11, 2024
    Inventors: Linhong Han, Qiwei Wang, Shun Zhang, Benlian Wang, Weiyun Huang
  • Patent number: 11952526
    Abstract: The present invention relates to liquid-crystalline (LC) media and to LC displays (LCDs) containing these media, in particular to LCDs of the twisted nematic (TN) mode, preferably to displays of the LCOS (LC on silicon) mode.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: April 9, 2024
    Assignee: MERCK PATENT GMBH
    Inventors: Nicole (I-Yun) Huang, Eason (Chi-Shun) Huang, Ray (Kuang-Ting) Chou
  • Publication number: 20240096998
    Abstract: The present disclosure describes a method for forming metallization layers that include a ruthenium metal liner and a cobalt metal fill. The method includes depositing a first dielectric on a substrate having a gate structure and source/drain (S/D) structures, forming an opening in the first dielectric to expose the S/D structures, and depositing a ruthenium metal on bottom and sidewall surfaces of the opening. The method further includes depositing a cobalt metal on the ruthenium metal to fill the opening, reflowing the cobalt metal, and planarizing the cobalt and ruthenium metals to form S/D conductive structures with a top surface coplanar with a top surface of the first dielectric.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shuen-Shin LIANG, Chij-chien CHI, Yi-Ying LIU, Chia-Hung CHU, Hsu-Kai CHANG, Cheng-Wei CHANG, Chein-Shun LIAO, Keng-chu LIN, KAi-Ting HUANG
  • Patent number: 11935969
    Abstract: A photodetector includes a first semiconductor layer, an absorption structure, a second semiconductor layer, and a barrier structure. The absorption structure is located on the first semiconductor layer, and having a first conduction band, a first valence band, and a first band gap. The second semiconductor layer is located on the absorption structure, and having a second conduction band, a second valence band, and a second band gap. The barrier structure is located between the absorption structure and the second semiconductor layer, and having a third conduction band, a third valence band, and a third band gap. The third conduction band is greater than the second conduction band or the third valence band is less than the second valence band.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: March 19, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Shih-Chang Lee, Shiuan-Leh Lin, I-Hung Chen, Chu-Jih Su, Chao-Shun Huang
  • Patent number: 11935981
    Abstract: A photo-detecting device includes a first semiconductor layer with a first dopant, a light-absorbing layer, a second semiconductor layer, and a semiconductor contact layer. The second semiconductor layer is located on the first semiconductor layer and has a first region and a second region, the light absorbing layer is located between the first semiconductor layer and the second semiconductor layer and has a third region and a fourth region, the semiconductor contact layer contacts the first region. The first region includes a second dopant and a third dopant, the second region includes second dopant, and the third region includes third dopant. The semiconductor contact layer has a first thickness greater than 50 ? and smaller than 1000 ?.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: March 19, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Chu-Jih Su, Chia-Hsiang Chou, Wei-Chih Peng, Wen-Luh Liao, Chao-Shun Huang, Hsuan-Le Lin, Shih-Chang Lee, Mei Chun Liu, Chen Ou
  • Publication number: 20240084432
    Abstract: The disclosure provides a method for heat-treating a boron steel, which includes: carburizing a boron steel on a surface thereof to obtain a carburized boron steel; austenitizing the carburized boron steel at a temperature of 885-895° C. for 25-35 min, to obtain an austenitized boron steel; sequentially subjecting the austenitized boron steel to an oil quenching and a tempering, wherein the oil quenching is performed at a temperature of 55-65° C. for 29-31 min.
    Type: Application
    Filed: November 3, 2021
    Publication date: March 14, 2024
    Inventors: Yulin JU, Xiaonong CHENG, Zhizhong YUAN, Shun GUO, Rui LUO, Fuyang CAO, Hao HUANG
  • Publication number: 20240073660
    Abstract: A positioning system and a positioning method based on radio frequency identification techniques (RFID) are provided. The positioning system includes in-vehicle devices, RFID readers and a server. The in-vehicle devices each includes a positioning device, an image capturing device and an image recognition module. The positioning device obtains a positioning location. The image capturing device captures a driving image. The image recognition module identifies adjacent vehicles, adjacent license plate information, and road attributes, and calculates relative location information. Each of the RFID readers reads a vehicle tag of one of the vehicles passing by, so as to mark a reference vehicle and generate reference vehicle information. A positioning adjustment module of the server determines whether the target vehicle is a reference vehicle, has been the reference vehicle or is a non-reference vehicle, and adjusts the positioning location of the target vehicle in different ways, accordingly.
    Type: Application
    Filed: October 11, 2022
    Publication date: February 29, 2024
    Inventors: YAO-SHUN YANG, HUI-TZU HUANG, JIAN-YING CHEN, CHUAN-CHUAN WANG
  • Patent number: 11911991
    Abstract: An apparatus and method for expanding a box blank into a box, the apparatus comprising an arm assembly, a controller, a camera and a box blank conveyor. The arm assembly includes a folding arm having a position in a first direction and a rotational angle controlled by the controller based on a position of a feature of the box blank in the field of view of the camera. The camera captures images of the box blank which are used to position the arm assembly and to evaluate the need to reject a box blank.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Szu-Chen Huang, Fu-Hsien Li, Mao-Jung Chiu, Mao-Shun Lien, Po-Hsien Chiu
  • Publication number: 20240028565
    Abstract: An information sharing method, an apparatus, an electronic device, and a storage medium are provided. The method includes: determining, in response to a file sharing request initiated by a sharing party, a file-for-sharing corresponding to the file sharing request; determining a sharing strategy for the file-for-sharing, including determining the sharing strategy for the file-for-sharing based on attribute information of the file-for-sharing, where the attribute information comprises a storage address; and sharing, based on the sharing strategy, the file-for-sharing to preset clients participating in sharing. In the method, the sharing strategy for the file-for-sharing is based on based on the storage address of the file in response to the storage address being a cloud address.
    Type: Application
    Filed: October 2, 2023
    Publication date: January 25, 2024
    Inventors: Zhihui HA, Qianyi XU, Guanghan ZHANG, Jingyi ZHANG, Xiaotao NIE, Zhongyang GUO, Tao CHEN, Yutao WU, Qi ZHANG, Rundong LIU, Shun HUANG, Minming ZHOU, Gewei YANG, Jiaqi CHEN, Yin SHI, Bin ZHU, Shuhan LU
  • Publication number: 20240006252
    Abstract: A semiconductor testing structure is provided. The semiconductor testing structure includes a substrate, a first metal layer, a dielectric structure, and a second metal layer. The first metal layer is disposed on the substrate and includes a plurality of fingers extending along a first direction. The dielectric structure is disposed on the first metal layer. The second metal layer is disposed on the dielectric structure and electrically isolated from the first metal layer. The second metal layer extends along a second direction different from the first direction. The dielectric structure defines a sidewall extending between the first metal layer and the second metal layer.
    Type: Application
    Filed: June 30, 2022
    Publication date: January 4, 2024
    Inventor: CHUN-SHUN HUANG
  • Publication number: 20240006253
    Abstract: A method of manufacturing semiconductor testing structure is provided. The method includes: providing a substrate; forming a first metal layer on the substrate, wherein the first metal layer comprises a plurality of fingers extending along a first direction; forming a dielectric structure on the first metal layer; and forming a plurality of second metal layers on the dielectric structure, wherein the first metal layer comprises a plurality of fingers extending along a first direction.
    Type: Application
    Filed: June 30, 2022
    Publication date: January 4, 2024
    Inventor: CHUN-SHUN HUANG
  • Publication number: 20240002728
    Abstract: A liquid-crystal (LC) material having negative dielectric anisotropy and the use thereof for optical, electro-optical and electronic purposes, such as for example in LC displays, in particular energy saving displays based on the ECB, IPS or FFS effect, where the liquid crystal medium contains one or more compounds of formula I and one or more compounds compounds of formulae IIA, IIB, IIC and IID
    Type: Application
    Filed: June 22, 2023
    Publication date: January 4, 2024
    Applicant: Merck Patent GmbH
    Inventors: Chi-Shun HUANG, Sven Christian LAUT, Hee-Kyu LEE, Minghui YANG, Harald HIRSCHMANN, Kuang-Ting CHOU, Shih-Chieh HUNG, Alexander HAHN, Philipp WUCHER