Patents by Inventor Shun MIZUNO

Shun MIZUNO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240174905
    Abstract: A showcase includes a refrigerant circuit and a refrigerant enclosed in the refrigerant circuit. The refrigerant circuit includes a compressor (121), a radiator (122), an expansion valve (123), and an evaporator (124). The refrigerant is a low-GWP refrigerant.
    Type: Application
    Filed: February 2, 2024
    Publication date: May 30, 2024
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Shinichi FUJINAKA, Masaru TANAKA, Shun OHKUBO, Mitsushi ITANO, Yuuki YOTSUMOTO, Akihito MIZUNO, Tomoyuki GOTOU, Yasufu YAMADA, Hitomi KUROKI, Tatsumi TSUCHIYA, Kenji GOBOU, Daisuke KARUBE, Tatsuya TAKAKUWA
  • Patent number: 11920077
    Abstract: No studies have been made regarding what kinds of refrigerants should be used in a refrigeration cycle device for a vehicle. An air conditioner (1) for a vehicle includes a refrigerant circuit (10) and a refrigerant that is sealed in the refrigerant circuit (10). The refrigerant circuit (10) includes a compressor (80), a first heat exchanger (85), which serves as a heat dissipater in a dehumidifying heating mode, an outside-air heat exchanger (82), a cooling control valve (87), and a second heat exchanger (86), which serves as an evaporator in the dehumidifying heating mode. The refrigerant is a refrigerant having a low GWP.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: March 5, 2024
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Eiji Kumakura, Kazuhiro Furusho, Masaru Tanaka, Shun Ohkubo, Mitsushi Itano, Yuuki Yotsumoto, Akihito Mizuno, Tomoyuki Gotou, Yasufu Yamada, Tatsumi Tsuchiya, Kenji Gobou, Hitomi Kuroki, Daisuke Karube, Tatsuya Takakuwa, Tetsushi Tsuda
  • Patent number: 11912922
    Abstract: A showcase includes a refrigerant circuit and a refrigerant enclosed in the refrigerant circuit. The refrigerant circuit includes a compressor (121), a radiator (122), an expansion valve (123), and an evaporator (124). The refrigerant is a low-GWP refrigerant.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: February 27, 2024
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Shinichi Fujinaka, Masaru Tanaka, Shun Ohkubo, Mitsushi Itano, Yuuki Yotsumoto, Akihito Mizuno, Tomoyuki Gotou, Yasufu Yamada, Hitomi Kuroki, Tatsumi Tsuchiya, Kenji Gobou, Daisuke Karube, Tatsuya Takakuwa
  • Patent number: 10487773
    Abstract: This vehicle mechanical component includes a mechanical component body, a heat insulating layer formed on the mechanical component body, and a protective layer formed on the heat insulating layer and including an inorganic compound that includes an alkoxide and scale-like inorganic solid particles dispersed in the inorganic compound.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: November 26, 2019
    Assignees: AISIN SEIKI KABUSHIKI KAISHA, AKROS CO., LTD.
    Inventors: Yosuke Taguchi, Akikazu Matsumoto, Ichiro Hiratsuka, Masaki Kato, Daishi Kobayashi, Megumi Sugisawa, Takuya Niimi, Yusuke Ikai, Kazuki Saai, Shun Mizuno
  • Publication number: 20180094603
    Abstract: This vehicle mechanical component includes a mechanical component body, a heat insulating layer formed on the mechanical component body, and a protective layer formed on the heat insulating layer and including an inorganic compound that includes an alkoxide and scale-like inorganic solid particles dispersed in the inorganic compound.
    Type: Application
    Filed: March 24, 2016
    Publication date: April 5, 2018
    Applicants: AISIN SEIKI KABUSHIKI KAISHA, AKROS CO., LTD.
    Inventors: Yosuke TAGUCHI, Akikazu MATSUMOTO, Ichiro HIRATSUKA, Masaki KATO, Daishi KOBAYASHI, Megumi SUGISAWA, Takuya NIIMI, Yusuke IKAI, Kazuki SAAI, Shun MIZUNO