Patents by Inventor Shun-Tien Lin

Shun-Tien Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DDR electronic module assembly
    Patent number: 10306751
    Abstract: An electronic module assembly has a memory module that includes a memory module and an electronic module. The memory module includes a first board having a first board first surface disposed opposite a first board second surface. The electronic module is operatively connected to the memory module. The electronic module includes a mounting plate having a mounting plate first surface that is disposed opposite a mounting plate second surface that faces towards the first board first surface. The mounting plate has a first post and a second post spaced apart from the first post.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: May 28, 2019
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Jason C. Duffy, James A. Gosse, Shun-Tien Lin, Michael Maynard, An Nguyen
  • DDR ELECTRONIC MODULE ASSEMBLY
    Publication number: 20190124760
    Abstract: An electronic module assembly has a memory module that includes a memory module and an electronic module. The memory module includes a first board having a first board first surface disposed opposite a first board second surface. The electronic module is operatively connected to the memory module. The electronic module includes a mounting plate having a mounting plate first surface that is disposed opposite a mounting plate second surface that faces towards the first board first surface. The mounting plate has a first post and a second post spaced apart from the first post.
    Type: Application
    Filed: October 20, 2017
    Publication date: April 25, 2019
    Inventors: Jason C. Duffy, James A. Gosse, Shun-Tien Lin, Michael Maynard, An Nguyen
  • HEAT DISSIPATION
    Publication number: 20150098190
    Abstract: Embodiments are directed to an apparatus comprising a thermal block coupled to an electronic device, a thermal strap coupled to the thermal block, and retention hardware coupled to the thermal strap and configured to retain the thermal block within the thermal strap when the apparatus is exposed to at least one variable environmental condition.
    Type: Application
    Filed: June 7, 2013
    Publication date: April 9, 2015
    Inventors: Luke T. Orsini, Charles V. DeSantis, Shun-Tien Lin, Kerry R. Querns, Kenneth J. Trotman, David Perley